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Infineon Technologies BSP318SL6327HTSA1
- Part No.:
- BSP318SL6327HTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BSP318SL6327HTSA1.pdf
- Description:
- MOSFET N-CH 60V 2.6A SOT223-4
- Quantity:
- Payment:
- Shipping:
Inventory:3,348
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Product details
Overview
BSP318SL6327HTSA1 from Infineon Technologies is an N-channel enhancement-mode logic-level SIPMOS™ small-signal power MOSFET in PG-SOT223 package, rated for 60 V VDS, 2.6 A continuous drain current, and 0.09 Ω RDS(on) at VGS = 10 V. It features avalanche rating (60 mJ single-pulse), dv/dt ruggedness (6 kV/µs), and AEC-Q101 qualification-used in automotive body control modules for low-side load switching.
For engineers reviewing the BSP318SL6327HTSA1 datasheet, BSP318SL6327HTSA1 pinout, BSP318SL6327HTSA1 application, or BSP318SL6327HTSA1 equivalent, key selection criteria include logic-level gate drive compatibility (VGS(th) = 1.2–1.6 V), thermal resistance (RthJA = 70 K/W on 6 cm² copper), and integrated reverse diode performance (VSD = 0.95 V at 5.2 A).
Technical Context
This MOSFET operates in enhancement mode with a threshold voltage range of 1.2–1.6 V, enabling direct interface with 3.3 V and 5 V microcontrollers without level-shifting. Its 0.09 Ω RDS(on) at 10 V gate drive and 2.6 A ID supports efficient low-voltage DC load control in space-constrained PCB layouts.
The device integrates an avalanche-rated body diode with 2.6 A continuous forward current and 75 ns reverse recovery time (trr), supporting inductive load commutation in relay drivers and solenoid controls. Thermal design is enabled by SOT223's exposed drain pad (Pin 4) and specified RthJS = 17 K/W to soldering point.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - maximum blocking voltage for 12 V automotive systems with load-dump margin |
| RDS(on) @ VGS = 10 V | 0.09 Ω - enables ≤0.6 W conduction loss at 2.6 A, suitable for thermally limited SMT designs |
| ID (continuous) | 2.6 A - rated at TA = 25 °C with 6 cm² copper cooling area |
| EAS (single pulse) | 60 mJ - supports reliable energy absorption during inductive turn-off transients |
| dv/dt rating | 6 kV/µs - ensures immunity to fast voltage transients in noisy automotive environments |
| VGS(th) | 1.2–1.6 V - guarantees full enhancement with standard logic-level MCU outputs |
| Ciss | 380 pF - determines gate drive strength requirement for <25 ns switching transitions |
Pinout & Package
Package: PG-SOT223 (4-pin variant with exposed drain pad on Pin 4). Standard SMT footprint compatible with JEDEC MO-178AB, optimized for thermal dissipation via soldered drain pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Gate (G) | Control input; requires ≤20 V absolute max gate-source voltage |
| Pins 2 & 4 | Drain (D) | High-current output node; electrically connected to exposed copper pad for thermal conduction |
| Pin 3 | Source (S) | Power return path; referenced to system ground in low-side switch configuration |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at VGS ≥ 4.5 V, eliminating need for external gate drivers in 3.3/5 V MCU systems |
| Avalanche energy rating | 60 mJ single-pulse capability allows safe operation under unclamped inductive switching conditions |
| dv/dt ruggedness | 6 kV/µs rating prevents spurious turn-on during high-slew-rate transients common in automotive power nets |
| AEC-Q101 qualified | Validated for automotive applications per stress test requirements including temperature cycling and HBM ESD (Class 1b) |
Applications
| Automotive Body Control Module | Industrial PLC Output Stage |
|---|---|
Use Scenario: Switching 12 V incandescent lamps, fans, and solenoids in vehicle door modules and seat controls. IC Role / Device Role / Timing Role: Low-side power switch controlled by 3.3 V CAN/LIN microcontroller GPIO pins. Use Value: 0.09 Ω RDS(on) limits self-heating to <0.7 W at 2.6 A, enabling compact 4-layer PCB layout without heatsinks. | Use Scenario: Driving 24 V DC solenoid valves and indicator LEDs in factory automation I/O modules. IC Role / Device Role / Timing Role: Solid-state replacement for electromechanical relays in DIN-rail mounted controllers. Use Value: 60 mJ avalanche rating eliminates need for external snubbers when switching inductive loads up to 100 mH. |
| LED Lighting Driver | DC Motor Speed Control |
Use Scenario: PWM dimming of high-brightness LED strings in commercial signage and interior lighting. IC Role / Device Role / Timing Role: High-frequency (≤25 kHz) low-side switch synchronized with MCU PWM output. Use Value: 380 pF Ciss and 25 ns typical rise/fall times support clean 20 kHz switching with minimal gate drive power. | Use Scenario: Controlling brushed DC motors in portable tools and HVAC actuators. IC Role / Device Role / Timing Role: Half-bridge low-side switch in H-bridge configurations with external high-side driver. Use Value: Integrated body diode with 75 ns trr and 0.95 V VSD enables efficient freewheeling during PWM off-time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3025LSD-13 | RDS(on) = 0.025 Ω @ 10 V, but 30 V VDS rating - lower conduction loss but insufficient for 60 V automotive transients | Best suited for 5–12 V consumer electronics, not 12 V automotive with load dump | Select only if system VDS stress remains ≤30 V and thermal budget allows smaller die size |
| IPB031N06L3G | TO-263 package, 3.1 mΩ RDS(on), 60 V rating - higher current (120 A) and superior thermal performance, but larger footprint | Targeted at high-power motor drives requiring >10 A, not space-constrained SOT223 applications | Choose when board area permits TO-263 and peak current exceeds 5 A |
Compared with DMN3025LSD-13 and IPB031N06L3G, BSP318SL6327HTSA1 uniquely balances 60 V robustness, logic-level drive, SOT223 form factor, and AEC-Q101 compliance-making it optimal for cost-sensitive, space-limited automotive low-side switches where 2–3 A continuous current suffices.
Availability
BSP318SL6327HTSA1 is available at Aetrix Electronics and suitable for automotive body electronics, industrial I/O modules, LED lighting drivers, and DC motor control circuits requiring stable component supply across production lifecycles.
Supply support for BSP318SL6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949.
This device belongs to Infineon's SIPMOS™ small-signal MOSFET product line, engineered for high-reliability, logic-compatible switching in automotive and industrial applications where ruggedness, thermal efficiency, and AEC-Q101 compliance are mandatory.
FAQ
Is BSP318SL6327HTSA1 suitable for 24 V industrial systems?
Yes. With 60 V VDS rating and 6 kV/µs dv/dt immunity, it safely handles 24 V nominal systems including transient overvoltages up to 48 V. Its RthJA = 70 K/W on 6 cm² copper ensures thermal stability at 2.6 A continuous current in ambient temperatures up to 85 °C.
What is the maximum gate resistor value for reliable 20 kHz PWM switching?
Based on 380 pF Ciss and 14 nC total gate charge, a 16 Ω gate resistor (per datasheet test condition) achieves ~25 ns rise/fall times. For 20 kHz PWM, values ≤22 Ω maintain acceptable switching losses (<5% duty-cycle penalty) while ensuring noise immunity and gate driver safety.
Does the integrated body diode support continuous reverse conduction?
Yes. The device specifies 2.6 A continuous inverse diode current (IS) at TA = 25 °C and 10.4 A pulsed (ISM). Forward voltage is 0.95 V at 5.2 A, confirming suitability for freewheeling paths in H-bridge and buck converter topologies.
How does AEC-Q101 qualification impact reliability in non-automotive use?
AEC-Q101 validation subjects the device to accelerated stress tests-including temperature cycling, HTGB, and HBM ESD-resulting in demonstrated field failure rates <10 FIT. This translates to extended MTBF in industrial and medical applications where long-term operational stability is critical.
BSP318SL6327HTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SIPMOS®
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 2.6A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 90mOhm @ 2.6A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 20µA
- Gate Charge (Qg) (Max) @ Vgs:
- 20 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 380 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.8W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT223-4-21
BSP318SL6327HTSA1 FAQ
1.How can I place an order for BSP318SL6327HTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSP318SL6327HTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSP318SL6327HTSA1 reliable?
The price and inventory of BSP318SL6327HTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP318SL6327HTSA1 is usually 5 days.
3.What payment methods are accepted for BSP318SL6327HTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP318SL6327HTSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSP318SL6327HTSA1?
BSP318SL6327HTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSP318SL6327HTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSP318SL6327HTSA1?
For technical support, including BSP318SL6327HTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP318SL6327HTSA1 requirements.
6.How does Aetrix verify that BSP318SL6327HTSA1 is sourced from the original manufacturer or authorized distributors?
All BSP318SL6327HTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP318SL6327HTSA1 meets industry standards.
7.What is the process for return or replacement of BSP318SL6327HTSA1?
All BSP318SL6327HTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSP318SL6327HTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSP318SL6327HTSA1 part is unused and in its original packaging.
Return procedure for BSP318SL6327HTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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