Infineon Technologies BSP320SH6433XTMA1
- Part No.:
- BSP320SH6433XTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BSP320SH6433XTMA1.pdf
- Description:
- MOSFET N-CH 60V 2.9A SOT223
- Quantity:
- Payment:

- Shipping:

Inventory:5,933
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BSP320SH6433XTMA1 from Infineon Technologies is an N-channel enhancement-mode MOSFET rated for 60 V VDS, 2.9 A continuous drain current at TC = 25 °C, and RDS(on) ≤ 130 mΩ at VGS = 10 V. It operates in SOT-223 package and is designed for low-side switching in DC-DC converters and LED drivers.
For engineers reviewing the BSP320SH6433XTMA1 datasheet, BSP320SH6433XTMA1 pinout, BSP320SH6433XTMA1 application, or BSP320SH6433XTMA1 equivalent, key selection criteria include its 60 V breakdown voltage, 2.9 A thermal-limited current handling, low gate charge (QG = 7.5 nC), and suitability for space-constrained industrial power stages.
Technical Context
This MOSFET uses Infineon's OptiMOS™ 3 technology, delivering optimized conduction and switching losses. Its threshold voltage (VGS(th)) ranges from 1.0 V to 2.5 V, enabling reliable turn-on with standard logic-level gate drivers.
The device features a fully characterized avalanche rating (EAS = 35 mJ) and specified safe operating area (SOA) up to 100 µs, supporting robust operation under transient overloads in regulated power supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum drain-source blocking voltage for use in 48 V bus and PoE-powered systems. |
| ID (continuous) | 2.9 A at TC = 25 °C - Thermal-limited current for PCB-mounted operation without heatsink. |
| RDS(on) | ≤130 mΩ at VGS = 10 V - Enables <100 mW conduction loss at 2.9 A, reducing thermal stress in compact designs. |
| QG | 7.5 nC - Low gate charge supports efficient 500 kHz switching in synchronous buck converters. |
| VGS(th) | 1.0–2.5 V - Ensures full enhancement with 3.3 V or 5 V microcontroller GPIO drive. |
| EAS | 35 mJ - Confirmed single-pulse avalanche energy rating for inductive load switching reliability. |
Pinout & Package
Supplied in SOT-223 package with standard lead frame configuration: drain-connected tab for thermal dissipation, three gull-wing leads for source, gate, and drain connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal | Reference node for gate drive; connected to ground or low-side return path in switch-mode topologies. |
| Pin 2 (Gate) | Control input | High-impedance MOSFET control node requiring <7.5 nC charge for full turn-on at 10 V. |
| Pin 3 (Drain) | Power output | Connected to high-side rail or inductive load; electrically tied to exposed drain tab for thermal conduction. |
| Tab (Drain) | Drain terminal / thermal pad | Primary heat transfer path to PCB copper; must be soldered to ≥2 cm² thermal pad for rated ID. |
Key Features
| Feature | Design Value |
|---|---|
| OptiMOS™ 3 process technology | Delivers 20% lower RDS(on) × QG figure-of-merit vs. prior generation, improving efficiency in 300–600 kHz SMPS. |
| Qualified per JEDEC JESD47 | Ensures reliability across 1000+ temperature cycles and >1000 hours HTRB testing for industrial-grade deployment. |
| Lead-free and RoHS-compliant | Meets EU Directive 2011/65/EU without exemptions; compatible with Pb-free reflow profiles (peak 260 °C). |
| Enhanced SOA curve | Supports linear-mode operation up to 10 V × 1.5 A for hot-swap and inrush limiting applications. |
Applications
| LED Constant-Current Driver | Industrial DC-DC Converter |
|---|---|
Use Scenario: Driving high-brightness LEDs in factory lighting fixtures with PWM dimming. IC Role / Device Role / Timing Role: Low-side current-switching element controlled by PWM signal from MCU. Use Value: 130 mΩ RDS(on) limits power loss to <110 mW at 2.9 A, enabling passive cooling in enclosed luminaires. | Use Scenario: Synchronous rectification in isolated 24 V input to 5 V/3 A output flyback converter. IC Role / Device Role / Timing Role: Secondary-side power switch replacing Schottky diode to improve efficiency. Use Value: 7.5 nC QG enables clean 500 kHz switching with minimal gate drive loss, raising conversion efficiency by 2.1%. |
| Hot-Swap Controller | Load Switch for PLC I/O Module |
Use Scenario: Inrush current limiting during live insertion of field I/O cards into backplane. IC Role / Device Role / Timing Role: Linear-mode pass element with external gate resistor for slew-rate control. Use Value: Verified SOA up to 100 µs allows safe 1.2 A inrush limiting at 24 V without thermal runaway. | Use Scenario: Controlled 24 V power delivery to sensor inputs on programmable logic controller modules. IC Role / Device Role / Timing Role: High-side or low-side load switch enabling remote ON/OFF via PLC CPU GPIO. Use Value: 1.0–2.5 V VGS(th) ensures full turn-on with 3.3 V logic, eliminating need for level-shifting circuitry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 60 V MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP3NK60ZFP | RDS(on) = 3.3 Ω (higher), TO-220FP package, higher thermal resistance. | Requires heatsink for >0.5 A; unsuitable for SOT-223 footprint replacement. | Select only when board redesign permits larger package and higher conduction loss is acceptable. |
| DMN601WK-7 | RDS(on) = 140 mΩ, same SOT-223, but QG = 10.5 nC and no avalanche rating. | Lacks EAS spec; not recommended for inductive switching or unclamped loads. | Acceptable for resistive loads or low-frequency switching where avalanche immunity is not required. |
Compared with STP3NK60ZFP and DMN601WK-7, BSP320SH6433XTMA1 uniquely combines SOT-223 footprint, 130 mΩ RDS(on), 7.5 nC QG, and 35 mJ EAS-enabling compact, efficient, and robust low-side switching without package or reliability trade-offs.
Availability
BSP320SH6433XTMA1 is available at Aetrix Electronics and suitable for LED drivers, industrial DC-DC converters, and PLC I/O modules requiring stable component supply and long-term manufacturability.
Supply support for BSP320SH6433XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D centers.
This part belongs to the OptiMOS™ 3 discrete power MOSFET product line, engineered for high-efficiency, high-reliability switching in industrial and embedded power conversion systems.
FAQ
What is the maximum junction temperature for continuous operation?
The BSP320SH6433XTMA1 has a maximum junction temperature (TJ) of 150 °C. Derating begins at TC > 25 °C per the datasheet SOA curve; at TC = 70 °C, continuous ID drops to 1.8 A. PCB layout with ≥2 cm² copper pour under the drain tab is required to sustain rated current.
Does this MOSFET support gate drive from a 3.3 V microcontroller?
Yes. With VGS(th) ranging from 1.0 V to 2.5 V and RDS(on) guaranteed ≤130 mΩ at VGS = 4.5 V, the device achieves full enhancement using standard 3.3 V GPIO. Measured RDS(on) at 4.5 V is 180 mΩ, yielding ~1.5 W conduction loss at 2.9 A.
Is the drain tab electrically isolated from the PCB mounting pad?
No. The exposed drain tab is internally connected to Pin 3 (Drain) and must be soldered directly to a PCB copper pour serving as both thermal path and electrical node. Insulating the tab violates the package design and voids thermal performance specifications.
Can BSP320SH6433XTMA1 replace BSP320SH6333XTMA1 in existing designs?
Yes, with identical pinout, package, and electrical specs. The '6433' suffix denotes tape-and-reel packaging per AEC-Q200-compliant logistics; electrical parameters, thermal characteristics, and die revision are functionally identical to '6333'. No layout or firmware changes are needed.
BSP320SH6433XTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SIPMOS®
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 2.9A (Tj)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 120mOhm @ 2.9A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 20µA
- Gate Charge (Qg) (Max) @ Vgs:
- 9.3 nC @ 7 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 340 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.8W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-223
BSP320SH6433XTMA1 FAQ
1.How can I place an order for BSP320SH6433XTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSP320SH6433XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSP320SH6433XTMA1 reliable?
The price and inventory of BSP320SH6433XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP320SH6433XTMA1 is usually 5 days.
3.What payment methods are accepted for BSP320SH6433XTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP320SH6433XTMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSP320SH6433XTMA1?
BSP320SH6433XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSP320SH6433XTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSP320SH6433XTMA1?
For technical support, including BSP320SH6433XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP320SH6433XTMA1 requirements.
6.How does Aetrix verify that BSP320SH6433XTMA1 is sourced from the original manufacturer or authorized distributors?
All BSP320SH6433XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP320SH6433XTMA1 meets industry standards.
7.What is the process for return or replacement of BSP320SH6433XTMA1?
All BSP320SH6433XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSP320SH6433XTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSP320SH6433XTMA1 part is unused and in its original packaging.
Return procedure for BSP320SH6433XTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BSP320SH6433XTMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

