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Infineon Technologies BSP324 E6327
- Part No.:
- BSP324 E6327
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BSP324 E6327.pdf
- Description:
- MOSFET N-CH 400V 170MA SOT223-4
- Quantity:
- Payment:
- Shipping:
Inventory:4,165
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Product details
Overview
BSP324 E6327 from Infineon Technologies is an N-channel enhancement-mode logic-level SIPMOS power transistor in SOT-223 package, rated for 400 V VDS, 25 Ω RDS(on) at 10 V VGS, and 0.17 A continuous drain current; used in low-power AC/DC auxiliary supplies and LED driver high-side switches.
For engineers reviewing the BSP324 E6327 datasheet, BSP324 E6327 pinout, BSP324 E6327 application, or BSP324 E6327 equivalent, key selection criteria include its dv/dt rating (6 kV/µs), gate threshold voltage range (1.3–2.3 V), integrated body diode performance (VSD = 0.8–1.2 V), and thermal resistance (RthJA = 45–115 K/W depending on PCB layout).
Technical Context
This device operates as a single N-channel MOSFET with logic-level gate drive compatibility (VGS(th) ≤ 2.3 V), enabling direct interface with 3.3 V or 5 V microcontrollers without level-shifting. Its dv/dt immunity (6 kV/µs) supports reliable operation in inductive switching environments such as relay drivers and solenoid controls.
The integrated body diode exhibits reverse recovery time (trr) of 85–127 ns and Qrr of 104–156 nC, indicating suitability for non-synchronous flyback and buck-derived topologies where controlled commutation is required but synchronous rectification is not implemented.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 400 V - supports input voltages up to 280 VAC RMS in auxiliary power supplies |
| RDS(on) | 25 Ω max at VGS = 10 V - limits conduction loss to ≤ 0.72 W at 0.17 A DC |
| ID | 0.17 A continuous - suitable for <1 W load switching in standby or control rails |
| VGS(th) | 1.3–2.3 V - ensures turn-on with standard logic outputs (e.g., STM32 GPIO, PIC I/O) |
| dv/dt rating | 6 kV/µs - prevents false triggering during fast voltage transients in industrial sensors |
| trr | 85–127 ns - enables operation in 100 kHz-class flyback snubberless designs |
| Ptot | 1.8 W at TA = 25 °C - requires ≥6 cm² copper pour for thermal compliance in sealed enclosures |
Pinout & Package
SOT-223 package with 4 terminals: pins 1–3 are Drain (internally connected), pin 4 is Source, and pin 2 is Gate. The large tab (Drain) serves as primary heat path to PCB copper.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Drain) | Main current-carrying terminal | Internally tied to metal tab; must be soldered to ≥6 cm² copper area for thermal management |
| Pin 2 (Gate) | Control electrode | Logic-level compatible; requires <0.45 nC total gate charge for full turn-on |
| Pin 3 (Drain) | Redundant drain connection | Electrically identical to Pin 1; improves current sharing and mechanical stability |
| Pin 4 (Source) | Reference node for gate drive | Common return path for load current and gate loop; critical for noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| N-channel enhancement mode | Zero conduction when VGS = 0 V - enables fail-safe off-state in power-loss scenarios |
| Logic-level gate drive | VGS(th) ≤ 2.3 V - eliminates need for gate driver ICs in microcontroller-based control |
| dv/dt rated | 6 kV/µs immunity - suppresses parasitic turn-on in high-noise motor control or relay interfaces |
| Integrated body diode | VSD = 0.8–1.2 V at 0.17 A - provides freewheeling path without external diode in low-current inductive loads |
| AEC-Q101 qualified | Validated for automotive temperature and reliability stress - supports under-hood sensor power stages |
Applications
| AC/DC Auxiliary Supply | LED Driver High-Side Switch |
|---|---|
Use Scenario: Provides isolated 5 V/12 V bias supply for SMPS controllers in offline converters. IC Role / Device Role / Timing Role: High-side switch in non-isolated buck or flyback auxiliary winding rectifier stage. Use Value: Low RDS(on) and logic-level drive reduce component count versus discrete driver + MOSFET solutions. | Use Scenario: Controls current to indicator LEDs in automotive instrument clusters and HVAC panels. IC Role / Device Role / Timing Role: Constant-current source switch with PWM dimming capability. Use Value: Integrated body diode handles reverse EMF during PWM off-time; dv/dt rating prevents misfiring near ignition systems. |
| Relay/Solenoid Driver | Industrial Sensor Power Switch |
Use Scenario: Drives 12 V/24 V electromagnetic relays and latching solenoids in PLC I/O modules. IC Role / Device Role / Timing Role: Low-duty-cycle load switch with inductive energy clamping via body diode. Use Value: 6 kV/µs dv/dt rating ensures stable operation despite fast coil de-energization transients. | Use Scenario: Powers analog sensor front-ends (e.g., pressure, temperature) in factory automation nodes. IC Role / Device Role / Timing Role: Controlled enable switch for precision analog subsystems requiring clean power sequencing. Use Value: AEC-Q101 qualification and -55 °C to +150 °C operating range support harsh industrial ambient conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP3NK60ZFP | 600 V VDS, 4.2 Ω RDS(on), TO-220FP package, higher current (3 A) | Requires heatsink and gate driver for same logic-level compatibility | Preferred for >0.5 A loads where board space allows TO-220 footprint |
| DMN2004LK-7 | 20 V VDS, 0.12 Ω RDS(on), SOT-23 package, lower voltage rating | Not suitable for 400 V line-referenced circuits; limited to low-voltage DC-DC | Select only for sub-24 V systems needing ultra-low RDS(on) in minimal footprint |
Compared with STP3NK60ZFP and DMN2004LK-7, the BSP324 E6327 uniquely balances 400 V capability, logic-level drive, SOT-223 thermal performance, and AEC-Q101 qualification-making it optimal for compact, high-reliability auxiliary power and automotive sensor switching where voltage, size, and robustness intersect.
Availability
BSP324 E6327 is available at Aetrix Electronics and suitable for AC/DC auxiliary supplies, LED driver high-side switches, and relay/solenoid drivers requiring stable component supply across automotive and industrial production cycles.
Supply support for BSP324 E6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.
The BSP324 belongs to Infineon's SIPMOS family of logic-level power MOSFETs, designed specifically for low-power, high-reliability switching in space-constrained auxiliary power and automotive body electronics.
FAQ
What is the maximum safe operating voltage for BSP324 E6327 in continuous DC operation?
The absolute maximum drain-source voltage is 400 V, verified per datasheet Section 1 (Maximum Ratings). Operation above 320 V requires derating based on temperature and dv/dt stress; design margin should maintain VDS ≤ 320 V for 150 °C junction temperature and repetitive switching.
Can BSP324 E6327 be driven directly by a 3.3 V microcontroller GPIO?
Yes - its gate threshold voltage range (1.3–2.3 V) and low total gate charge (≤5.9 nC) allow full enhancement with 3.3 V logic. However, rise/fall times increase at 3.3 V; for <100 ns switching, a 5 V gate drive is recommended per dynamic characteristics data on Page 3.
Does BSP324 E6327 include a built-in ESD protection diode?
No - it carries JESD22-A114-HBM Class 1A ESD rating (>250 V, <500 V), meaning it has basic process-level ESD tolerance but no dedicated on-chip protection diodes. External TVS or RC filtering is advised in high-static environments per Infineon Application Note AN2015-05.
How does the SOT-223 package affect thermal performance in confined PCB layouts?
With minimum footprint, RthJA is 115 K/W; with 6 cm² copper area, it improves to 45 K/W. The metal tab (Drain) must be soldered to inner-layer copper planes using thermal vias - insufficient copper results in Tj exceeding 150 °C even at 0.1 A continuous current, per Figure 1 on Page 4.
BSP324 E6327 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SIPMOS®
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 400 V
- Current - Continuous Drain (Id) @ 25°C:
- 170mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 25Ohm @ 170mA, 10V
- Vgs(th) (Max) @ Id:
- 2.3V @ 94µA
- Gate Charge (Qg) (Max) @ Vgs:
- 5.9 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 154 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.8W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT223-4
BSP324 E6327 FAQ
1.How can I place an order for BSP324 E6327 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSP324 E6327 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSP324 E6327 reliable?
The price and inventory of BSP324 E6327 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP324 E6327 is usually 5 days.
3.What payment methods are accepted for BSP324 E6327?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP324 E6327 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSP324 E6327?
BSP324 E6327 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSP324 E6327 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSP324 E6327?
For technical support, including BSP324 E6327 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP324 E6327 requirements.
6.How does Aetrix verify that BSP324 E6327 is sourced from the original manufacturer or authorized distributors?
All BSP324 E6327 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP324 E6327 meets industry standards.
7.What is the process for return or replacement of BSP324 E6327?
All BSP324 E6327 units undergo pre-shipment inspection (PSI). If there is an issue with BSP324 E6327, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSP324 E6327 part is unused and in its original packaging.
Return procedure for BSP324 E6327:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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