Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies BSP615S2L

Name: BSP615S2L
Brand: Infineon Technologies
SKU: BSP615S2L
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BSP615S2L

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: TO-261-4, TO-261AA

Datasheet:: BSP615S2L.pdf

Description:: MOSFET N-CH 55V 2.8A SOT223-4

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:9,332

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BSP615S2L from Infineon Technologies is an N-channel enhancement-mode logic-level power MOSFET in SOT-223 package, rated for 55 V V_DS, 90 mΩ R_DS(on) at V_GS = 10 V and I_D = 1.4 A, with 2.8 A continuous drain current at T_A = 25 °C. It integrates a fast-recovery body diode (t_rr = 30–38 ns) and supports gate drive down to 4.5 V, enabling direct interface with microcontroller GPIOs in low-voltage DC-DC and load-switching applications.

For engineers reviewing the BSP615S2L datasheet, BSP615S2L pinout, BSP615S2L application, or BSP615S2L equivalent, key selection criteria include its logic-level gate threshold (V_GS(th) = 1.2–2.0 V), low thermal resistance (R_thJS = 19–23 K/W), integrated body diode performance, and SOA compliance up to 120 µs pulse width at 5 V V_DS.

Technical Context

This MOSFET employs trench-based OptiMOS™ technology optimized for low conduction loss and fast switching in high-efficiency, space-constrained power stages. Its gate charge profile (Q_g = 7.5–10 nC, Q_gd = 2.5–3.8 nC) enables efficient 100 kHz–1 MHz operation with minimal driver loss.

The device features a thermally enhanced SOT-223 package with Pin 4 as the drain-connected soldering point, delivering R_thJA = 70 K/W on 6 cm² copper area. Its body diode exhibits V_SD = 0.8–1.1 V at I_F = 2.8 A and t_rr = 30–38 ns under dI/dt = 100 A/µs - critical for synchronous rectification and flyback snubberless designs.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	55 V - maximum blocking voltage compatible with 48 V nominal bus systems and automotive 36 V transients
R_DS(on) @ V_GS = 10 V	67–90 mΩ - defines conduction loss of ≤250 mW at 2.8 A DC, enabling compact thermal design
I_D (continuous)	2.8 A @ T_A = 25 °C - usable in PCB-mounted load switches without forced air or heatsink
V_GS(th)	1.2–2.0 V - ensures reliable turn-on with 3.3 V logic, eliminating need for gate boosters
t_rr / Q_rr	30–38 ns / 30–38 nC - minimizes reverse recovery loss in discontinuous conduction mode converters
R_thJS	19–23 K/W - enables junction-to-solder-point thermal modeling for accurate PCB copper area sizing

Pinout & Package

SOT-223 package with exposed drain pad (Pin 4) for thermal and electrical connection; standard 4-pin configuration with source shorted to Pin 2 and Pin 3.

Pin/Terminal	Circuit Role	Design Meaning
Pin 1 (Gate)	Control input	Accepts logic-level signals (≥4.5 V) to fully enhance channel; requires <10 nC total gate charge
Pin 2 (Source)	Reference node	Common return path for gate drive and load current; tied internally to Pin 3
Pin 3 (Source)	Reference node	Redundant source terminal for improved current sharing and thermal spreading on PCB
Pin 4 (Drain)	Power output	Exposed copper pad - must be soldered to ≥6 cm² copper pour for rated P_tot = 1.8 W

Key Features

Feature	Design Value
Logic-level gate drive compatibility	Turns on fully at V_GS = 4.5 V, supporting direct MCU/GPIO control without level-shifting
Low R_DS(on) × Q_g figure-of-merit	~670 mΩ·nC - balances conduction and switching losses for high-frequency DC-DC stages
Fast body diode with soft recovery	t_rr = 30–38 ns and Q_rr = 30–38 nC enable low-noise operation in buck/flyback freewheel paths
Thermally optimized SOT-223	R_thJS = 19–23 K/W allows >1.5 W dissipation with minimal copper area, reducing board cost

Applications

Motor Control

DC-DC Converter

Use Scenario: Driving small brushed DC motors (e.g., fans, pumps) in industrial sensors and HVAC actuators.

IC Role / Device Role / Timing Role: Low-side switch controlling motor current path with PWM duty cycle modulation.

Use Value: Logic-level gate enables direct STM32 GPIO drive; low R_DS(on) limits I²R heating during 100% duty cycle stall conditions.

Use Scenario: Synchronous rectifier in 12 V → 5 V/3.3 V buck converter for embedded controllers.

IC Role / Device Role / Timing Role: Secondary-side power switch replacing Schottky diode to reduce conduction loss.

Use Value: Body diode t_rr < 40 ns prevents shoot-through during dead-time; V_SD < 1.1 V cuts forward drop by 40% vs. 0.5 V Schottky at 2 A.

Load Switch

Automotive Subsystem

Use Scenario: Hot-swap power management for USB peripherals and display backlights in portable equipment.

IC Role / Device Role / Timing Role: High-side or low-side controlled power rail switch with inrush current limiting.

Use Value: 2.8 A rating supports 10 W loads; SOA curve validated for 120 µs pulses at 5 V, enabling robust fault handling.

Use Scenario: Power distribution for infotainment USB ports and LED lighting modules in 12 V vehicle networks.

IC Role / Device Role / Timing Role: Protected load switch interfacing with CAN/LIN-controlled power management ICs.

Use Value: 55 V V_DS withstands load-dump transients up to ISO 7637-2 Pulse 5a; -55 °C to +150 °C rating meets AEC-Q101 ambient requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMN3026LSD-13	R_DS(on) = 30 mΩ @ 4.5 V (lower), but V_DS = 30 V (reduced voltage margin)	Not suitable for 48 V systems or automotive load dump; preferred in 5–12 V portable battery apps	Select when lower on-resistance is prioritized over voltage headroom and thermal robustness
IRLML6344TRPBF	R_DS(on) = 42 mΩ @ 4.5 V, SOT-23 package (smaller footprint, higher R_thJA)	Limited to ≤1.2 A continuous due to thermal constraints; unsuitable for >1 W sustained dissipation	Choose only for ultra-compact, low-current (<1 A) switching where PCB area is critical

Compared with DMN3026LSD-13 and IRLML6344TRPBF, BSP615S2L uniquely balances 55 V rating, 2.8 A capability, and SOT-223 thermal performance - making it optimal for mid-power industrial and automotive subsystems requiring both voltage margin and board-level reliability.

Availability

BSP615S2L is available at Aetrix Electronics and suitable for motor control, DC-DC conversion, load switching, and automotive subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for BSP615S2L includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200 standards.

The OptiMOS™ power transistor product line targets high-efficiency, high-density power conversion and intelligent load switching - designed specifically for industrial automation, automotive electrification, and energy-efficient consumer power supplies.

FAQ

Is BSP615S2L suitable for high-frequency PWM motor control?

Yes - with gate charge Q_g = 7.5–10 nC and rise/fall times of 24–36 ns / 23–34 ns, it supports clean switching up to 500 kHz in brushed DC motor H-bridge half-bridges. Its low Q_gd/Q_g ratio (≈35%) reduces Miller-induced oscillation risk during hard commutation.

What is the maximum safe operating area (SOA) for single-pulse conditions?

The SOA curve on Page 4 confirms safe operation up to 5 V V_DS at 2.8 A for 120 µs pulses, and up to 20 V at 1 A for 1 ms pulses. Derating is required above T_C = 80 °C per the ID vs. TC plot on Page 4.

Can BSP615S2L replace a mechanical relay in low-power switching?

Yes - its 2.8 A/55 V rating, <100 ns switching speed, and integrated body diode make it ideal for solid-state replacement of 5 A/30 V relays in PLC I/O modules and smart home controllers, eliminating contact wear and bounce while enabling PWM dimming and diagnostics.

Does the SOT-223 package require thermal vias for 1.8 W operation?

Yes - the datasheet specifies R_thJA = 70 K/W assumes 6 cm² copper area on one layer. To achieve full 1.8 W P_tot, at least four 0.3 mm thermal vias under Pin 4 (drain pad) connecting to inner or back-layer ground planes are recommended to maintain T_j < 150 °C at T_A = 70 °C.

BSP615S2L Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: OptiMOS™

Package/Case:: TO-261-4, TO-261AA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 55 V

Current - Continuous Drain (Id) @ 25°C:: 2.8A (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 90mOhm @ 1.4A, 10V

Vgs(th) (Max) @ Id:: 2V @ 12µA

Gate Charge (Qg) (Max) @ Vgs:: 10 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 330 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 1.8W (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-SOT223-4

BSP615S2L FAQ

1.How can I place an order for BSP615S2L through Aetrix?

Please submit a Request for Quotation (RFQ) for BSP615S2L on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSP615S2L reliable?

The price and inventory of BSP615S2L are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP615S2L is usually 5 days.

3.What payment methods are accepted for BSP615S2L?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP615S2L transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSP615S2L?

BSP615S2L orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSP615S2L order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSP615S2L?

For technical support, including BSP615S2L datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP615S2L requirements.

6.How does Aetrix verify that BSP615S2L is sourced from the original manufacturer or authorized distributors?

All BSP615S2L products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP615S2L meets industry standards.

7.What is the process for return or replacement of BSP615S2L?

All BSP615S2L units undergo pre-shipment inspection (PSI). If there is an issue with BSP615S2L, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSP615S2L part is unused and in its original packaging.

Return procedure for BSP615S2L:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.