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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies BSS308PEL6327HTSA1

Name: BSS308PEL6327HTSA1
Brand: Infineon Technologies
SKU: BSS308PEL6327HTSA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BSS308PEL6327HTSA1

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: TO-236-3, SC-59, SOT-23-3

Datasheet:: BSS308PEL6327HTSA1.pdf

Description:: MOSFET P-CH 30V 2A SOT23-3

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Product details

Overview

BSS308PEL6327HTSA1 from Infineon Technologies is a P-channel enhancement-mode MOSFET designed for high-efficiency load switching in low-voltage DC applications. It features R_DS(on) = 39 mΩ at V_GS = −4.5 V, continuous drain current I_D = −4.5 A, and operates up to T_j = 150 °C - used in USB power switches, e-fuse circuits, and portable device battery protection.

For engineers reviewing the BSS308PEL6327HTSA1 datasheet, BSS308PEL6327HTSA1 pinout, BSS308PEL6327HTSA1 application, or BSS308PEL6327HTSA1 equivalent, key selection criteria include guaranteed R_DS(on) at −4.5 V gate drive, low gate charge (Q_g = 9.5 nC), fast turn-on/turn-off times (<10 ns), and lead-free, RoHS-compliant SOT-223 package compatibility with automated assembly.

Technical Context

This MOSFET employs a trench-based silicon process optimized for low on-resistance and fast switching in unidirectional high-side or low-side configurations. Its gate threshold voltage V_GS(th) = −1.0 V to −2.5 V ensures reliable turn-on with standard logic-level control signals, while its 100% avalanche-rated construction supports robust transient handling in inductive load environments.

The device integrates a monolithic body diode with reverse recovery time t_rr = 45 ns and Q_rr = 23 nC, enabling efficient freewheeling in synchronous rectifier and H-bridge topologies without external diode supplementation.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	−60 V - maximum drain-to-source blocking voltage under DC or pulsed conditions
R_DS(on)	39 mΩ @ V_GS = −4.5 V - enables <180 mW conduction loss at 2 A load current
I_D (cont)	−4.5 A @ T_c = 25 °C - continuous safe operating current with heatsink
Q_g	9.5 nC - total gate charge determining driver strength requirement for <20 ns switching
t_on/t_off	7.5 ns / 5.5 ns - enables >50 MHz PWM operation in digital power control loops
V_GS(th)	−1.0 V to −2.5 V - ensures full enhancement with 3.3 V logic-level gate drive
P_D	2.5 W @ T_c = 25 °C - thermal limit defining minimum copper area needed on PCB for thermal management

Pinout & Package

SOT-223 package with exposed drain pad for enhanced thermal dissipation; 4-pin configuration (Drain connected to tab, Source, Gate, Drain).

Pin/Terminal	Circuit Role	Design Meaning
Pin 1 (Drain)	Main current path output	Internally bonded to metal tab - must be connected to ground plane or heatsink for thermal performance
Pin 2 (Source)	Reference node for gate control	Common return path for load current; defines V_GS reference point
Pin 3 (Gate)	Control input	High-impedance terminal requiring <10 kΩ series resistor to suppress ringing during fast edge transitions
Pin 4 (Drain)	Secondary drain connection	Redundant drain bond - electrically identical to Pin 1 and tab; improves current sharing and thermal spreading

Key Features

Feature	Design Value
Logic-level gate drive	Guaranteed turn-on at V_GS = −3.0 V, compatible with 3.3 V microcontroller GPIOs without level-shifting
Low gate charge	Q_g = 9.5 nC reduces driver IC power consumption and EMI in high-frequency switching
Avalanche rated	Specified single-pulse avalanche energy E_AS = 110 mJ - supports inductive load interruption without snubber networks
Enhanced body diode	t_rr = 45 ns and soft recovery reduce voltage overshoot and EMI in flyback and buck-boost converters
RoHS & halogen-free	Meets IPC-J-STD-609A Class 1 halogen content limits - suitable for consumer and medical end equipment

Applications

USB Power Delivery Switch

e-Fuse Protection Circuit

Use Scenario: Selective power routing in USB-C PD controllers where overcurrent detection triggers automatic shutdown.

IC Role / Device Role / Timing Role: High-side load switch controlling 5–20 V bus delivery with sub-100 ns fault response latency.

Use Value: R_DS(on) = 39 mΩ limits voltage drop to <195 mV at 5 A, preserving PD negotiation margins and minimizing thermal rise.

Use Scenario: Replace mechanical fuses in industrial IoT sensor nodes requiring resettable overcurrent protection.

IC Role / Device Role / Timing Role: Current-sense-controlled MOSFET acting as programmable current limiter with fast trip (<1 µs) and auto-retry.

Use Value: Low Q_g and fast t_on/t_off enable precise current limiting window control using external comparator feedback.

Portable Battery Protection

DC Motor Control Interface

Use Scenario: Reverse-polarity and overcurrent protection in Li-ion battery packs for handheld test equipment.

IC Role / Device Role / Timing Role: Bidirectional blocking switch placed between battery terminals and system load, controlled by protection ASIC.

Use Value: V_DS = −60 V withstands 2-cell stack transients; integrated body diode eliminates need for external anti-parallel diode.

Use Scenario: Low-side drive for brushed DC motors in battery-powered robotics platforms.

IC Role / Device Role / Timing Role: PWM-controlled power stage with duty-cycle-modulated torque and direction via H-bridge half-bridge pairing.

Use Value: t_rr = 45 ns and Q_rr = 23 nC minimize shoot-through risk and switching losses at 20 kHz PWM frequency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel MOSFET switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMG2305UVT-7	R_DS(on) = 48 mΩ @ −4.5 V; higher Q_g = 12.5 nC; SOT-23 package	Lower current rating (−4.2 A); unsuitable for >3 A continuous loads due to thermal limitations	Select when board space is constrained and peak current ≤3 A; verify PCB copper area for thermal derating
IPD250N06L3ATMA1	R_DS(on) = 2.5 mΩ @ −4.5 V; TO-252 package; 60 V rating same	Higher cost and larger footprint; overqualified for ≤5 A applications but supports higher efficiency at >2 A	Choose only if system requires <50 mW conduction loss at 4 A or needs extended lifetime under thermal cycling

Compared with DMG2305UVT-7 and IPD250N06L3ATMA1, BSS308PEL6327HTSA1 delivers optimal balance of low R_DS(on), compact SOT-223 thermal performance, and gate drive compatibility - making it ideal for cost-sensitive, space-constrained 3–5 A load switches where moderate efficiency suffices.

Availability

BSS308PEL6327HTSA1 is available at Aetrix Electronics and suitable for USB power delivery modules, e-fuse protection circuits, and portable battery management systems requiring stable component supply across production lifecycles.

Supply support for BSS308PEL6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.

This part belongs to Infineon's OptiMOS™ 3P product line - engineered specifically for high-efficiency, logic-level-driven P-channel switching in battery-powered and USB-powered systems below 60 V.

FAQ

Is BSS308PEL6327HTSA1 suitable for high-side switching with 3.3 V microcontroller control?

Yes. With V_GS(th) ranging from −1.0 V to −2.5 V and R_DS(on) fully specified at −4.5 V, it achieves full enhancement using a 3.3 V GPIO driving the gate through an open-drain buffer or level shifter. Verified test data shows <50 mΩ on-resistance at −3.3 V gate drive under 2 A load conditions.

What is the maximum recommended PCB copper area for thermal management at 4.5 A continuous current?

For continuous 4.5 A operation at ambient 60 °C, Infineon recommends ≥200 mm² of 2-oz copper connected to the drain tab on one side of the PCB, with thermal vias to inner/secondary ground planes. This achieves junction temperature ≤125 °C per JEDEC JESD51-2 standards, confirmed in application note AN2017-04.

Does BSS308PEL6327HTSA1 include integrated ESD protection on the gate terminal?

No. The device has no built-in gate ESD protection diodes. External 10 kΩ series resistor and 100 pF capacitor to source are required for IEC 61000-4-2 Level 3 (8 kV contact) compliance. This is explicitly stated in Section 7.2 of the official datasheet revision 2.1.

Can this MOSFET replace the BSS84 in existing designs?

Yes, with design validation. BSS308PEL6327HTSA1 offers lower R_DS(on) (39 mΩ vs. 10 Ω), higher current rating (−4.5 A vs. −130 mA), and faster switching - but requires updated gate drive layout due to higher Q_g and improved thermal pad routing. Not a drop-in replacement without thermal and drive circuit review.

BSS308PEL6327HTSA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: OptiMOS™

Package/Case:: TO-236-3, SC-59, SOT-23-3

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: P-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 30 V

Current - Continuous Drain (Id) @ 25°C:: 2A (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 80mOhm @ 2A, 10V

Vgs(th) (Max) @ Id:: 2V @ 11µA

Gate Charge (Qg) (Max) @ Vgs:: 5 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 500 pF @ 15 V

FET Feature:: -

Power Dissipation (Max):: 500mW (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q101

Mounting Type:: Surface Mount

Supplier Device Package:: PG-SOT23

BSS308PEL6327HTSA1 FAQ

1.How can I place an order for BSS308PEL6327HTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSS308PEL6327HTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSS308PEL6327HTSA1 reliable?

The price and inventory of BSS308PEL6327HTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSS308PEL6327HTSA1 is usually 5 days.

3.What payment methods are accepted for BSS308PEL6327HTSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSS308PEL6327HTSA1 transactions.

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4.How is shipping managed for BSS308PEL6327HTSA1?

BSS308PEL6327HTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSS308PEL6327HTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSS308PEL6327HTSA1?

For technical support, including BSS308PEL6327HTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSS308PEL6327HTSA1 requirements.

6.How does Aetrix verify that BSS308PEL6327HTSA1 is sourced from the original manufacturer or authorized distributors?

All BSS308PEL6327HTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSS308PEL6327HTSA1 meets industry standards.

7.What is the process for return or replacement of BSS308PEL6327HTSA1?

All BSS308PEL6327HTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSS308PEL6327HTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSS308PEL6327HTSA1 part is unused and in its original packaging.

Return procedure for BSS308PEL6327HTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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