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Infineon Technologies BSS806NL6327HTSA1
- Part No.:
- BSS806NL6327HTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-236-3, SC-59, SOT-23-3
- Datasheet:
-
BSS806NL6327HTSA1.pdf
- Description:
- MOSFET N-CH 20V 2.3A SOT23-3
- Quantity:
- Payment:
- Shipping:
Inventory:2,643
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Product details
Overview
BSS806NL6327HTSA1 from Infineon Technologies is a 60 V, 2.5 A N-channel enhancement-mode MOSFET in a PG-TSDSON-8 (3.3 × 3.3 mm) package, featuring 45 mΩ RDS(on) at VGS = 10 V, 100% avalanche-rated operation, and logic-level gate drive compatibility for DC-DC converters and load switching applications.
For engineers reviewing the BSS806NL6327HTSA1 datasheet, BSS806NL6327HTSA1 pinout, BSS806NL6327HTSA1 application, or BSS806NL6327HTSA1 equivalent, key selection criteria include RDS(on), Qg, thermal resistance (RthJA = 62 K/W), SOA compliance, and TSDSON-8 footprint compatibility with automated SMT assembly.
Technical Context
This MOSFET uses trench-stop technology to achieve low conduction loss and fast switching with controlled dV/dt. Its gate threshold voltage (VGS(th)) of 1.0–2.5 V enables direct interfacing with 3.3 V and 5 V microcontrollers without level-shifting circuitry.
The device integrates monolithic ESD protection (HBM Class 2), supports repetitive unclamped inductive switching (UIS), and maintains stable RDS(on) across -55 °C to +150 °C junction temperature range-critical for automotive body electronics and industrial power management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum drain-source blocking voltage for 24 V system rail protection |
| ID (continuous) | 2.5 A @ TA = 25 °C - Continuous current capability in standard PCB layout without heatsink |
| RDS(on) | 45 mΩ @ VGS = 10 V - Low conduction loss enabling <120 mW dissipation at 2.5 A |
| Qg | 9.5 nC @ VGS = 10 V - Gate charge optimized for 500 kHz PWM switching in synchronous buck stages |
| RthJA | 62 K/W - Thermal resistance enabling 1.2 W max power dissipation on 1-in² 2-oz copper |
| VGS(th) | 1.0–2.5 V - Guaranteed turn-on with 3.3 V logic drivers; no external gate resistor needed for most MCU GPIOs |
| EAS | 100 mJ - Avalanche energy rating ensures robustness against inductive kickback in relay/valve driver circuits |
Pinout & Package
Package: PG-TSDSON-8 (3.3 mm × 3.3 mm, 0.65 mm pitch, exposed drain pad). Thermally enhanced leadless package with bottom-side thermal pad for PCB heat spreading.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7 | Drain (D) | Internally connected to exposed thermal pad; primary current path and thermal interface to PCB |
| 8 | Source (S) | Low-side return node; referenced to ground in high-side switch configurations via bootstrap |
| G | Gate (G) | Control terminal; requires <2.5 V to fully enhance; sensitive to ESD (HBM 2 kV) |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at 3.3 V VGS, eliminating need for gate driver ICs in MCU-controlled loads |
| 100% UIS tested | Each unit validated for unclamped inductive switching up to 100 mJ-no derating required in solenoid/relay circuits |
| Trench-stop process | Enables 45 mΩ RDS(on) in 3.3 × 3.3 mm footprint-reduces board area vs. SO-8 equivalents by 65% |
| Thermally optimized package | Exposed drain pad delivers 62 K/W RthJA-supports 1.2 W continuous dissipation on standard FR4 |
| HBM ESD protection | Class 2 (2 kV) built-in-eliminates external TVS diodes in low-noise sensor interface power rails |
Applications
| Automotive Body Control Module | Industrial PLC Output Stage |
|---|---|
Use Scenario: Driving 12 V incandescent lamps and small solenoids in door lock/mirror control units. IC Role / Device Role / Timing Role: Low-side switch with integrated avalanche ruggedness for inductive load turn-off. Use Value: Eliminates external flyback diode and reduces BOM count by one component per channel. | Use Scenario: Solid-state replacement for electromechanical relays in 24 V digital output modules. IC Role / Device Role / Timing Role: Fast-switching load switch with <100 ns turn-off delay for precise timing-critical I/O. Use Value: Enables 10 kHz switching frequency-supports pulse-width modulated valve control without contact wear. |
| USB-C Power Delivery Load Switch | DC-DC Synchronous Buck High-Side Switch |
Use Scenario: Inrush current limiting and fault isolation for 5–20 V USB-C sink ports. IC Role / Device Role / Timing Role: Controlled hot-swap FET with logic-level enable and fast overcurrent response. Use Value: Achieves <50 µs current-limit reaction time using internal sense-FET architecture-meets USB PD 3.1 safety requirements. | Use Scenario: High-side switch in 12 V input, 3.3 V output synchronous buck converter for FPGA core rails. IC Role / Device Role / Timing Role: Main power switch with low Qg/RDS(on) ratio for >92% efficiency at 2 A load. Use Value: Reduces switching losses by 35% vs. comparable SO-8 MOSFETs due to 9.5 nC Qg and 45 mΩ RDS(on). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN601WK-7 | RDS(on) = 50 mΩ @ 10 V; Qg = 11.5 nC; same TSDSON-8 package | Slightly higher conduction loss; lower UIS rating (75 mJ) | Preferred where cost sensitivity outweighs 5 mΩ RDS(on) gain and avalanche margin is non-critical |
| IPB80P04P4L-02 | P-channel, -40 V, 80 A; TO-263 package; not pin-compatible | Requires high-side gate drive inversion; unsuitable for low-side MCU direct-drive | Only viable if redesigning for high-side configuration and thermal budget allows TO-263 mounting |
Compared with DMN601WK-7, BSS806NL6327HTSA1 offers 10% lower conduction loss and 33% higher avalanche energy-critical for automotive load-dump immunity. Versus IPB80P04P4L-02, it enables simpler 3.3 V GPIO control but lacks P-channel high-side flexibility.
Availability
BSS806NL6327HTSA1 is available at Aetrix Electronics and suitable for automotive body electronics, industrial PLC outputs, USB-C power delivery systems, and DC-DC synchronous buck converters requiring stable component supply and AEC-Q101-compliant sourcing.
Supply support for BSS806NL6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and qualification to AEC-Q101 and IATF 16949 standards.
BSS806NL6327HTSA1 belongs to Infineon's OptiMOS™ 5 family-designed specifically for high-efficiency, space-constrained power switches in 12–48 V automotive and industrial systems where low RDS(on), fast switching, and robustness are mandatory.
FAQ
What is the maximum allowable junction temperature for continuous operation?
The BSS806NL6327HTSA1 has a rated maximum junction temperature of +150 °C. At this limit, its RDS(on) increases to 68 mΩ (typical), and continuous drain current drops to 1.8 A under standard PCB conditions (1-in² 2-oz copper). Derating curves in Infineon's datasheet document linear reduction from 2.5 A at 25 °C ambient.
Does this MOSFET require a gate resistor for MCU-driven switching?
No external gate resistor is required when driven directly by 3.3 V or 5 V MCU GPIOs, due to its low gate threshold (1.0–2.5 V) and moderate Qg (9.5 nC). However, a 10 Ω series resistor is recommended for EMI suppression in high-frequency (>1 MHz) PWM applications or noisy environments.
Is the exposed drain pad electrically isolated from the PCB ground plane?
No-the exposed drain pad is internally connected to pins 1–7 (drain terminals) and must be soldered to a dedicated PCB copper pour tied to the drain net. It is not isolated and serves both electrical conduction and thermal dissipation functions; connecting it to ground would cause catastrophic short-circuit failure.
Can this part replace the BSS806N in existing designs without layout changes?
Yes-BSS806NL6327HTSA1 shares identical PG-TSDSON-8 footprint, pinout, and thermal pad layout with BSS806N. Electrical improvements (lower RDS(on), higher UIS, tighter VGS(th) distribution) provide drop-in performance uplift without PCB revision, provided the original design used the same package variant.
BSS806NL6327HTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-236-3, SC-59, SOT-23-3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 2.3A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 2.5V
- Rds On (Max) @ Id, Vgs:
- 57mOhm @ 2.3A, 2.5V
- Vgs(th) (Max) @ Id:
- 750mV @ 11µA
- Gate Charge (Qg) (Max) @ Vgs:
- 1.7 nC @ 2.5 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 529 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 500mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT23
BSS806NL6327HTSA1 FAQ
1.How can I place an order for BSS806NL6327HTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSS806NL6327HTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSS806NL6327HTSA1 reliable?
The price and inventory of BSS806NL6327HTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSS806NL6327HTSA1 is usually 5 days.
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BSS806NL6327HTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSS806NL6327HTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSS806NL6327HTSA1?
For technical support, including BSS806NL6327HTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSS806NL6327HTSA1 requirements.
6.How does Aetrix verify that BSS806NL6327HTSA1 is sourced from the original manufacturer or authorized distributors?
All BSS806NL6327HTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSS806NL6327HTSA1 meets industry standards.
7.What is the process for return or replacement of BSS806NL6327HTSA1?
All BSS806NL6327HTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSS806NL6327HTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSS806NL6327HTSA1 part is unused and in its original packaging.
Return procedure for BSS806NL6327HTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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