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NXP Semiconductors BYD17J,115

Part No.:
BYD17J,115
Manufacturer:
NXP Semiconductors
Category:
Single Diodes
Package:
SOD-87
Datasheet:
AetrixBYD17J,115.pdf
Description:
DIODE AVALANCHE 600V 1.5A MELF
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,712

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Product details

Overview

BYD17J,115 from NXP Semiconductors (formerly Philips) is a controlled avalanche rectifier in SOD87 glass package, rated for 600 V repetitive peak reverse voltage (VRRM), 1.5 A average forward current (IF(AV)) at 105 °C tie-point temperature, and 7 mJ non-repetitive reverse avalanche energy (ERSM). It serves as a rugged, surface-mount power rectifier in flyback snubber networks and inductive load switching circuits.

For engineers reviewing the BYD17J,115 datasheet, BYD17J,115 pinout, BYD17J,115 application, or BYD17J,115 equivalent, key selection criteria include its guaranteed avalanche energy absorption, low leakage (≤1 µA at VR = VRRM), fast 3 µs reverse recovery time (trr), and thermal resistance of 30 K/W (junction-to-tie-point), critical for high-reliability industrial power conversion designs.

Technical Context

The BYD17J,115 employs Implotec™ hermetically sealed cavity-free cylindrical glass packaging with matched thermal expansion coefficients, eliminating fatigue failure modes. Its controlled avalanche capability enables reliable clamping during inductive turn-off transients without external suppressors.

It operates with a typical forward voltage of 1.05 V at 1 A and 25 °C, reverse breakdown voltage of 650 V at IR = 0.1 mA, and diode capacitance of 21 pF at 0 V - parameters optimized for high-voltage, medium-current switching applications where stability under thermal stress is essential.

Key Specifications

ParameterValue and Actual Design Meaning
VRRM600 V - maximum repetitive reverse voltage the device withstands without breakdown in normal operation
IF(AV)1.5 A at Ttp = 105 °C - average forward current rating under PCB-mounted thermal conditions
ERSM7 mJ - guaranteed non-repetitive reverse avalanche energy absorption capability for inductive load switching
trr3 µs - reverse recovery time enabling efficient operation in 100–500 kHz switching converters
Rth j-tp30 K/W - junction-to-tie-point thermal resistance supporting compact layout with direct thermal path to PCB copper
IR≤1 µA at VRRM - ultra-low reverse leakage ensures minimal standby power loss in high-impedance bias networks

Pinout & Package

SOD87 hermetically sealed glass surface-mount package (2.0 × 3.7 mm body, 0.3 mm height), cathode marked with band on cylindrical body. Designed for reflow soldering on epoxy-glass PCBs with ≥40 µm copper thickness.

Pin/TerminalCircuit RoleDesign Meaning
AnodeForward current entry terminalConnected to source/switch node in flyback or buck-derived topologies; must handle 20 A surge peaks
CathodeForward current exit / avalanche clamping terminalMarked with band; ties to output rail or clamp node; absorbs inductive energy during turn-off

Key Features

FeatureDesign Value
Glass passivationHermetic seal prevents moisture ingress and corrosion, ensuring long-term reliability in humid environments
Controlled avalanche capabilityGuaranteed 7 mJ ERSM allows safe, repeatable clamping without external Zener or TVS devices
High operating temperatureJunction temperature range −65 °C to +175 °C supports operation in automotive under-hood and industrial motor drive enclosures
Low leakage current≤1 µA at VRRM enables stable DC biasing in high-impedance feedback or sensing paths

Applications

Switch-Mode Power Supply SnubbersInductive Load Switching

Use Scenario: Used across MOSFET drain-source in flyback or forward converters to absorb leakage inductance energy during switch turn-off.

IC Role / Device Role / Timing Role: Avalanche rectifier providing passive clamping function with precise voltage threshold and energy handling.

Use Value: Eliminates need for external RC snubber or TVS, reducing BOM count and improving efficiency by recovering stored energy.

Use Scenario: Placed across relay coils or solenoid windings in PLC I/O modules and industrial controllers.

IC Role / Device Role / Timing Role: Controlled avalanche rectifier acting as freewheeling and voltage-clamping element during coil de-energization.

Use Value: Prevents voltage spikes >1000 V that could damage driving transistors, extending system lifetime and meeting IEC 61000-4-4 immunity requirements.

Motor Drive Braking CircuitsDC Link Protection

Use Scenario: Integrated into dynamic braking paths of brushed DC motor drivers to dissipate regenerated energy.

IC Role / Device Role / Timing Role: High-energy avalanche rectifier conducting reverse current during regenerative events while limiting voltage overshoot.

Use Value: Enables compact, cost-effective braking without active chopper circuits or large electrolytic capacitors.

Use Scenario: Mounted across DC bus rails in inverters to clamp transient overvoltages caused by line surges or IGBT switching.

IC Role / Device Role / Timing Role: Fast-response avalanche rectifier absorbing short-duration, high-power transients before protection ICs react.

Use Value: Provides primary-level overvoltage suppression with tighter voltage tolerance than standard TVS diodes (650 V V(BR)R vs. ±10% tolerance).

Equivalent & Alternatives

The following parts are listed as comparable options for similar controlled avalanche rectifier applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STTH1L06S600 V VRRM, 1 A IF(AV), TO-277 package, 50 ns trr - faster but lower current and no guaranteed avalanche energy specPreferred in space-constrained high-frequency PFC stages where speed outweighs energy handlingSelect when trr < 10 ns is required and ERSM > 5 mJ is not mandatory
ON Semiconductor MUR160600 V VRRM, 1 A IF(AV), DO-41 package, 75 ns trr - axial leaded, no avalanche rating, higher VF (1.7 V)Suitable for low-cost, non-critical AC/DC adapters where board space and reliability margins are less constrainedChoose only for legacy through-hole designs; not recommended for surface-mount or high-reliability use

Compared with STTH1L06S and MUR160, the BYD17J,115 uniquely combines SOD87 surface-mount form factor, guaranteed 7 mJ avalanche energy, and 3 µs trr - making it the only option among the three qualified for high-stress inductive switching in industrial control PCBs requiring both miniaturization and robust transient suppression.

Availability

BYD17J,115 is available at Aetrix Electronics and suitable for industrial motor drives, programmable logic controller (PLC) I/O modules, and switch-mode power supply snubber networks requiring stable component supply and long-lifecycle availability.

Supply support for BYD17J,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader delivering high-performance analog, logic, and interface solutions, with roots in Philips' pioneering discrete power device development.

The BYD17 series was engineered specifically for controlled avalanche energy absorption in surface-mount industrial power interfaces - targeting applications where reliability under repetitive inductive stress exceeds standard rectifier specifications.

FAQ

What is the maximum junction temperature rating for BYD17J,115?

The BYD17J,115 has a maximum junction temperature (Tj) of +175 °C and a minimum of −65 °C, validated per IEC 60134 limiting values. This wide range supports operation in harsh environments such as motor drive enclosures and automotive under-hood applications. The BYD17J,115 maintains specified electrical characteristics across this full range when mounted per Fig.9 PCB guidelines.

Does BYD17J,115 have a specified reverse recovery time (trr)?

Yes, the BYD17J,115 has a maximum reverse recovery time (trr) of 3 µs, measured under standard conditions: IF = 0.5 A switched to IR = 1 A, with measurement at IR = 0.25 A. This value is confirmed in the Electrical Characteristics table on page 3 of the original Philips datasheet. The BYD17J,115 delivers consistent trr performance due to its controlled avalanche structure and glass-passivated junction.

Is BYD17J,115 compatible with lead-free reflow soldering processes?

Yes, the BYD17J,115's SOD87 glass package is qualified for lead-free reflow soldering per JEDEC J-STD-020. Its hermetic Implotec™ construction withstands peak temperatures up to 260 °C for 10 seconds. The BYD17J,115 requires standard preheat and soak profiles; no special flux or nitrogen atmosphere is needed for reliable joint formation on FR-4 or high-Tg PCBs.

What does "controlled avalanche" mean for BYD17J,115?

"Controlled avalanche" means the BYD17J,115 is designed and tested to safely operate in reverse breakdown mode with predictable voltage clamping and guaranteed energy absorption (7 mJ ERSM). Unlike standard rectifiers, the BYD17J,115 avoids destructive thermal runaway during transient overvoltage events. This behavior is intrinsic to its process and verified per test condition L = 120 mH, Tj = max prior to surge.

How is the cathode identified on BYD17J,115?

The cathode of the BYD17J,115 is marked with a distinct band on the cylindrical glass body, as shown in Figure 1 (Simplified outline) and Package Outline drawing on page 7 of the datasheet. This marking aligns with industry-standard polarity identification for SOD87 devices. When mounted on PCB, the banded end connects to the higher-potential node during reverse bias - confirming correct orientation for avalanche clamping functionality in the BYD17J,115.

BYD17J,115 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
SOD-87
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
Avalanche
Voltage - DC Reverse (Vr) (Max):
600 V
Current - Average Rectified (Io):
1.5A
Voltage - Forward (Vf) (Max) @ If:
1.05 V @ 1 A
Speed:
Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr):
3 µs
Current - Reverse Leakage @ Vr:
1 µA @ 600 V
Capacitance @ Vr, F:
21pF @ 0V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
MELF
Operating Temperature - Junction:
-65°C ~ 175°C

BYD17J,115 FAQ

1.How can I place an order for BYD17J,115 through Aetrix?

Please submit a Request for Quotation (RFQ) for BYD17J,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BYD17J,115 reliable?

The price and inventory of BYD17J,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BYD17J,115 is usually 5 days.

3.What payment methods are accepted for BYD17J,115?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BYD17J,115 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BYD17J,115?

BYD17J,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BYD17J,115 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BYD17J,115?

For technical support, including BYD17J,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BYD17J,115 requirements.

6.How does Aetrix verify that BYD17J,115 is sourced from the original manufacturer or authorized distributors?

All BYD17J,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BYD17J,115 meets industry standards.

7.What is the process for return or replacement of BYD17J,115?

All BYD17J,115 units undergo pre-shipment inspection (PSI). If there is an issue with BYD17J,115, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BYD17J,115 part is unused and in its original packaging.

Return procedure for BYD17J,115:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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