NXP Semiconductors BYD17K,135

Overview

BYD17K,135 from NXP Semiconductors (formerly Philips) is a controlled avalanche rectifier in SOD87 glass package, rated for 800 V repetitive peak reverse voltage (VRRM), 1.5 A average forward current (IF(AV)) at 105 °C tie-point temperature, and 7 mJ non-repetitive reverse avalanche energy (ERSM), used in snubber circuits and inductive load switching in industrial power supplies.

For engineers reviewing the BYD17K,135 datasheet, BYD17K,135 pinout, BYD17K,135 application, or BYD17K,135 equivalent, key selection criteria include guaranteed avalanche energy absorption, low leakage current (≤1 µA at 800 V), 3 µs reverse recovery time, and thermal resistance of 30 K/W junction-to-tie-point - critical for high-reliability transient suppression in compact surface-mount designs.

Technical Context

The BYD17K,135 employs Implotec™ hermetically sealed glass passivation technology with matched thermal expansion coefficients, eliminating cavity-induced fatigue and enabling stable operation up to 175 °C junction temperature. Its controlled avalanche behavior is characterized by a reverse breakdown voltage (V(BR)R) of 900 V at IR = 0.1 mA, exceeding its 800 V VRRM rating to ensure margin during surge events.

Designed for inductive load commutation, it delivers 20 A non-repetitive peak forward current (IFSM) under 10 ms half-sine conditions and exhibits 21 pF diode capacitance at 0 V reverse bias, supporting fast switching while maintaining low EMI in snubber networks.

Key Specifications

Pinout & Package

SOD87 hermetically sealed cylindrical glass package (2.0 × 3.5 mm body, 0.3 mm lead diameter), cathode marked with band (k) per Fig.1 and outline drawing. Implotec™ construction ensures zero internal cavities and fatigue-free thermal cycling performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar controlled avalanche rectifier applications.

Compared with STTH1L06S and MUR160, the BYD17K,135 uniquely combines 800 V rating, guaranteed 7 mJ avalanche energy, and SOD87 surface-mount form factor - making it the only option among the three qualified for high-energy, space-constrained inductive clamp applications requiring certified surge robustness.

Availability

BYD17K,135 is available at Aetrix Electronics and suitable for industrial power supply snubbers, relay coil suppression, and DC motor protection requiring stable component supply, long-lifecycle support, and traceable sourcing for production programs.

Supply support for BYD17K,135 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader delivering high-performance analog, logic, and power devices rooted in Philips' legacy of reliability and industrial-grade qualification.

The BYD17 series was developed specifically for controlled avalanche energy absorption in surface-mount inductive switching applications, targeting industrial automation, power conversion, and electromechanical actuation systems demanding certified transient robustness.

FAQ

What is the guaranteed avalanche energy rating for BYD17K,135?

The BYD17K,135 has a guaranteed non-repetitive peak reverse avalanche energy (ERSM) of 7 mJ under specified test conditions (L = 120 mH, Tj = max prior to surge). This value is measured and assured per the original Philips datasheet, confirming its suitability for inductive load switching where precise energy clamping is required. The BYD17K,135 achieves this with a 900 V V(BR)R, providing 100 V margin above its 800 V VRRM rating.

Does BYD17K,135 have a specified reverse recovery time?

Yes, the BYD17K,135 has a reverse recovery time (trr) of 3 µs, measured when switched from IF = 0.5 A to IR = 1 A, with IR = 0.25 A defined as the recovery threshold. This value is confirmed in the "Electrical Characteristics" table of the official datasheet and supports operation in switching applications up to approximately 500 kHz. The BYD17K,135 maintains consistent trr performance across its full temperature range.

What is the thermal resistance from junction to tie-point for BYD17K,135?

The thermal resistance from junction to tie-point (Rth j-tp) for BYD17K,135 is 30 K/W, as specified in the "Thermal Characteristics" section of the datasheet. This value assumes mounting on an epoxy-glass PCB with ≥40 µm copper thickness per Figure 9. The BYD17K,135 relies on tie-point conduction rather than ambient convection, making Rth j-tp the dominant thermal path for power dissipation management.

Is BYD17K,135 suitable for surface-mount assembly using standard reflow profiles?

Yes, the BYD17K,135 uses a hermetically sealed glass SOD87 package compatible with standard IR reflow soldering processes. Its Implotec™ construction eliminates internal cavities, preventing popcorning or cracking during thermal cycling. The BYD17K,135 has been qualified for JEDEC J-STD-020 moisture sensitivity level (MSL) 1 - unlimited floor life - and withstands peak reflow temperatures up to 260 °C for 10 seconds.

What does the "135" suffix indicate in BYD17K,135?

Within the BYD17 series, the "135" suffix in BYD17K,135 denotes the specific packaging and reel configuration: 8 mm embossed tape, 1000 pieces per reel, and standard Philips Semiconductors shipping format per the 2001 datasheet. It does not affect electrical specifications - all BYD17K variants share identical VRRM, ERSM, trr, and thermal characteristics. The BYD17K,135 remains functionally identical to BYD17K without suffix in circuit operation.