NXP Semiconductors BYD77B,115

Overview

BYD77B,115 from NXP Semiconductors (formerly Philips) is an ultra-fast, low-loss controlled-avalanche surface-mount rectifier in SOD87 glass package, rated for 100 V repetitive peak reverse voltage (VRRM), 2.00 A average forward current at tie-point temperature of 105 °C, and 25 ns reverse recovery time (trr). It serves as a primary output rectifier in high-frequency switch-mode power supplies where fast switching, low conduction loss, and robust avalanche energy handling are required.

For engineers reviewing the BYD77B,115 datasheet, BYD77B,115 pinout, BYD77B,115 application, or BYD77B,115 equivalent, key selection criteria include its guaranteed 10 mJ non-repetitive reverse avalanche energy (ERSM), 0.75 V max forward voltage at 1 A and Tj = Tj max, 1 µA max reverse leakage at VR = 100 V and 25 °C, thermal resistance Rth j-tp = 30 K/W, and SOD87 hermetic glass package with cathode marking.

Technical Context

The BYD77B,115 employs Implotec™ cavity-free cylindrical glass packaging for hermetic sealing and thermal fatigue resistance, with matched coefficients of expansion across all materials. Its controlled-avalanche design ensures predictable reverse breakdown at 110 V (V(BR)R, IR = 0.1 mA) and stable energy absorption under inductive turn-off stress.

It operates with junction temperatures from −65 °C to +175 °C and delivers low diode capacitance (≤50 pF at f = 1 MHz, VR = 0 V) and high dIF/dt immunity (≤4 A/µs), making it suitable for high-efficiency, high-density DC/DC converters and auxiliary power supply rails.

Key Specifications

Pinout & Package

SOD87 is a hermetically sealed, cavity-free cylindrical glass surface-mount package with two axial leads; cathode is marked by a band on the glass body. The device has no internal die attach pad or exposed thermal slug - thermal performance relies entirely on leadframe conduction through the tie-point.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-fast controlled-avalanche rectifier applications.

Compared with STTH2L06 and MUR220, the BYD77B,115 offers superior high-frequency efficiency via its 25 ns trr and 0.75 V VF, plus verified 10 mJ avalanche energy handling - enabling smaller magnetics, reduced snubber count, and SMT-compatible layout in space-constrained SMPS designs.

Availability

BYD77B,115 is available at Aetrix Electronics and suitable for high-frequency switch-mode power supplies, industrial auxiliary power rails, and LED driver secondary stages requiring stable component supply, long-lifecycle support, and consistent parametric performance across production batches.

Supply support for BYD77B,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Philips' pioneering discrete and analog portfolio.

The BYD77 series was developed by Philips specifically for ultra-fast, low-loss rectification in high-frequency power conversion, emphasizing controlled avalanche ruggedness, miniaturized SMD packaging, and stable parametric behavior across extended temperature ranges.

FAQ

What is the maximum junction temperature rating for BYD77B,115?

The BYD77B,115 has a specified junction temperature range of −65 °C to +175 °C. This high upper limit enables reliable operation in thermally demanding environments such as enclosed industrial power modules or high-ambient-temperature LED drivers. The 175 °C rating is validated per IEC 134 limiting values and confirmed in the thermal characteristics section of the official datasheet.

Does BYD77B,115 have a specified avalanche energy rating, and how is it tested?

Yes, BYD77B,115 is guaranteed to absorb 10 mJ of non-repetitive reverse avalanche energy (ERSM), tested under standardized conditions: L = 120 mH inductive load, Tj = 25 °C prior to surge, and VR = VRRMmax (100 V). This rating is explicitly listed in the Limiting Values table and reflects its controlled-avalanche design for snubberless inductive switching applications.

What is the reverse recovery time (trr) of BYD77B,115, and under what test conditions is it measured?

The reverse recovery time (trr) of BYD77B,115 is 25 ns, measured when switched from IF = 0.5 A to IR = 1 A, with detection at IR = 0.25 A, per Figure 18 test circuit. This value applies to the entire BYD77A–D subgroup and is confirmed in the Electrical Characteristics table under "trr" parameter for BYD77A to D.

Is BYD77B,115 compatible with lead-free reflow soldering processes?

Yes, BYD77B,115's SOD87 glass package is qualified for standard lead-free reflow profiles, including peak temperatures up to 260 °C for 10 seconds. The glass passivation and hermetic seal ensure no moisture-induced popcorning or delamination, and the device meets JEDEC J-STD-020 moisture sensitivity level (MSL) 1 requirements as documented in Philips' packaging specifications.

What does the "115" suffix in BYD77B,115 indicate?

The "115" suffix in BYD77B,115 denotes the original Philips date code format indicating November 1995 - however, this part was superseded in the 1999 revision (Nov 15, 1999) and is now manufactured and supported by NXP Semiconductors under the same ordering code. The "115" is an integral part of the full orderable number and must be included for accurate procurement and traceability.