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NXP Semiconductors BYD77D,115
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- Part No.:
- BYD77D,115
- Manufacturer:
- NXP Semiconductors
- Category:
- Single Diodes
- Package:
- SOD-87
- Datasheet:
-
BYD77D,115.pdf
- Description:
- DIODE AVALANCHE 200V 850MA MELF
- Quantity:
- Payment:
- Shipping:
Inventory:7,120
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Product details
Overview
BYD77D,115 from NXP Semiconductors (formerly Philips) is an ultra-fast, low-loss controlled-avalanche surface-mount rectifier in SOD87 glass package, rated for 200 V repetitive peak reverse voltage (VRRM), 2.00 A average forward current at tie-point temperature of 105 °C, and 25 ns reverse recovery time (trr). It serves as a high-reliability output rectifier in switched-mode power supplies where controlled avalanche energy absorption (10 mJ) and low leakage (<1 µA at 200 V) are critical.
For engineers reviewing the BYD77D,115 datasheet, BYD77D,115 pinout, BYD77D,115 application, or BYD77D,115 equivalent, this device is selected for high-efficiency AC/DC adapters, DC-DC converters, and flyback snubber circuits requiring fast switching, thermal stability up to 175 °C junction temperature, and guaranteed avalanche ruggedness under inductive turn-off stress.
Technical Context
The BYD77D,115 employs a cavity-free cylindrical glass SOD87 package fabricated via Implotec™ technology, ensuring hermetic sealing and matched coefficients of thermal expansion for fatigue-free operation. Its controlled avalanche structure enables reliable energy absorption during inductive load switching without degradation.
It delivers ultra-fast recovery (25 ns) with low forward voltage drop (0.75 V max at 1 A and Tj = Tj max), low reverse leakage (≤1 µA at VR = 200 V, 25 °C), and high dIF/dt capability (4 A/µs), making it suitable for high-frequency SMPS topologies operating above 100 kHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 200 V - Maximum repetitive reverse blocking voltage; defines safe operating range in rectifier applications with voltage margin against transients. |
| IF(AV) | 2.00 A at Ttp = 105 °C - Continuous DC output current capability when mounted on PCB with defined thermal tie-point, enabling compact 15–25 W SMPS designs. |
| trr | 25 ns - Reverse recovery time measured at IF = 0.5 A → IR = 1 A; ensures minimal switching loss and EMI in high-frequency converters. |
| VF | 0.75 V max at IF = 1 A, Tj = Tj max - Low forward conduction loss improves efficiency and reduces thermal stress in high-duty-cycle operation. |
| ERSM | 10 mJ - Non-repetitive avalanche energy rating with L = 120 mH; supports robust snubberless inductive turn-off in relay drivers or solenoid controls. |
| Rth j-tp | 30 K/W - Junction-to-tie-point thermal resistance; enables accurate thermal modeling when PCB copper area is used as heatsink. |
| IR | ≤1 µA at VR = 200 V, 25 °C - Ultra-low reverse leakage preserves standby power budget in energy-efficient power supplies. |
Pinout & Package
BYD77D,115 uses the SOD87 surface-mount glass package: hermetically sealed, cavity-free cylindrical outline with axial leads, cathode marked by band (k), anode unmarked (a); dimensions: D = 2.0 mm, L = 3.5 mm (typ), H = 2.1 mm (max).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (a) | Forward current entry point | Connected to input side of rectifier stage (e.g., transformer secondary or switch node); must withstand surge currents up to 25 A non-repetitive. |
| Cathode (k) | Forward current exit / output terminal | Connected to output filter capacitor or load; polarity marking essential for correct PCB layout and ESD-safe handling. |
Key Features
| Feature | Design Value |
|---|---|
| Glass passivation | Hermetic protection against moisture and contaminants; eliminates need for conformal coating in industrial-grade power modules. |
| Controlled avalanche capability | Guaranteed 10 mJ single-pulse energy absorption; enables elimination of external snubber networks in flyback and forward converters. |
| High junction temperature rating | 175 °C maximum operating junction temperature; supports operation in enclosed, thermally constrained environments without derating. |
| Low reverse leakage | ≤1 µA at 200 V and 25 °C; maintains low standby power in Energy Star-compliant AC/DC adapters. |
| SOD87 surface-mount outline | Smallest standardized glass rectifier package; allows high-density PCB layouts while retaining reliability advantages of glass encapsulation. |
Applications
| AC/DC Adapter Output Rectification | Flyback Converter Secondary Side |
|---|---|
Use Scenario: 12 V/2 A universal-input offline adapter for consumer electronics. IC Role / Device Role / Timing Role: Primary output rectifier converting high-frequency transformer secondary voltage to regulated DC. Use Value: 25 ns trr minimizes switching loss and diode ringing; 0.75 V VF reduces conduction loss, improving efficiency from 78% to 81% at full load. | Use Scenario: Isolated 5 V/1.5 A auxiliary supply in telecom power system. IC Role / Device Role / Timing Role: Secondary-side freewheeling rectifier clamping transformer reset energy. Use Value: Guaranteed 10 mJ avalanche energy absorbs leakage inductance spikes without failure, eliminating need for RC snubber. |
| DC-DC Buck-Boost Stage | Industrial Relay Driver Protection |
Use Scenario: 24 V input to ±15 V dual-rail converter in PLC I/O module. IC Role / Device Role / Timing Role: Synchronous rectifier replacement in discontinuous conduction mode (DCM) topology. Use Value: Low IR (≤1 µA) prevents output rail discharge during sleep mode; 30 K/W Rth j-tp enables direct copper pour thermal coupling. | Use Scenario: 24 V DC coil driver for safety-critical pneumatic valve control. IC Role / Device Role / Timing Role: Freewheeling diode across relay coil to suppress inductive kickback. Use Value: Controlled avalanche behavior ensures predictable 200 V clamp voltage and avoids destructive voltage overshoot beyond MOSFET breakdown limit. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-fast controlled-avalanche rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTH2R02 | 200 V VRRM, 2 A IF(AV), 35 ns trr, TO-220AC package, higher VF (0.95 V typ) | Requires heatsink due to larger package; less suitable for space-constrained SMT designs | Select when higher surge current rating (IFSM = 60 A) and through-hole assembly are preferred over miniaturization. |
| ON Semiconductor MUR220 | 200 V VRRM, 2 A IF(AV), 35 ns trr, DO-15 package, plastic encapsulation, no guaranteed avalanche rating | Lacks specified ERSM; not validated for repeated inductive switching stress | Choose only for non-critical, low-energy flyback applications where cost is prioritized over ruggedness assurance. |
Compared with STTH2R02 and MUR220, the BYD77D,115 uniquely combines SOD87 miniaturization, guaranteed 10 mJ avalanche energy, and 25 ns trr-making it the only option among the three qualified for high-reliability, high-density, inductive-switching-critical designs without external protection.
Availability
BYD77D,115 is available at Aetrix Electronics and suitable for AC/DC adapters, industrial DC-DC converters, and relay driver circuits requiring stable component supply, long-term lifecycle support, and traceable sourcing from original manufacturer stock.
Supply support for BYD77D,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions, automotive radar, and high-reliability power management components.
The BYD77 series was developed by Philips (now NXP) specifically for ultra-fast, avalanche-rugged surface-mount rectification in high-frequency switched-mode power supplies demanding long-term reliability under thermal and electrical stress.
FAQ
What is the maximum junction temperature rating for BYD77D,115?
The BYD77D,115 has a maximum junction temperature (Tj) rating of +175 °C, verified per IEC 134 limiting values. This allows sustained operation in thermally demanding environments such as enclosed power supplies or industrial motor drives. The BYD77D,115 maintains parameter stability-including VF and trr-up to this limit, supporting designs where ambient temperatures exceed 85 °C.
Does BYD77D,115 have a guaranteed avalanche energy rating?
Yes, the BYD77D,115 is explicitly specified with a non-repetitive peak reverse avalanche energy (ERSM) of 10 mJ under L = 120 mH, Tj = 25 °C conditions. This rating is guaranteed in the official Philips product specification and distinguishes the BYD77D,115 from standard fast rectifiers. The BYD77D,115 leverages its controlled avalanche structure to safely absorb inductive turn-off energy without degradation.
What is the reverse recovery time (trr) of BYD77D,115 and how is it measured?
The BYD77D,115 has a maximum reverse recovery time (trr) of 25 ns, measured under standardized conditions: switching from IF = 0.5 A to IR = 1 A, with IR measurement threshold at 0.25 A, per Fig.18 test circuit. This value applies to all BYD77A–D variants and is confirmed across production lots. The BYD77D,115 achieves this performance via optimized carrier lifetime control in its epitaxial structure.
Is BYD77D,115 compatible with lead-free reflow soldering processes?
Yes, the BYD77D,115's glass SOD87 package and internal metallization are qualified for standard lead-free reflow profiles (JEDEC J-STD-020), including peak temperatures up to 260 °C for 10 seconds. The device's hermetic glass seal prevents moisture ingress and popcorning, and its thermal resistance (Rth j-tp = 30 K/W) supports effective heat dissipation during soldering. BYD77D,115 remains fully functional post-reflow without parameter shift.
What does the "115" suffix in BYD77D,115 indicate?
Within the Philips/NXP ordering system, the "115" suffix in BYD77D,115 denotes tape-and-reel packaging in 8 mm embossed carrier tape, per the "Shipped in 8 mm embossed tape" feature stated in the datasheet. It also indicates compliance with standard RoHS exemptions applicable at time of release (1999), and confirms the part is a fully tested, production-grade device-not a sample or engineering unit. The BYD77D,115 is the standard commercial version of the BYD77D die in SOD87 package.
BYD77D,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SOD-87
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- Avalanche
- Voltage - DC Reverse (Vr) (Max):
- 200 V
- Current - Average Rectified (Io):
- 850mA
- Voltage - Forward (Vf) (Max) @ If:
- 980 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 25 ns
- Current - Reverse Leakage @ Vr:
- 1 µA @ 200 V
- Capacitance @ Vr, F:
- 50pF @ 0V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- MELF
- Operating Temperature - Junction:
- -65°C ~ 175°C
BYD77D,115 FAQ
1.How can I place an order for BYD77D,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for BYD77D,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BYD77D,115 reliable?
The price and inventory of BYD77D,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BYD77D,115 is usually 5 days.
3.What payment methods are accepted for BYD77D,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BYD77D,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BYD77D,115?
BYD77D,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BYD77D,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BYD77D,115?
For technical support, including BYD77D,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BYD77D,115 requirements.
6.How does Aetrix verify that BYD77D,115 is sourced from the original manufacturer or authorized distributors?
All BYD77D,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BYD77D,115 meets industry standards.
7.What is the process for return or replacement of BYD77D,115?
All BYD77D,115 units undergo pre-shipment inspection (PSI). If there is an issue with BYD77D,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BYD77D,115 part is unused and in its original packaging.
Return procedure for BYD77D,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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