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NXP Semiconductors BYV25FX-600,127
- Part No.:
- BYV25FX-600,127
- Manufacturer:
- NXP Semiconductors
- Category:
- Single Diodes
- Package:
- TO-220-2 Full Pack
- Datasheet:
-
BYV25FX-600,127.pdf
- Description:
- DIODE GEN PURP 600V 5A TO220F
- Quantity:
- Payment:
- Shipping:
Inventory:4,000
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Product details
Overview
BYV25FX-600 from NXP Semiconductors is an enhanced ultrafast power diode in a SOD113 (TO-220F) isolated plastic package, designed for high-efficiency PFC stages. It delivers 600 V repetitive peak reverse voltage, 5 A average forward current at 97 °C heatsink temperature, and 17.5–35 ns reverse recovery time with soft recovery behavior-enabling low EMI and reduced switching losses in interleaved DCM/CCM topologies.
For engineers reviewing the BYV25FX-600 datasheet, BYV25FX-600 pinout, BYV25FX-600 application, or BYV25FX-600 equivalent, key selection criteria include its isolated TO-220F package, 2500 V RMS isolation rating, 5.5 K/W junction-to-heatsink thermal resistance, and verified performance in dual-mode PFC circuits requiring fast, soft-recovery diodes with low forward voltage drift over temperature.
Technical Context
The BYV25FX-600 employs an optimized silicon structure to achieve ultrafast recovery with softness-critical for minimizing voltage overshoot and ringing in high-frequency PFC boost converters. Its isolated mounting base enables direct heatsink attachment without additional insulation, supporting thermally demanding industrial and server power supplies.
It operates with a typical forward voltage of 1.3 V at 5 A and 25 °C, dropping to 1.1 V at 150 °C junction temperature-demonstrating negative thermal coefficient behavior that improves current sharing in parallel configurations. The 10 A repetitive peak forward current and 66 A non-repetitive surge rating support robust transient handling in line-synchronized rectification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 600 V - Withstands continuous 600 V reverse bias in repetitive operation, suitable for universal-input (85–265 VAC) PFC front-ends. |
| IF(AV) | 5 A - Sustains 5 A average forward current with square-wave excitation at ≤97 °C heatsink temperature, defining steady-state conduction capability. |
| trr | 17.5–35 ns - Ultrafast reverse recovery with softness reduces di/dt-induced voltage spikes and EMI in >100 kHz PFC stages. |
| VF @ 5 A, 150 °C | 1.1–1.7 V - Low and stable forward drop at elevated junction temperature ensures efficiency retention under thermal stress. |
| Rth(j-h) | 5.5 K/W - Low junction-to-heatsink thermal resistance enables effective heat transfer when mounted with thermal compound on isolated heatsinks. |
| Visol(RMS) | 2500 V - Isolation barrier withstands 2500 V RMS between pins and heatsink, eliminating need for insulating pads in Class I safety designs. |
| Qr | 13 nC - Low recovered charge minimizes turn-off losses and commutation stress in interleaved boost phases. |
Pinout & Package
Package: SOD113 (2-lead TO-220F), plastic single-ended package with isolated mounting base, 1 mounting hole, and heatsink-compatible footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (K) | Main current exit terminal; connects to PFC output rail or boost inductor node. |
| 2 | Anode (A) | Main current entry terminal; connects to AC input bridge or PFC switch node. |
| Mounting Base (mb) | Isolated Heatsink Interface | Electrically isolated metal surface for direct thermal coupling to heatsink-no insulator required. |
Key Features
| Feature | Design Value |
|---|---|
| Isolated TO-220F package | Enables direct heatsink mounting without dielectric interface, reducing thermal impedance and assembly cost. |
| Soft recovery characteristic | Minimizes voltage overshoot and oscillation during reverse recovery, easing EMI filter design in high-density PFC modules. |
| Low thermal resistance (Rth(j-h) = 5.5 K/W) | Supports higher power density by enabling efficient heat extraction at 5 A continuous load. |
| High thermal cycling performance | Validated for repeated thermal stress in industrial power supplies with wide ambient operating ranges. |
| Low on-state losses (VF = 1.1 V @ 5 A, 150 °C) | Reduces conduction loss by ~15% compared to standard ultrafast diodes at elevated temperature, improving full-load efficiency. |
Applications
| Interleaved PFC Boost Converter | Dual-Mode (DCM/CCM) PFC Stage |
|---|---|
|
Use Scenario: Two-phase interleaved boost converter in 1–3 kW server PSUs operating across universal AC input (85–265 VAC). IC Role / Device Role / Timing Role: Ultrafast freewheeling diode in each boost leg, conducting during switch off-time and recovering before next switching cycle. Use Value: Soft 17.5–35 ns recovery and 13 nC Qr suppress voltage spikes, allowing tighter layout and smaller snubbers while maintaining >96% efficiency at 230 VAC full load. |
Use Scenario: Adaptive PFC controller transitioning between discontinuous (DCM) and continuous (CCM) conduction modes based on load and line conditions. IC Role / Device Role / Timing Role: Output rectifier diode handling variable duty-cycle conduction with rapid turn-off demands in both modes. Use Value: Stable VF across 25–150 °C and low Rth(j-h) ensure consistent conduction loss and thermal margin regardless of mode transitions or ambient shifts. |
| Industrial AC-DC Front-End | Telecom Rectifier Module |
|
Use Scenario: 2 kW industrial AC-DC power supply with forced-air cooling and strict reliability requirements over 10-year service life. IC Role / Device Role / Timing Role: Primary output rectifier in high-voltage boost stage, subjected to frequent thermal cycling and line transients. Use Value: High thermal cycling endurance and 2500 V RMS isolation allow direct heatsink mounting and simplify safety certification for Class I equipment. |
Use Scenario: 48 V telecom rectifier module with redundant PFC stages and hot-swap capability. IC Role / Device Role / Timing Role: Fast-recovery diode in active clamp or boost circuitry where low Qr and soft recovery prevent cross-conduction losses. Use Value: 66 A non-repetitive surge rating and 150 °C max junction temperature support short-term overload events during system startup or fault recovery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultrafast power diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTH8R06D | 600 V VRRM, 8 A IF(AV), 35 ns trr, TO-220AC (non-isolated) package | Lacks integrated isolation; requires external insulator for heatsink mounting | Select when higher average current is needed and isolation can be implemented externally. |
| IXYS MUR1060CT | 600 V VRRM, 10 A IF(AV), 60 ns trr, TO-220AB (dual common-cathode) package | Slower recovery, higher Qr, and no isolation-suited for lower-frequency, cost-sensitive designs | Choose for legacy 50–100 kHz PFC where softness and isolation are secondary to cost and current rating. |
Compared with STTH8R06D and IXYS MUR1060CT, the BYV25FX-600 uniquely combines certified 2500 V isolation, ultrafast soft recovery, and thermal robustness in a single TO-220F outline-making it optimal for space-constrained, high-reliability PFC where board-level insulation and EMI control are critical.
Availability
BYV25FX-600 is available at Aetrix Electronics and suitable for industrial AC-DC front-ends, telecom rectifier modules, and server-grade PFC circuits requiring stable component supply, long lifecycle support, and certified isolation performance.
Supply support for BYV25FX-600 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in high-performance analog, logic, and power devices for industrial, automotive, and communications markets.
The BYV25FX-600 belongs to NXP's enhanced ultrafast diode product line, engineered specifically for high-efficiency, high-reliability power factor correction in demanding AC-DC conversion systems.
FAQ
What is the maximum junction temperature rating for the BYV25FX-600?
The BYV25FX-600 has a maximum junction temperature (Tj) rating of 150 °C, validated per IEC 60134 limiting values. This allows reliable operation in high-ambient environments such as enclosed server PSUs or industrial enclosures, provided heatsink temperature remains ≤97 °C to sustain the rated 5 A average forward current.
Does the BYV25FX-600 require an insulating pad when mounted to a heatsink?
No-the BYV25FX-600 features an electrically isolated mounting base rated for 2500 V RMS isolation between all pins and the heatsink interface. This eliminates the need for mica or polymer insulating pads, simplifying thermal design and reducing thermal resistance in the path from junction to heatsink.
What is the reverse recovery charge (Qr) specification for the BYV25FX-600?
The BYV25FX-600 specifies a typical recovered charge (Qr) of 13 nC under conditions of IF = 1 A, VR = 30 V, dIF/dt = 100 A/µs, and Tj = 25 °C. This low Qr contributes directly to reduced turn-off losses and lower EMI generation in high-frequency PFC stages.
How does the forward voltage of the BYV25FX-600 change with temperature?
The BYV25FX-600 exhibits a negative temperature coefficient for forward voltage: VF decreases from 1.3 V (typ) at 25 °C to 1.1 V (typ) at 150 °C under 5 A forward current. This behavior supports stable current sharing in parallel configurations and maintains efficiency during thermal transients.
Can the BYV25FX-600 be used in both DCM and CCM PFC topologies?
Yes-the BYV25FX-600 is explicitly qualified for dual-mode (DCM and CCM) Power Factor Correction applications. Its soft recovery characteristic, low Qr, and stable VF across temperature ensure reliable commutation and minimal voltage overshoot in both conduction modes, as confirmed in NXP's application guidance and datasheet Section 1.3.
BYV25FX-600,127 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- TO-220-2 Full Pack
- Packaging:
- Bulk
- Product Status:
- Active
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 600 V
- Current - Average Rectified (Io):
- 5A
- Voltage - Forward (Vf) (Max) @ If:
- 1.9 V @ 5 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 35 ns
- Current - Reverse Leakage @ Vr:
- 50 µA @ 600 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220F
- Operating Temperature - Junction:
- 150°C (Max)
BYV25FX-600,127 FAQ
1.How can I place an order for BYV25FX-600,127 through Aetrix?
Please submit a Request for Quotation (RFQ) for BYV25FX-600,127 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BYV25FX-600,127 reliable?
The price and inventory of BYV25FX-600,127 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BYV25FX-600,127 is usually 5 days.
3.What payment methods are accepted for BYV25FX-600,127?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BYV25FX-600,127 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BYV25FX-600,127?
BYV25FX-600,127 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BYV25FX-600,127 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BYV25FX-600,127?
For technical support, including BYV25FX-600,127 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BYV25FX-600,127 requirements.
6.How does Aetrix verify that BYV25FX-600,127 is sourced from the original manufacturer or authorized distributors?
All BYV25FX-600,127 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BYV25FX-600,127 meets industry standards.
7.What is the process for return or replacement of BYV25FX-600,127?
All BYV25FX-600,127 units undergo pre-shipment inspection (PSI). If there is an issue with BYV25FX-600,127, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BYV25FX-600,127 part is unused and in its original packaging.
Return procedure for BYV25FX-600,127:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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