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Vishay General Semiconductor - Diodes Division BZG04-200TR

Part No.:
BZG04-200TR
Manufacturer:
Vishay General Semiconductor - Diodes Division
Category:
TVS Diodes
Package:
DO-214AC, SMA
Datasheet:
AetrixBZG04-200TR.pdf
Description:
TVS DIODE 200VWM 336VC DO214AC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,595

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Product details

Overview

BZG04-200TR from Vishay Semiconductors is a glass-passivated, surface-mount Zener diode optimized for high-energy transient voltage suppression in power rails and signal lines. It features a 200 V standoff voltage (VR), 228 V minimum breakdown voltage at 2 mA (V(BR)), 336 V clamping voltage at 0.9 A (VCL), 300 W non-repetitive surge power rating (PZSM), and DO-214AC package for industrial-grade reliability.

For engineers reviewing the BZG04-200TR datasheet, BZG04-200TR pinout, BZG04-200TR application, or BZG04-200TR equivalent, this device is selected for overvoltage protection where fast response (≤1 ps), low junction capacitance (122 pF), and high surge current tolerance (50 A IFSM) are critical in DC power supplies, telecom interfaces, and automotive control modules.

Technical Context

The BZG04-200TR operates as a unidirectional voltage-clamping device with a precisely defined Zener breakdown threshold and tightly controlled dynamic impedance. Its glass-passivated junction ensures stable leakage current (IR ≤ 5 µA at VR = 200 V) and long-term parameter stability under thermal cycling.

Designed for transient suppression per IEC 61000-4-5 (10/1000 µs waveform), it delivers 300 W peak surge power dissipation with minimal voltage overshoot due to low clamping ratio (VCL/V(BR) ≈ 1.47) and sub-nanosecond response time, enabling robust protection without sacrificing system speed.

Key Specifications

Parameter Value and Actual Design Meaning
Standoff Voltage (VR) 200 V - Maximum reverse voltage before significant conduction begins; defines operating margin before clamping activation.
Breakdown Voltage (V(BR)) 228 V min @ 2 mA - Guaranteed minimum Zener voltage at test current; sets lower bound for clamping onset.
Clamping Voltage (VCL) 336 V @ 0.9 A - Peak voltage seen across device during 10/1000 µs surge; determines protected circuit's maximum stress level.
Surge Power (PZSM) 300 W - Non-repetitive peak power handling capability; enables survival of high-energy lightning-induced transients.
Junction Capacitance (Cj) 122 pF @ 0 V - Low capacitance minimizes signal distortion and loading on high-speed data lines or RF circuits.
Surge Current (IFSM) 50 A - Peak forward surge current tolerance; supports robustness against accidental polarity reversal or inrush events.
Thermal Resistance (RthJA) 100–150 K/W - Depends on PCB mounting; dictates derating curve and maximum continuous power (1.25–3 W) at ambient temperatures.

Pinout & Package

Package: DO-214AC (SMA), surface-mount, molded plastic case with axial leads trimmed and formed for gull-wing mounting. Approximate weight: 77 mg.

Pin/Terminal Circuit Role Design Meaning
Cathode (Marked Band) High-impedance reference node Connected to protected line; conducts when voltage exceeds V(BR); defines polarity-sensitive clamping direction.
Anode Return path / ground reference Typically tied to system ground or low-impedance return; completes clamping current path during transient events.

Key Features

Feature Design Value
Glass-passivated junction Ensures stable leakage current (<5 µA) and resistance to humidity-induced parameter drift over 10+ year field life.
Fast response time ≤1 ps rise time enables clamping before sensitive downstream ICs experience damaging overvoltage.
Low clamping ratio VCL/V(BR) ≈ 1.47 reduces voltage overshoot during surges, lowering stress on protected MOSFETs or microcontrollers.
RoHS-compliant & lead-free Meets EU Directive 2002/95/EC; compatible with standard Pb-free reflow profiles without solder joint reliability degradation.

Applications

Industrial DC Power Supply Protection Telecom Line Interface Protection

Use Scenario: 24 V/48 V industrial PLC power input subjected to load dump and inductive switching transients.

IC Role / Device Role / Timing Role: Primary shunt clamping element placed across input rail to clamp surges to safe levels before they reach DC-DC converters.

Use Value: Withstands 300 W surges and clamps to 336 V, preventing damage to upstream rectifiers and downstream regulators rated for ≤400 V.

Use Scenario: RS-485 data line exposed to ESD and lightning-induced common-mode surges in outdoor base stations.

IC Role / Device Role / Timing Role: Bidirectional protection pair (with complementary device) limiting differential and common-mode overvoltage on twisted-pair lines.

Use Value: 122 pF capacitance avoids signal integrity loss at 10 Mbps; 50 A IFSM handles multi-kV EFT bursts without degradation.

Automotive Body Control Module Renewable Energy Inverter DC Link

Use Scenario: 12 V battery-supplied BCM experiencing ISO 7637-2 pulse 5a (load dump up to 60 V).

IC Role / Device Role / Timing Role: Standoff-rated Zener placed between battery rail and regulator input to absorb energy beyond TVS diode capability.

Use Value: 200 V VR provides margin above nominal 12 V + load dump; 300 W PZSM sustains multiple pulses without thermal runaway.

Use Scenario: 400 V DC link in solar inverter subject to switching transients and grid fault recovery spikes.

IC Role / Device Role / Timing Role: Secondary clamping stage parallel to main MOV, providing precise voltage limit and faster response than bulk varistors.

Use Value: Tight V(BR) tolerance (228 V min) ensures predictable clamping at 336 V, protecting IGBT gate drivers from overvoltage stress.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener-based transient suppression applications.

Alternative Part Technical Difference Application Difference Selection Advice
SMBJ200A TVS diode (AEC-Q101 qualified), 200 V standoff, 328 V clamping @ 1.2 A, 600 W Ppp, higher capacitance (170 pF) Designed for automotive-grade repetitive surge immunity; requires tighter layout for thermal management Select SMBJ200A when AEC-Q101 qualification and higher average power handling are required; not drop-in due to different VCL and thermal profile.
P6KE200A Through-hole DO-15 package, 200 V standoff, 324 V clamping @ 1.2 A, 600 W Ppp, slower response (~1 ns) Legacy design compatibility; unsuitable for high-density SMT layouts or automated assembly Choose P6KE200A only for through-hole prototyping or legacy board refresh; BZG04-200TR offers superior SMT reliability and smaller footprint.

Compared with SMBJ200A and P6KE200A, the BZG04-200TR delivers lower clamping voltage (336 V vs. ≥324 V), faster response (≤1 ps vs. ~1 ns), and DO-214AC SMT compatibility-making it optimal for space-constrained, high-reliability industrial and telecom designs where precise voltage limiting and rapid transient capture are essential.

Availability

BZG04-200TR is available at Aetrix Electronics and suitable for industrial DC power supply protection, telecom line interface protection, and automotive body control module applications requiring stable component supply, RoHS compliance, and consistent surge performance across production batches.

Supply support for BZG04-200TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Semiconductors is a global leader in discrete semiconductors, specializing in high-reliability passive and active components for industrial, automotive, and computing markets.

The BZG04-Series was developed specifically for high-energy transient suppression in harsh environments, emphasizing glass-passivated junction stability, tight voltage tolerances, and robust surge survivability in compact SMT packages.

FAQ

What is the maximum continuous power dissipation for BZG04-200TR at 50 °C ambient?

The BZG04-200TR supports 1.25 W continuous power dissipation when mounted on epoxy-glass hard tissue with RthJA = 100 K/W and ambient temperature of 50 °C. This value assumes proper PCB copper area and thermal vias; exceeding this rating risks junction temperature exceeding 150 °C and permanent degradation. Always verify thermal design using the BZG04-200TR's published RthJA curves and actual board layout.

Does BZG04-200TR meet RoHS and lead-free soldering requirements?

Yes, the BZG04-200TR is lead (Pb)-free and compliant with RoHS Directive 2002/95/EC and WEEE 2002/96/EC. It is qualified for standard Pb-free reflow profiles (peak temperature ≤ 260 °C, 10-second dwell), and its glass-passivated construction prevents intermetallic formation or solder joint embrittlement during repeated thermal cycles.

What is the typical junction capacitance of BZG04-200TR and how does it affect high-speed signal lines?

The BZG04-200TR has a typical junction capacitance of 122 pF at 0 V bias. At 1 MHz, this value remains stable and introduces minimal loading on signal lines operating below 10 Mbps. For higher-speed interfaces (e.g., USB 2.0 or CAN FD), designers should verify eye diagram integrity and consider series impedance matching to mitigate capacitive coupling effects introduced by the BZG04-200TR.

Can BZG04-200TR be used in bidirectional transient protection configurations?

No, the BZG04-200TR is a unidirectional Zener diode and conducts only in reverse breakdown. For bidirectional protection (e.g., RS-485 or AC lines), two BZG04-200TR devices must be connected in series opposition (anode-to-anode), or a dedicated bidirectional TVS like SMBJ200CA should be selected. Using a single BZG04-200TR in AC applications risks forward conduction and failure.

How does the 300 W surge rating of BZG04-200TR relate to real-world IEC 61000-4-5 testing?

The 300 W non-repetitive surge power rating (PZSM) of the BZG04-200TR corresponds to a 10/1000 µs waveform with peak current of 0.9 A delivering 336 V clamping. This meets Level 4 (4 kV) IEC 61000-4-5 common-mode surge testing when properly mounted on adequate copper area. Multiple surges require thermal recovery time; the BZG04-200TR is not rated for repetitive operation at full PZSM.

BZG04-200TR Specifications

Product attributes
Attribute value
Manufacturer:
Vishay General Semiconductor - Diodes Division
Package/Case:
DO-214AC, SMA
Series:
BZG04
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Zener
Unidirectional Channels:
1
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
200V
Voltage - Breakdown (Min):
228V
Voltage - Clamping (Max) @ Ipp:
336V
Current - Peak Pulse (10/1000µs):
900mA
Power - Peak Pulse:
300W
Power Line Protection:
No
Applications:
-
Capacitance @ Frequency:
122pF @ 1MHz
Operating Temperature:
-
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
DO-214AC (SMA)

BZG04-200TR FAQ

1.How can I place an order for BZG04-200TR through Aetrix?

Please submit a Request for Quotation (RFQ) for BZG04-200TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BZG04-200TR reliable?

The price and inventory of BZG04-200TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BZG04-200TR is usually 5 days.

3.What payment methods are accepted for BZG04-200TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BZG04-200TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BZG04-200TR?

BZG04-200TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BZG04-200TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BZG04-200TR?

For technical support, including BZG04-200TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BZG04-200TR requirements.

6.How does Aetrix verify that BZG04-200TR is sourced from the original manufacturer or authorized distributors?

All BZG04-200TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BZG04-200TR meets industry standards.

7.What is the process for return or replacement of BZG04-200TR?

All BZG04-200TR units undergo pre-shipment inspection (PSI). If there is an issue with BZG04-200TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BZG04-200TR part is unused and in its original packaging.

Return procedure for BZG04-200TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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