Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Circuit Protection > Transient Voltage Suppressors (TVS) > TVS Diodes

STMicroelectronics CBTVS2A16-1F3

Name: CBTVS2A16-1F3
Brand: STMicroelectronics
SKU: CBTVS2A16-1F3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: CBTVS2A16-1F3

Manufacturer:: STMicroelectronics

Category:: TVS Diodes

Package:: 4-UFBGA, FCBGA

Datasheet:: CBTVS2A16-1F3.pdf

Description:: TVS DIODE 19VC 4FLIPCHIP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:7,288

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

CBTVS2A16-1F3 from STMicroelectronics is a unidirectional flip-chip transient voltage suppressor (TVS) with integrated non-resettable overcurrent protection (OCP), designed for ESD/OVP/OCP co-protection on single-line power rails in portable electronics. It features 16 V breakdown voltage (V_BR), 19 V clamping voltage (V_CL) at 1 A, 70 W peak pulse power (10/1000 µs), and ultra-thin 0.5 mm profile.

For engineers reviewing the CBTVS2A16-1F3 datasheet, CBTVS2A16-1F3 pinout, CBTVS2A16-1F3 application, or CBTVS2A16-1F3 equivalent, key selection criteria include its fused TVS architecture, 50 mΩ pre-fuse resistance, 125 pF line capacitance at 1 MHz, IEC 61000-4-2 ±15 kV air/±8 kV contact ESD compliance, and 100 ms maximum fuse opening time at 5 A.

Technical Context

This device integrates a silicon TVS diode and a fusible metal trace in a monolithic flip-chip die, enabling simultaneous overvoltage clamping and irreversible overcurrent interruption on the same signal path. Its A1–A2 terminals form the current-carrying fuse path, while A1–B1 and A2–B2 define the TVS clamping path across GND.

The 4-bump flip-chip configuration requires B1 and B2 to be jointly grounded on PCB, establishing a low-inductance return path critical for high-speed ESD suppression. Clamping occurs between A1–B1 (or A2–B2) with typical V_CL = 19 V at 1 A (8/20 µs), and fuse activation is triggered by sustained DC current ≥2 A for >1000 hours or ≥5 A within 100 ms.

Key Specifications

Parameter	Value and Actual Design Meaning
V_BR	16 V @ I_R = 20 mA - precise standoff threshold before avalanche conduction begins
V_CL	19 V @ I_PP = 1 A (8/20 µs) - limits transient voltage seen by downstream ICs
R_A1–A2 (pre-fuse)	50 mΩ @ 100 mA - minimal insertion loss for battery charging paths
C_line	125 pF @ 1 MHz, V_R = 0 V - preserves signal integrity on high-speed USB/charger lines
T_fuse (max)	100 ms @ 5 A - fast thermal cutoff prevents damage during short-circuit faults
ESD rating	IEC 61000-4-2 Level 4: ±15 kV air / ±8 kV contact - meets industrial handheld requirements
Package height	0.5 mm - enables placement under thin bezels or stacked PCB assemblies

Pinout & Package

CBTVS2A16-1F3 uses a 4-bump flip-chip package (ECOPACK® compliant, lead-free, 400 µm pitch). Dimensions: 0.77 mm × 0.77 mm die area, 185 µm bump diameter, 255 µm bump-to-bump spacing. B1 and B2 must be connected together to GND on PCB.

Pin/Terminal	Circuit Role	Design Meaning
A1	Fuse input / TVS anode	Connects to charger input or protected line; carries full load current until fuse opens
A2	Fuse output / TVS anode	Connects to power management unit (PMU); isolates downstream circuit after fuse blow
B1	TVS cathode / GND	Must be soldered to common GND plane with B2; forms low-inductance clamping return path
B2	TVS cathode / GND	Must be soldered to common GND plane with B1; ensures symmetric current sharing during ESD events

Key Features

Feature	Design Value
Integrated fuse + TVS in single die	Eliminates discrete fuse+TVS layout area and interconnect inductance, reducing board space by >40% vs. dual-component solutions
Low clamping factor (V_CL/V_BR = 1.19)	Minimizes voltage overshoot during transients, protecting 1.8 V/3.3 V PMU inputs without derating
125 pF line capacitance	Enables use on 480 Mbps USB 2.0 data lines or 5 V USB-C charger inputs without signal degradation
0.5 mm profile	Permits placement beneath mechanical buttons or display modules in <8 mm total thickness devices
Non-resettable OCP	Provides fail-safe open-circuit isolation after overcurrent event, preventing fire risk in Li-ion battery systems

Applications

USB-C Charger Input Protection

Smartphone PMU Input Protection

Use Scenario: Protects USB-C port against ESD strikes, hot-plug surges, and adapter short circuits.

IC Role / Device Role / Timing Role: Acts as first-line co-protection element between connector and PMU, clamping transients and fusing on sustained overcurrent.

Use Value: Prevents PMU latch-up or destruction from ±8 kV contact ESD and 5 A short-circuit faults, meeting IEC 61000-4-2 and UL 62368-1.

Use Scenario: Shields battery charging circuitry from reverse polarity, overvoltage, and electrostatic discharge.

IC Role / Device Role / Timing Role: Serves as fused rail protector on VBUS input to buck-boost charger IC, combining OVP clamping and OCP interruption.

Use Value: Enables single-component replacement of discrete TVS + polyfuse, reducing BOM count and improving ESD response time by 300 ps.

Wearable Device Battery Line Protection

Tablet Power Button Circuit Protection

Use Scenario: Secures Li-ion battery connection in compact wearables exposed to daily ESD events.

IC Role / Device Role / Timing Role: Placed inline on battery feed to system PMIC, providing simultaneous ESD suppression and overcurrent cutoff.

Use Value: Maintains 50 mΩ on-resistance for efficient charging while guaranteeing open-circuit failure mode during fault conditions.

Use Scenario: Guards mechanical power button traces from user-induced ESD and accidental shorting.

IC Role / Device Role / Timing Role: Installed on button sense line to MCU, absorbing ±15 kV air discharge and limiting leakage to 100 nA at 12 V.

Use Value: Preserves low-power sleep current budget (<1 µA) while ensuring reliable button operation after repeated ESD exposure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar fused TVS protection applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CBTVS2A16-1F4	Same die, 0.65 mm height package - 0.15 mm taller than -1F3	Suitable where PCB assembly tolerance allows greater Z-height; identical electrical specs	Select when stencil thickness or reflow profile favors higher bump standoff
SM712-TR	Discrete bidirectional TVS only (no fuse); 12 V V_BR, 25 V V_CL, 150 pF	Requires external fuse; higher clamping voltage and capacitance limit USB 2.0 use	Choose only if fused protection is handled separately and lower cost outweighs integration benefit

Compared with CBTVS2A16-1F4, the -1F3 offers tighter height control for ultra-thin designs; versus SM712-TR, it eliminates layout complexity and timing uncertainty of discrete fuse+TVS coordination, delivering deterministic single-event fault isolation.

Availability

CBTVS2A16-1F3 is available at Aetrix Electronics and suitable for USB-C charger input protection, smartphone PMU input protection, and wearable battery line protection requiring stable component supply and guaranteed ECOPACK® compliance.

Supply support for CBTVS2A16-1F3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and protection devices for automotive, industrial, and consumer markets.

CBTVS2A16-1F3 belongs to ST's CBTVS family of fused TVS diodes, engineered specifically to replace discrete fuse+TVS combinations in space-constrained portable electronics where co-location, low inductance, and fail-safe isolation are mandatory.

FAQ

What is the fuse trip current and time profile for CBTVS2A16-1F3?

The fuse opens irreversibly at 5 A within 100 ms maximum (T_fuse), and withstands 2 A continuous DC current for 1000 hours at 25 °C. At 3.2 A, it opens after 24 hours (T_fuse2). These values are measured across A1–A2 terminals under specified thermal conditions and define its overcurrent protection envelope.

Can CBTVS2A16-1F3 be used on bidirectional signal lines?

No. CBTVS2A16-1F3 is a unidirectional device optimized for DC power rails like VBUS or battery feeds. Its asymmetric structure (A1/A2 as anode, B1/B2 as cathode/GND) does not support reverse-biased operation. For bidirectional data lines, ST recommends standalone TVS arrays such as ESDALC6V1-1U2.

How is grounding implemented for optimal ESD performance?

B1 and B2 bumps must be connected together to a low-impedance, solid GND plane on the PCB - not via vias or narrow traces. This joint grounding minimizes loop inductance and ensures symmetrical current division during ESD events, achieving the specified ±8 kV contact discharge robustness per IEC 61000-4-2.

Does the device retain TVS functionality after the fuse opens?

No. Once the A1–A2 fuse opens, the TVS path between A1–B1 and A2–B2 becomes electrically disconnected. The device ceases all protection functions - both overvoltage clamping and ESD suppression - and presents an open circuit. This fail-safe behavior prevents latent faults in safety-critical battery systems.

CBTVS2A16-1F3 Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Package/Case:: 4-UFBGA, FCBGA

Series:: -

Packaging:: Tape & Reel (TR)

Product Status:: Active

Type:: -

Unidirectional Channels:: 1

Bidirectional Channels:: -

Voltage - Reverse Standoff (Typ):: -

Voltage - Breakdown (Min):: 16V

Voltage - Clamping (Max) @ Ipp:: 19V

Current - Peak Pulse (10/1000µs):: -

Power - Peak Pulse:: 70W

Power Line Protection:: No

Applications:: General Purpose

Capacitance @ Frequency:: 125pF @ 1MHz

Operating Temperature:: 125°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 4-FlipChip (0.77x0.77)

CBTVS2A16-1F3 FAQ

1.How can I place an order for CBTVS2A16-1F3 through Aetrix?

Please submit a Request for Quotation (RFQ) for CBTVS2A16-1F3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CBTVS2A16-1F3 reliable?

The price and inventory of CBTVS2A16-1F3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CBTVS2A16-1F3 is usually 5 days.

3.What payment methods are accepted for CBTVS2A16-1F3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CBTVS2A16-1F3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CBTVS2A16-1F3?

CBTVS2A16-1F3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CBTVS2A16-1F3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CBTVS2A16-1F3?

For technical support, including CBTVS2A16-1F3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CBTVS2A16-1F3 requirements.

6.How does Aetrix verify that CBTVS2A16-1F3 is sourced from the original manufacturer or authorized distributors?

All CBTVS2A16-1F3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CBTVS2A16-1F3 meets industry standards.

7.What is the process for return or replacement of CBTVS2A16-1F3?

All CBTVS2A16-1F3 units undergo pre-shipment inspection (PSI). If there is an issue with CBTVS2A16-1F3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CBTVS2A16-1F3 part is unused and in its original packaging.

Return procedure for CBTVS2A16-1F3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-11 Comparator Circuit: Voltage Thresholds, Op-Amp Differences, LM393 and Practical Design

Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.

2026-09-10 Schmitt Trigger Explained: Hysteresis, Circuits, Inverters and Applications

Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…

2026-09-09 Counterfeit Electronic Components: How to Detect, Authenticate, and Test Suspect Parts

Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …