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Toshiba Semiconductor and Storage CCS15S30,L3F

Part No.:
CCS15S30,L3F
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Single Diodes
Package:
2-SMD, No Lead
Datasheet:
AetrixCCS15S30,L3F.pdf
Description:
DIODE SCHOTTKY 20V 1.5A CST2C
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:29,761

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Product details

Overview

CCS15S30 from Toshiba Electronic Devices & Storage Corporation is a silicon epitaxial Schottky barrier diode optimized for high-speed switching in low-voltage DC-DC converters and power management circuits, featuring a typical forward voltage of 0.33 V at 1 A, 30 V peak reverse voltage rating, and 1.5 A average rectified current capability.

For engineers reviewing the CCS15S30 datasheet, CCS15S30 pinout, CCS15S30 application, or CCS15S30 equivalent, key selection considerations include its low VF for reduced conduction loss, low junction capacitance (200 pF) for fast switching, thermal derating guidance per Toshiba Reliability Handbook, and CST2C package compatibility with space-constrained PCB layouts.

Technical Context

The CCS15S30 implements a planar Schottky junction structure on silicon epitaxial substrate to achieve low forward voltage and fast recovery without minority-carrier storage delay. Its 30 V VRM rating targets 24 V system rails and buck converter freewheeling paths.

Thermal design must account for higher reverse leakage versus PN diodes-Toshiba specifies IR ≤ 0.5 mA at VR = 30 V and warns of thermal runaway risk under simultaneous high temperature and high reverse bias conditions.

Key Specifications

ParameterValue and Actual Design Meaning
Peak Reverse Voltage30 V - supports 24 V nominal input systems with margin for transient spikes
Forward Voltage (VF)0.33 V typ. at IF = 1 A - reduces conduction loss and heat generation in high-current paths
Average Rectified Current1.5 A - enables use in compact 1–2 W DC-DC output stages without forced cooling
Junction Temperature125 °C max - requires thermal pad layout per FR4 board spec (645 mm² Cu area)
Total Capacitance200 pF at VR = 0 V, f = 1 MHz - limits high-frequency switching noise and EMI in SMPS designs
Reverse Current0.2 mA typ. at VR = 30 V - necessitates careful thermal management to avoid leakage-driven thermal runaway

Pinout & Package

CCS15S30 is housed in the CST2C surface-mount package (TOSHIBA designation: 1-1W1S), a 2-pin ultra-small plastic molded case measuring 1.2 × 0.8 × 0.5 mm with 1.9 mg typical weight. The package uses a single-side electrode configuration optimized for automated placement and reflow soldering.

Pin/TerminalCircuit RoleDesign Meaning
1CathodeConnected to higher-potential node in freewheeling path; carries full load current during switch-off phase
2AnodeConnected to lower-potential node (e.g., ground or switch node); polarity-sensitive for correct rectification

Key Features

FeatureDesign Value
Low Forward Voltage0.33 V typ. at 1 A enables >95% efficiency in 3.3–5 V buck converters at light-to-moderate loads
Ultra-Small PackageCST2C footprint (1.2 × 0.8 mm) saves >60% board area versus SOD-123 while maintaining thermal performance via exposed cathode pad
Fast SwitchingNo minority-carrier storage enables sub-nanosecond reverse recovery-critical for >1 MHz switching frequencies
Controlled LeakageIR ≤ 0.5 mA at 30 V allows predictable thermal modeling when combined with FR4 board thermal relief guidelines

Applications

DC-DC Buck Converter Output StageUSB Power Delivery Clamp

Use Scenario: Freewheeling diode in 5 V/1.2 A synchronous buck regulator for portable SSDs.

IC Role / Device Role: Low-loss return path during high-side FET off-time; replaces active sync rectifier where cost sensitivity dominates.

Use Value: 0.33 V VF cuts conduction loss by ~40% vs. standard PN diode, reducing thermal stress on 2-layer PCB.

Use Scenario: Reverse-polarity protection and overvoltage clamping on USB-C VBUS line.

IC Role / Device Role: Low-capacitance clamp diode limiting transient overshoot to <33 V during hot-plug events.

Use Value: 200 pF Ct minimizes signal distortion on 10 Gbps USB3.2 Gen2x2 lanes while handling 5 A surge peaks.

Automotive Body Control Module (BCM) LDO InputIndustrial Sensor Node Power Rail

Use Scenario: Input protection diode upstream of 3.3 V LDO supplying CAN transceiver and microcontroller.

IC Role / Device Role: Prevents backfeed from LDO output during main supply dropout; withstands 12 V battery transients.

Use Value: 30 V VRM and 5 A IFSM rating ensure survival during load-dump events per ISO 7637-2 Pulse 5a.

Use Scenario: Polarity protection and hold-up diode in battery-backed 3.3 V rail for LoRaWAN sensor node.

IC Role / Device Role: Blocks reverse current from supercapacitor during main supply failure; maintains clean 3.3 V during brownout.

Use Value: 1.5 A IO rating supports 10-second hold-up at 500 mA load; low VF preserves energy in low-power sleep mode.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
RBS2MM30T3GHigher VF (0.45 V typ. at 1 A), same 30 V VRM, SOD-523 package (1.3 × 0.85 mm)Larger footprint and 15% higher conduction loss reduce suitability for ultra-thin portable designsSelect when legacy SOD-523 placement is fixed and 0.12 V VF penalty is acceptable
NSR0230P2T5GLower IO (0.2 A), same VF (0.33 V), smaller X1-DFN package (1.0 × 0.6 mm)Inadequate for >0.3 A continuous current; limited to signal-level clamping or bias networksChoose only for space-critical signal integrity roles-not power rectification

Compared with RBS2MM30T3G and NSR0230P2T5G, the CCS15S30 uniquely balances 1.5 A current capacity, 0.33 V VF, and CST2C size-making it the only option among the three viable for 1 A+ DC-DC freewheeling in sub-2 mm² footprints.

Availability

CCS15S30 is available at Aetrix Electronics and suitable for high-speed switching, USB power delivery protection, and automotive body control module applications requiring stable component supply across extended production lifecycles.

Supply support for CCS15S30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on reliability, miniaturization, and automotive-grade qualification.

The CCS15S30 belongs to Toshiba's CST2C-series Schottky diodes, engineered specifically for space-constrained, high-efficiency DC-DC conversion in consumer, industrial, and automotive power supplies.

FAQ

What is the maximum average current rating for CCS15S30 under standard PCB conditions?

The CCS15S30 is rated for 1.5 A average rectified current when mounted on an FR4 board with 645 mm² copper pad area per Toshiba's Absolute Maximum Ratings specification. This assumes Ta = 25 °C and derating applies above 25 °C ambient-consult Toshiba's Reliability Handbook for thermal resistance curves and safe operating area boundaries specific to the CCS15S30.

Does CCS15S30 have a specified reverse recovery time (trr)?

No-CCS15S30 is a Schottky barrier diode and does not specify reverse recovery time (trr) because it lacks minority-carrier storage. Toshiba characterizes its switching speed via junction capacitance (Ct = 200 pF at 0 V) and forward voltage transient response. For high-frequency SMPS designs, this enables near-instantaneous turn-off without tail current, unlike PN-junction diodes.

What is the marking code printed on the CCS15S30 package?

The CCS15S30 is marked with the code "74" on its top surface, as confirmed in Toshiba's official datasheet Rev.4.0.B section 6.1. This two-character laser marking identifies the device within Toshiba's CST2C package family and corresponds exclusively to the CCS15S30 part number-not interchangeable with other "74"-marked variants.

Can CCS15S30 be used in automotive under-hood applications?

The CCS15S30 has a storage temperature range of −55 to +125 °C and junction temperature limit of 125 °C, but Toshiba explicitly excludes automotive under-hood use in its Restrictions on Product Use statement. It is not AEC-Q101 qualified, and thermal runaway risk under high VR/high Tj conditions makes it unsuitable for uncontrolled engine compartment environments without additional derating and validation.

How does the CST2C package of CCS15S30 compare thermally to SOD-123?

The CST2C package (1.2 × 0.8 mm) of CCS15S30 provides comparable thermal resistance to SOD-123 when using identical 645 mm² copper pads, despite its smaller footprint-achieved via optimized internal thermal path and exposed cathode metallization. Toshiba's datasheet confirms equivalent θJA under the same FR4 board conditions, enabling direct replacement where board space is constrained.

CCS15S30,L3F Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
-
Package/Case:
2-SMD, No Lead
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
20 V
Current - Average Rectified (Io):
1.5A
Voltage - Forward (Vf) (Max) @ If:
400 mV @ 1 A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
-
Current - Reverse Leakage @ Vr:
500 µA @ 30 V
Capacitance @ Vr, F:
200pF @ 0V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
CST2C
Operating Temperature - Junction:
125°C (Max)

CCS15S30,L3F FAQ

1.How can I place an order for CCS15S30,L3F through Aetrix?

Please submit a Request for Quotation (RFQ) for CCS15S30,L3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CCS15S30,L3F reliable?

The price and inventory of CCS15S30,L3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CCS15S30,L3F is usually 5 days.

3.What payment methods are accepted for CCS15S30,L3F?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CCS15S30,L3F transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CCS15S30,L3F?

CCS15S30,L3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CCS15S30,L3F order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CCS15S30,L3F?

For technical support, including CCS15S30,L3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CCS15S30,L3F requirements.

6.How does Aetrix verify that CCS15S30,L3F is sourced from the original manufacturer or authorized distributors?

All CCS15S30,L3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CCS15S30,L3F meets industry standards.

7.What is the process for return or replacement of CCS15S30,L3F?

All CCS15S30,L3F units undergo pre-shipment inspection (PSI). If there is an issue with CCS15S30,L3F, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CCS15S30,L3F part is unused and in its original packaging.

Return procedure for CCS15S30,L3F:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CCS15S30,L3F Tags

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