Microchip Technology CEC1734-S0-I/2HW-TCSM

Overview

CEC1734-S0-I/2HW-TCSM from Microchip Technology is a Real Time Platform Root of Trust controller for server and embedded computing systems, integrating an ARM® Cortex-M4F core at up to 96 MHz, 384 KB SRAM (320 KB code + 64 KB data), 2 MB in-package SPI Flash, and dual-voltage (1.8 V / 3.3 V) SPI host interface. It delivers secure boot with SHA-384/ECC384, active SPI flash monitoring, and hardware crypto acceleration for AES-256, SHA-2, and ECDSA.

For engineers reviewing the CEC1734-S0-I/2HW-TCSM datasheet, CEC1734-S0-I/2HW-TCSM pinout, CEC1734-S0-I/2HW-TCSM application, or CEC1734-S0-I/2HW-TCSM equivalent, key selection criteria include single-channel SPI flash monitoring capability, 64-pin VFBGA package with VTR1-only I/O voltage domain, 32 kHz RTC timer operation across sleep states, and TCG DICE-compliant immutable ROM-based root of trust.

Technical Context

The CEC1734-S0-I/2HW-TCSM implements a dedicated SPI Flash Monitor block for one host channel (BMC or CPU), performing real-time hash verification (SHA-256/SHA-384) on 8 KB match regions and enforcing access rules via internal QSPI analog switches. Its security architecture relies on Boot ROM–based secure boot, fused life cycle management, and hardware-accelerated public-key operations (ECC384, RSA up to 4096 bits).

Power management includes Light Sleep and Heavy Sleep modes with sub-μA standby current, wake-up support from GPIO, UART, timers, and I²C events, and runtime operation from VTR_REG (3.3 V) and VTR1 (1.8 V / 3.3 V configurable) power domains - no VTR2 pins present in this 64-pin variant.

Key Specifications

Pinout & Package

CEC1734-S0-I/2HW-TCSM uses a 64-pin Very Thin Fine-Pitch Ball Grid Array (VFBGA) package measuring 5 mm × 5 mm × 0.65 mm, with 0.4 mm ball pitch and bottom-side thermal pad. I/O is organized into VTR_REG (core 3.3 V), VTR1 (SPI0 bus voltage), and analog domains - no VTR2 pins are present.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar embedded controller security applications.

Compared with CEC1734-S0-I/2ZW and MAX32570, the CEC1734-S0-I/2HW-TCSM uniquely combines single-channel hardware-enforced SPI flash monitoring, 2 MB integrated flash, and TCG DICE-compliant attestation in a compact 64-pin VFBGA - optimized for cost-sensitive, single-host BMC implementations.

Availability

CEC1734-S0-I/2HW-TCSM is available at Aetrix Electronics and suitable for server BMC, telecom equipment, industrial gateways, and embedded computing platforms requiring stable component supply, long-term lifecycle support, and certified root-of-trust functionality.

Supply support for CEC1734-S0-I/2HW-TCSM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and security ICs, serving automotive, industrial, communications, and computing markets with silicon, software, and development tools.

The CEC173x family is designed as Real Time Platform Root of Trust controllers for servers, telecom infrastructure, and embedded systems - delivering hardware-enforced firmware integrity, cryptographic acceleration, and DICE-compliant attestation in a single chip.

FAQ

What is the primary security function of the CEC1734-S0-I/2HW-TCSM?

The CEC1734-S0-I/2HW-TCSM provides hardware-enforced SPI flash monitoring and secure boot via its immutable Boot ROM. It authenticates firmware images using SHA-384/ECC384 before loading, performs real-time hash verification during host boot, and intervenes on illegal flash operations (e.g., erase, write) using dedicated QSPI analog switches - all implemented in the CEC1734-S0-I/2HW-TCSM's single SPI Monitor block.

Does the CEC1734-S0-I/2HW-TCSM support dual-host SPI flash monitoring?

No. The CEC1734-S0-I/2HW-TCSM is the 64-pin variant with a single SPI Flash Monitor block, intended for one host (e.g., BMC only). Dual-monitor capability requires the 84-pin CEC1734-S0-I/2ZW package. This distinction is confirmed in Table 1-1 of the datasheet, which lists "Single" under SPI-Flash Monitor for CEC1734-S0-I/2HW and "Dual" for CEC1734-S0-I/2ZW.

What voltage levels does the CEC1734-S0-I/2HW-TCSM support for SPI interface operation?

The CEC1734-S0-I/2HW-TCSM supports both 3.3 V and optional 1.8 V SPI interface voltages, configurable per the VTR1 power domain. Its GPIOs assigned to SPI functions (e.g., QSPI0_IO0–QSPI0_IO3, QSPI0_CLK) operate at the VTR1 rail voltage, which may be set to either level - enabling interoperability with legacy 3.3 V or modern low-voltage 1.8 V flash devices without level-shifting circuitry.

How does the CEC1734-S0-I/2HW-TCSM handle power management during system idle?

The CEC1734-S0-I/2HW-TCSM automatically enters its lowest power state during normal operation and supports two configurable sleep modes: Light Sleep and Heavy Sleep. In both, the 32 kHz RTOS timer remains active and can generate wake events. Wake sources include GPIO edges, UART activity, I²C transactions, and timer expiration - all managed by hardware without CPU intervention, ensuring sub-μA standby current in Heavy Sleep mode.

Is the CEC1734-S0-I/2HW-TCSM compatible with TCG DICE and SPDM standards?

Yes. The CEC1734-S0-I/2HW-TCSM implements TCG DICE in immutable Boot ROM code, generating a Device Identity (CDI) and supporting SPDM-based attestation in its EC firmware. This enables standardized remote verification of platform integrity, with measurement reporting and certificate exchange - fully documented in the CEC173x datasheet sections on Life Cycle Management and Attestation.