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Microchip Technology CEC1734-S0-I/2ZW-TCSM

Part No.:
CEC1734-S0-I/2ZW-TCSM
Manufacturer:
Microchip Technology
Category:
Application Specific Microcontrollers
Package:
84-WFBGA
Datasheet:
AetrixCEC1734-S0-I/2ZW-TCSM.pdf
Description:
TRUSTCUSTOM 2-CHANNEL PFR WITH 4
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,905

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Product details

Overview

CEC1734-S0-I/2ZW-TCSM from Microchip Technology is a real-time platform root of trust controller for server, telecom, and industrial embedded systems. It integrates an ARM® Cortex-M4F core (96 MHz), 384 KB SRAM (320 KB code + 64 KB data), dual SPI flash monitoring blocks, hardware crypto accelerators (AES-256, SHA-384, ECDSA, PUF), and operates at 3.3 V with -40°C to +85°C temperature range - deployed as a secure boot and runtime integrity monitor between BMC and CPU host processors.

For engineers reviewing the CEC1734-S0-I/2ZW-TCSM datasheet, CEC1734-S0-I/2ZW-TCSM pinout, CEC1734-S0-I/2ZW-TCSM application, or CEC1734-S0-I/2ZW-TCSM equivalent, key selection criteria include dual QSPI channel isolation capability, TCG DICE compliance, SPI flash intervention enforcement, and support for 1.8 V/3.3 V I/O voltage domains on VTR1/VTR2 power wells.

Technical Context

The CEC1734-S0-I/2ZW-TCSM implements two independent SPI flash monitor blocks - one per host (BMC and CPU) - each with dedicated 64 KB match RAM, real-time hash calculation (SHA-256/SHA-384) on 8 KB regions, and QSPI analog switch isolation. It uses dual runtime power wells (VTR1/VTR2) to independently supply SPI interface logic at either 1.8 V or 3.3 V, enabling coexistence with heterogeneous flash devices.

Its immutable Boot ROM enforces CNSA-compliant secure boot (SHA-384/ECC384), supports AES-256 encrypted SPI flash images, and implements life cycle management via fused OTP bits. The device delivers SPDM-based attestation, key revocation, rollback protection, and DICE-compliant CDI generation - all rooted in ROM-resident immutable code.

Key Specifications

Parameter Value and Actual Design Meaning
Core Processor ARM Cortex-M4F @ 96 MHz with FPU and NVIC supporting 8 priority levels
Memory 384 KB SRAM (320 KB code + 64 KB data); 8 Kbit OTP; 4 MB in-package SPI flash
SPI Monitoring Dual-channel SPI flash monitoring with real-time intervention, 64 KB match RAM per channel
Crypto Acceleration AES-128/192/256, SHA-256/384/512, ECDSA/P-384, RSA up to 4096-bit, DRNG with NIST SP800-90B compliance
Package & I/O 84-pin WFBGA; dual 1.8 V/3.3 V configurable I/O banks (VTR1/VTR2); 71 GPIOs with glitch/UV protection
Security Compliance TCG DICE (immutable ROM), NIST 800-193 PFR, CNSA, SPDM attestation, fused life cycle management
Power Management Light Sleep and Heavy Sleep modes; always operates in lowest power state during normal operation

Pinout & Package

CEC1734-S0-I/2ZW-TCSM is housed in an 84-pin WFBGA package (2ZW variant), supporting dual SPI flash monitoring with dedicated QSPI I/O banks for BMC and CPU channels. VTR1 and VTR2 power wells enable independent 1.8 V/3.3 V I/O voltage configuration per host interface.

Pin/Terminal Circuit Role Design Meaning
GPIO055 / SPIMON_QSPI0_CS0# SPI Monitor Channel 0 Chip Select Asserted during BMC flash access; triggers real-time signature verification and intervention
GPIO124 / SPIMON_QSPI1_CS0# SPI Monitor Channel 1 Chip Select Asserted during CPU flash access; enables parallel, isolated integrity enforcement
GPIO020 / QSPI0_IN_CS0# BMC Flash Input Chip Select Direct connection to BMC SPI flash device; monitored by Channel 0 SPI filter
GPIO071 / QSPI1_IN_CS0# CPU Flash Input Chip Select Direct connection to CPU SPI flash device; monitored by Channel 1 SPI filter
VTR1 / VTR2 Independent I/O Power Wells VTR1 powers BMC-side QSPI I/O (e.g., GPIO020–GPIO023); VTR2 powers CPU-side QSPI I/O (e.g., GPIO070–GPIO071)
GPIO156 / LED0 & GPIO157 / LED1 Breathing LED Outputs Programmable blink/breathe waveforms for status indication; operational in all EC sleep states

Key Features

Feature Design Value
Dual SPI Flash Monitoring Two independent hardware monitors with 64 KB match RAM each, enabling concurrent BMC/CPU firmware integrity enforcement
QSPI Analog Switch Isolation Hardware-level isolation between hosts and flash devices prevents unauthorized read/write/erase during runtime
TCG DICE Root of Trust Immutable ROM-based DICE implementation generates cryptographically bound CDI for chain-of-trust attestation
Fused Life Cycle Management OTP-controlled security state transitions (dev/test/prod) enforce phase-appropriate access to PUF, keys, and debug interfaces
SPDM Attestation Support EC_FW implements SPDM responder commands returning certificates and runtime measurements for remote platform verification

Applications

Server BMC Integrity Enforcement Telecom Baseband Controller Security

Use Scenario: Enforcing firmware integrity during BMC boot and runtime in dual-socket x86 servers.

IC Role / Device Role / Timing Role: Real-time SPI flash monitor acting as hardware-enforced gatekeeper between BMC SoC and its boot flash.

Use Value: Prevents malicious firmware persistence by detecting and blocking illegal opcodes (e.g., chip erase) before execution, using per-channel 64 KB match RAM and SHA-384 hashing.

Use Scenario: Securing boot and update paths for distributed baseband units in 5G RAN infrastructure.

IC Role / Device Role / Timing Role: Platform root of trust controller validating signed firmware images and enforcing cryptographic rollback protection across field-upgradable modules.

Use Value: Enables NIST 800-193 PFR-compliant recovery from compromised firmware via authenticated fallback image loading from internal 4 MB SPI flash.

Industrial Edge Gateway Trust Anchor Network Equipment Secure Boot Manager

Use Scenario: Providing hardware-rooted attestation and secure boot for time-sensitive industrial edge gateways with dual host processors.

IC Role / Device Role / Timing Role: TCG DICE-compliant RoT generating CDI for SPDM-based remote verification of firmware health and configuration state.

Use Value: Delivers cryptographically verifiable evidence of boot integrity and runtime behavior to cloud-based security orchestration platforms.

Use Scenario: Mediating SPI flash access between network processor and control plane CPU in carrier-grade routers.

IC Role / Device Role / Timing Role: Dual-channel SPI monitor enforcing regional access permissions and opcode whitelisting on shared flash resources.

Use Value: Eliminates cross-host flash corruption risks by isolating BMC and CPU flash traffic through independent QSPI analog switches and per-channel intervention logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar embedded controller security applications.

Alternative Part Technical Difference Application Difference Selection Advice
CEC1734-S0-I/2HW 64-pin VFBGA; single SPI monitor channel; 2 MB internal SPI flash; 52 GPIOs Supports only BMC-side flash monitoring; no CPU-side isolation or dual-voltage I/O banks Select when system requires only one host (e.g., BMC-only architecture) and space/power constraints favor smaller package.
CEC1736-S0-I/2ZW Same 84-pin WFBGA; adds tamper detection (temperature/voltage/side-channel); higher ECC key support (P-521) Required for environments demanding physical tamper resistance and extended public-key flexibility Select when deployment mandates NIST SP800-193 Class 3 tamper response or elliptic curve operations beyond P-384.

Compared with CEC1734-S0-I/2ZW-TCSM, the CEC1734-S0-I/2HW lacks CPU-side monitoring and dual-voltage I/O, limiting it to single-host use cases; the CEC1736-S0-I/2ZW adds tamper sensing and extended crypto but shares identical dual-monitor architecture and pin compatibility - making it a drop-in upgrade for enhanced threat models.

Availability

CEC1734-S0-I/2ZW-TCSM is available at Aetrix Electronics and suitable for server BMC integrity enforcement, telecom baseband controller security, and industrial edge gateway trust anchor applications requiring stable component supply, long-term lifecycle support, and certified secure boot functionality.

Supply support for CEC1734-S0-I/2ZW-TCSM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a global semiconductor company specializing in microcontrollers, analog, FPGA, and security solutions, with emphasis on industrial, automotive, and communications markets.

The CEC173x family is designed as a real-time platform root of trust controller - delivering hardware-enforced firmware integrity, cryptographic acceleration, and SPDM-based attestation for servers, telecom infrastructure, and embedded computing systems.

FAQ

What is the primary security function of the CEC1734-S0-I/2ZW-TCSM in server platforms?

The CEC1734-S0-I/2ZW-TCSM serves as a hardware-enforced root of trust that monitors and intervenes in real time on both BMC and CPU SPI flash transactions. It validates firmware signatures during boot using SHA-384/ECC384, enforces regional access permissions at runtime, and blocks illegal opcodes - all implemented in dedicated dual-channel monitor logic within the CEC1734-S0-I/2ZW-TCSM die.

Does the CEC1734-S0-I/2ZW-TCSM support dual-voltage I/O for interfacing with mixed 1.8 V and 3.3 V flash devices?

Yes. The CEC1734-S0-I/2ZW-TCSM features two independent I/O power wells - VTR1 and VTR2 - each configurable for either 1.8 V or 3.3 V operation. This allows simultaneous interfacing with heterogeneous SPI flash devices (e.g., 1.8 V BMC flash and 3.3 V CPU flash), a capability confirmed in the CEC1734-S0-I/2ZW-TCSM datasheet Section 2.2 and Table 1-1.

How does the CEC1734-S0-I/2ZW-TCSM implement TCG DICE compliance?

The CEC1734-S0-I/2ZW-TCSM implements TCG DICE in immutable ROM code, generating a Device Identity Composite Identifier (CDI) derived from hardware-unique entropy and firmware measurements. Its DICE-compliant boot flow ensures cryptographically bound attestation evidence, validated by external requesters via SPDM protocols - a feature explicitly documented for the CEC1734-S0-I/2ZW-TCSM in DS00004571A-page 6 and page 15.

What is the role of the 64 KB match RAM in each SPI monitor block of the CEC1734-S0-I/2ZW-TCSM?

Each of the two SPI monitor blocks in the CEC1734-S0-I/2ZW-TCSM includes 64 KB of dedicated match RAM used to store pattern templates for real-time comparison against live SPI channel data. During boot, it verifies 8 KB flash regions via SHA-256/SHA-384; during runtime, it enforces access rules by matching command sequences - a hardware resource allocated exclusively per channel and confirmed in Table 1-1 of the CEC1734-S0-I/2ZW-TCSM datasheet.

Can the CEC1734-S0-I/2ZW-TCSM operate in low-power states while maintaining SPI flash monitoring capability?

Yes. The CEC1734-S0-I/2ZW-TCSM supports Light Sleep and Heavy Sleep modes where SPI flash monitoring remains fully active - including real-time hash calculation, pattern matching, and intervention logic. Its RTOS timer runs continuously off the 32 kHz oscillator across all sleep states, ensuring uninterrupted integrity enforcement without host processor involvement - a capability specified in DS00004571A-page 3 and page 5 for the CEC1734-S0-I/2ZW-TCSM.

CEC1734-S0-I/2ZW-TCSM Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
CryptoController™
Package/Case:
84-WFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
-
Applications:
Real Time Platform Root
Core Processor:
ARM® Cortex®-M4F
Program Memory Type:
OTP (1kB)
Controller Series:
CEC173X
RAM Size:
384K x 8
Interface:
I2C, PWM, SMBus, SPI, UART
Number of I/O:
71
Voltage - Supply:
1.8V ~ 3.3V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
84-WFBGA (7x7)

CEC1734-S0-I/2ZW-TCSM FAQ

1.How can I place an order for CEC1734-S0-I/2ZW-TCSM through Aetrix?

Please submit a Request for Quotation (RFQ) for CEC1734-S0-I/2ZW-TCSM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CEC1734-S0-I/2ZW-TCSM reliable?

The price and inventory of CEC1734-S0-I/2ZW-TCSM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CEC1734-S0-I/2ZW-TCSM is usually 5 days.

3.What payment methods are accepted for CEC1734-S0-I/2ZW-TCSM?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CEC1734-S0-I/2ZW-TCSM transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CEC1734-S0-I/2ZW-TCSM?

CEC1734-S0-I/2ZW-TCSM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CEC1734-S0-I/2ZW-TCSM order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CEC1734-S0-I/2ZW-TCSM?

For technical support, including CEC1734-S0-I/2ZW-TCSM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CEC1734-S0-I/2ZW-TCSM requirements.

6.How does Aetrix verify that CEC1734-S0-I/2ZW-TCSM is sourced from the original manufacturer or authorized distributors?

All CEC1734-S0-I/2ZW-TCSM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CEC1734-S0-I/2ZW-TCSM meets industry standards.

7.What is the process for return or replacement of CEC1734-S0-I/2ZW-TCSM?

All CEC1734-S0-I/2ZW-TCSM units undergo pre-shipment inspection (PSI). If there is an issue with CEC1734-S0-I/2ZW-TCSM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CEC1734-S0-I/2ZW-TCSM part is unused and in its original packaging.

Return procedure for CEC1734-S0-I/2ZW-TCSM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CEC1734-S0-I/2ZW-TCSM Tags

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