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Microchip Technology CEC1736-S0-I/2ZW-TCSM

Part No.:
CEC1736-S0-I/2ZW-TCSM
Manufacturer:
Microchip Technology
Category:
Application Specific Microcontrollers
Package:
84-WFBGA
Datasheet:
AetrixCEC1736-S0-I/2ZW-TCSM.pdf
Description:
TRUSTCUSTOM 2-CHANNEL PFR WITH 4
Quantity:
Payment:
Payment
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Product details

Overview

CEC1736-S0-I/2ZW-TCSM from Microchip Technology is a real-time platform root of trust controller for server and telecom infrastructure, integrating an ARM® Cortex-M4F core (96 MHz), 384 KB SRAM (320 KB code + 64 KB data), dual SPI flash monitoring blocks, 4 MB in-package SPI flash, and hardware crypto accelerators (AES-256, SHA-384, ECDSA, PUF, DRNG). It operates at 3.3 V with optional 1.8 V SPI I/O and supports -40°C to +85°C industrial temperature range.

For engineers reviewing the CEC1736-S0-I/2ZW-TCSM datasheet, CEC1736-S0-I/2ZW-TCSM pinout, CEC1736-S0-I/2ZW-TCSM application, or CEC1736-S0-I/2ZW-TCSM equivalent, key selection criteria include dual-channel SPI flash intervention capability, TCG DICE compliance, secure boot with CNSA-compliant SHA-384/ECC384, 84-pin WFBGA package with VTR1/VTR2 dual-power I/O domains, and support for SPDM-based attestation in server BMC/CPU co-verification architectures.

Technical Context

The CEC1736-S0-I/2ZW-TCSM implements two independent QSPI analog switch isolation paths - one per host (BMC and CPU) - enabling real-time SPI flash access monitoring, hash-based integrity verification (SHA-256/384 on 8 KB regions), and active intervention against illegal erase/write operations. Its dual 64 KB dedicated SRAM match buffers and per-channel 50 MHz SPI operation are confirmed for the 84-pin 2ZW variant.

It features deterministic random number generation compliant with NIST SP800-90B, tamper detection across voltage, temperature, and side-channel power, fused life-cycle management per OpenTitan spec, and immutable Boot ROM implementing DICE CDI generation, SPDM requester support, and rollback-protected dual-image boot from internal flash.

Key Specifications

Parameter Value and Actual Design Meaning
Core Processor ARM Cortex-M4F @ 96 MHz with FPU, NVIC, MPU, and JTAG/SWD debug interfaces
Memory 384 KB SRAM (320 KB code + 64 KB data), 8 Kbit OTP, 4 MB in-package SPI flash (dual-channel)
Crypto Acceleration AES-128/192/256-GCM, SHA-256/384/512, RSA up to 4096-bit, ECC up to 521-bit prime field, PUF for ECC384 key derivation
SPI Flash Monitoring Dual independent monitors (BMC & CPU), each with 64 KB match buffer, SHA-256/384 hashing, real-time intervention on illegal opcodes
Package & I/O 84-pin WFBGA, dual 1.8 V / 3.3 V configurable I/O banks (VTR1/VTR2), 71 GPIOs with glitch/UV protection
Security Compliance TCG DICE (immutable ROM), CNSA (SHA-384/ECC384), NIST 800-193 PFR, SPDM attestation, Life Cycle Management
Power & Temp 3.3 V VTR_REG supply, -40°C to +85°C operating range, Light/Heavy Sleep modes with GPIO wake capability

Pinout & Package

CEC1736-S0-I/2ZW-TCSM uses an 84-pin WFBGA package (2ZW suffix) with dual-voltage I/O domains: VTR1 (SPI0 channel) and VTR2 (SPI1 channel), plus VTR_REG (core 3.3 V) and VTR_ANALOG (analog reference). Pin functions include dual QSPI controllers, five SMBus/I2C hosts, two breathing LEDs, UART, PWM, RTC timers, and dedicated SPI flash monitor control signals (e.g., SPIMON_QSPI0_CS0#, SPIMON_QSPI1_CS1#).

Pin/Terminal Circuit Role Design Meaning
GPIO020/QSPI0_IN_CS0# SPI Monitor Channel 0 Chip Select Input Asserted by host CPU to initiate monitored SPI transaction on first channel; enables real-time signature verification
GPIO120/QSPI1_CS1# SPI Monitor Channel 1 Chip Select Input Asserted by BMC to initiate monitored SPI transaction on second channel; isolates BMC firmware integrity path
GPIO055/SPIMON_QSPI0_CS0# SPI Monitor Channel 0 Intervention Output Active-low signal that cancels ongoing SPI flash access when violation detected on channel 0
GPIO124/SPIMON_QSPI1_CS0# SPI Monitor Channel 1 Intervention Output Active-low signal that cancels ongoing SPI flash access when violation detected on channel 1
GPIO201/32KHZ_OUT[CR_FLASH] Crystal Oscillator Output for Flash Timing Provides 32.768 kHz clock to external SPI flash devices; enabled only during CR_FLASH strap mode
GPIO170[JTAG_STRAP] JTAG Enable Strap Input Pulled low at reset to disable JTAG interface permanently; required for production security hardening

Key Features

Feature Design Value
Dual SPI Flash Monitor Blocks Enables independent, real-time integrity enforcement for both BMC and CPU boot images without shared resources or timing contention
TCG DICE Root of Trust Immutable Boot ROM generates DICE CDI and supports SPDM attestation - enabling verifiable platform identity in zero-trust server environments
Hardware Crypto Engine Offloads SHA-384/ECC384 signing, AES-256-GCM encryption, and DRNG health-tested entropy generation from firmware
Fused Life Cycle Management OTP-controlled progression through development → test → production states, disabling debug interfaces and locking key storage per phase
QSPI Analog Switch Isolation Physically separates host processors from flash devices during runtime, preventing unauthorized direct access even if host OS is compromised

Applications

Server BMC Firmware Integrity Telecom Baseband Processor RoT

Use Scenario: BMC boots from SPI flash and loads host firmware; malicious firmware update attempts must be blocked before execution.

IC Role / Device Role / Timing Role: Real-time SPI flash monitor acting as hardware-enforced gatekeeper between BMC and its boot flash, verifying signatures and blocking illegal opcodes.

Use Value: Prevents persistent BMC compromise via flash corruption; meets NIST 800-193 Platform Firmware Resilience requirements.

Use Scenario: Baseband processor in 5G radio unit requires cryptographically verified boot and runtime attestation for regulatory compliance.

IC Role / Device Role / Timing Role: Immutable Root of Trust providing DICE CDI, SPDM responder functionality, and hardware-accelerated certificate signing.

Use Value: Enables remote attestation of baseband firmware integrity to network operator security gateways without software stack dependency.

Industrial Edge Controller Secure Boot Network Switch Trusted Execution Environment

Use Scenario: Edge controller in factory automation runs untrusted third-party applications but must guarantee bootloader and kernel integrity.

IC Role / Device Role / Timing Role: Secure boot loader authenticating dual-image firmware (primary/fallback) from internal SPI flash using SHA-384/ECC384 keys stored in OTP.

Use Value: Enforces rollback protection and key revocation - critical for long-lifecycle deployments where firmware patches may introduce regressions.

Use Scenario: Managed Ethernet switch requires hardware-isolated firmware verification for both control plane (CPU) and management plane (BMC).

IC Role / Device Role / Timing Role: Dual-channel SPI monitor enforcing separate integrity policies for CPU and BMC flash, with independent 64 KB match buffers and intervention logic.

Use Value: Eliminates cross-plane attack surface - BMC compromise cannot corrupt CPU firmware, and vice versa, satisfying IEC 62443-4-2 SL3 requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar embedded controller root-of-trust applications.

Alternative Part Technical Difference Application Difference Selection Advice
CEC1736-S0-I/2HW 64-pin VFBGA, single SPI monitor block, 2 MB internal SPI flash, no VTR2 I/O bank Limited to single-host (BMC-only) monitoring; unsuitable for CPU+BMC dual-path architectures Select only for cost-sensitive BMC-only designs without CPU-side flash protection requirement
MAX32570 Maxim Integrated secure microcontroller; ARM Cortex-M4 @ 48 MHz, 512 KB SRAM, no integrated SPI flash, single-channel SPI monitor Lacks dual-monitor architecture, DICE compliance, and in-package flash - requires external memory and additional isolation components Consider when needing higher SRAM capacity and external flash flexibility, but accept added BOM complexity and reduced integration

Compared with CEC1736-S0-I/2ZW-TCSM, the CEC1736-S0-I/2HW omits CPU-side monitoring and reduces flash capacity, while MAX32570 trades integration for configurability - neither provides the same dual-channel, in-package, DICE-compliant RoT foundation for server-grade firmware resilience.

Availability

CEC1736-S0-I/2ZW-TCSM is available at Aetrix Electronics and suitable for server BMC validation, telecom baseband certification, and industrial edge controller production requiring stable component supply, long-term lifecycle assurance, and traceable secure silicon sourcing.

Supply support for CEC1736-S0-I/2ZW-TCSM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and security solutions, serving automotive, industrial, communications, and computing markets with vertically integrated silicon and software.

The CEC173x family is designed as a real-time platform root of trust controller specifically for server, telecom, and industrial systems requiring hardware-enforced firmware integrity, cryptographic acceleration, and DICE-compliant attestation capabilities.

FAQ

What is the primary security function of the CEC1736-S0-I/2ZW-TCSM in server platforms?

The CEC1736-S0-I/2ZW-TCSM serves as a hardware-enforced root of trust that performs real-time SPI flash monitoring for both BMC and CPU boot paths. It verifies firmware image authenticity using SHA-384/ECC384 signatures from OTP-stored keys, intervenes on illegal flash operations (e.g., chip erase), and generates DICE-compliant attestation evidence via SPDM - all enforced by immutable Boot ROM code in the CEC1736-S0-I/2ZW-TCSM.

Does the CEC1736-S0-I/2ZW-TCSM support dual-voltage I/O for interfacing with both 1.8 V and 3.3 V SPI flash devices?

Yes, the CEC1736-S0-I/2ZW-TCSM supports dual-voltage I/O through separate VTR1 and VTR2 power domains, allowing independent configuration of SPI0 and SPI1 channels for either 1.8 V or 3.3 V operation. This enables direct connection to mixed-voltage flash devices without level shifters - a confirmed capability of the CEC1736-S0-I/2ZW-TCSM per its 2ZW package specification.

How does the CEC1736-S0-I/2ZW-TCSM implement tamper resistance?

The CEC1736-S0-I/2ZW-TCSM integrates voltage, temperature, and side-channel power tamper detection circuits that trigger countermeasures including OTP lock, SRAM wipe, and cryptographic key erasure. These features are explicitly documented for the CEC1736-S0-I/2ZW-TCSM in DS00004571A-page 7 and are enabled by fused life-cycle bits in OTP memory.

Can the CEC1736-S0-I/2ZW-TCSM operate in low-power sleep modes while maintaining security monitoring?

Yes, the CEC1736-S0-I/2ZW-TCSM supports Light Sleep and Heavy Sleep modes with sub-µA standby current, and its RTOS timer continues counting off the 32 kHz oscillator in all sleep states. SPI flash monitoring remains active during sleep, and GPIO, timer, or SPI activity can wake the device - all confirmed operational characteristics of the CEC1736-S0-I/2ZW-TCSM.

What debug interfaces are available on the CEC1736-S0-I/2ZW-TCSM, and how are they secured?

The CEC1736-S0-I/2ZW-TCSM provides 2-pin Serial Wire Debug (SWD), 4-pin JTAG (disabled by default), and Trace FIFO Debug Port (TFDP). JTAG is disabled at power-on unless GPIO170[JTAG_STRAP] is held low during reset - a hardware fuse mechanism ensuring debug lockdown in production. SWD remains available for authorized firmware development but requires authenticated access per Boot ROM policy in the CEC1736-S0-I/2ZW-TCSM.

CEC1736-S0-I/2ZW-TCSM Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
CryptoController™
Package/Case:
84-WFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
-
Applications:
Real Time Platform Root
Core Processor:
ARM® Cortex®-M4F
Program Memory Type:
OTP (1kB)
Controller Series:
CEC173X
RAM Size:
384K x 8
Interface:
I2C, PWM, SMBus, SPI, UART
Number of I/O:
71
Voltage - Supply:
1.8V ~ 3.3V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
84-WFBGA (7x7)

CEC1736-S0-I/2ZW-TCSM FAQ

1.How can I place an order for CEC1736-S0-I/2ZW-TCSM through Aetrix?

Please submit a Request for Quotation (RFQ) for CEC1736-S0-I/2ZW-TCSM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CEC1736-S0-I/2ZW-TCSM reliable?

The price and inventory of CEC1736-S0-I/2ZW-TCSM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CEC1736-S0-I/2ZW-TCSM is usually 5 days.

3.What payment methods are accepted for CEC1736-S0-I/2ZW-TCSM?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CEC1736-S0-I/2ZW-TCSM transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CEC1736-S0-I/2ZW-TCSM?

CEC1736-S0-I/2ZW-TCSM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CEC1736-S0-I/2ZW-TCSM order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CEC1736-S0-I/2ZW-TCSM?

For technical support, including CEC1736-S0-I/2ZW-TCSM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CEC1736-S0-I/2ZW-TCSM requirements.

6.How does Aetrix verify that CEC1736-S0-I/2ZW-TCSM is sourced from the original manufacturer or authorized distributors?

All CEC1736-S0-I/2ZW-TCSM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CEC1736-S0-I/2ZW-TCSM meets industry standards.

7.What is the process for return or replacement of CEC1736-S0-I/2ZW-TCSM?

All CEC1736-S0-I/2ZW-TCSM units undergo pre-shipment inspection (PSI). If there is an issue with CEC1736-S0-I/2ZW-TCSM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CEC1736-S0-I/2ZW-TCSM part is unused and in its original packaging.

Return procedure for CEC1736-S0-I/2ZW-TCSM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CEC1736-S0-I/2ZW-TCSM Tags

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