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Home > Products > Discrete Semiconductor Products > Diodes > Rectifiers > Single Diodes

Toshiba Semiconductor and Storage CMS02(TE12L)

Name: CMS02(TE12L)
Brand: Toshiba Semiconductor and Storage
SKU: CMS02(TE12L)
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CMS02(TE12L)

Manufacturer:: Toshiba Semiconductor and Storage

Category:: Single Diodes

Package:: SOD-128

Datasheet:: CMS02(TE12L).pdf

Description:: DIODE SCHOTTKY 30V 3A MFLAT

Quantity:: RFQ Add To RFQ list

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Inventory:6,960

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Product details

Overview

CMS02(TE12L) from TOSHIBA is a trench-structured Schottky barrier rectifier optimized for high-efficiency, low-loss DC/DC conversion in compact power supplies. It delivers V_F = 0.40 V (max) at 3.0 A, supports 30 V repetitive peak reverse voltage (V_RRM), and operates across −40°C to +125°C junction temperature. It is widely deployed in switching mode power supplies and portable battery-powered equipment.

For engineers reviewing the CMS02(TE12L) datasheet, CMS02(TE12L) pinout, CMS02(TE12L) application, or CMS02(TE12L) equivalent, key selection criteria include forward voltage drop at rated current, thermal resistance under defined PCB mounting conditions, surge current capability (IFSM = 40 A), junction-to-ambient thermal resistance (R_th(j-a) = 135°C/W on 6 mm × 6 mm glass-epoxy board), and reverse leakage (IRRM = 0.5 mA at VRRM).

Technical Context

The CMS02(TE12L) employs Toshiba's trench Schottky barrier technology to minimize forward conduction loss while maintaining fast recovery and low reverse recovery charge-critical for high-frequency SMPS operation. Its low V_F (0.37 V typ. at 3.0 A) directly reduces conduction losses in synchronous rectification and secondary-side rectification stages.

Thermal performance is tightly coupled to PCB layout: R_th(j-a) ranges from 60°C/W (ceramic board, 2 mm × 2 mm pad) to 135°C/W (standard glass-epoxy, 6 mm × 6 mm pad). Junction capacitance is 170 pF at 10 V, supporting stable high-frequency switching behavior without excessive capacitive loading.

Key Specifications

Parameter	Value and Actual Design Meaning
V_RRM	30 V - Maximum reverse blocking voltage; sets upper limit for output voltage in buck or flyback secondary-side rectification
I_F(AV)	3.0 A - Continuous average forward current; defines steady-state power handling with appropriate thermal design
V_F (max)	0.40 V at I_F = 3.0 A - Low conduction loss enables >95% efficiency in 5 V/3 A output rails
I_FSM	40 A (50 Hz sine half-cycle) - Withstands short-duration inrush or fault currents without damage
R_th(j-a)	135°C/W on 6 mm × 6 mm glass-epoxy board - Determines required minimum copper area for thermal management
C_j	170 pF at V_R = 10 V - Limits high-frequency displacement current and EMI generation in MHz-range converters
I_RRM	0.5 mA max at V_RRM = 30 V - Low leakage preserves light-load efficiency and prevents thermal runaway risk

Pinout & Package

Package: M-FLAT™ (Toshiba proprietary small surface-mount package, 3.0 mm × 1.4 mm × 0.5 mm, weight 0.023 g). Mounting requires 2.1 mm × 1.4 mm solder land per JEDEC-standard footprint.

Pin/Terminal	Circuit Role	Design Meaning
Anode	Forward current entry point	Connected to switch node or transformer secondary; must handle full load current and transient spikes
Cathode	Forward current exit / reverse voltage reference	Connected to output rail or ground return; serves as primary thermal path to PCB copper

Key Features

Feature	Design Value
Trench Schottky structure	Enables lower V_F vs. planar Schottky diodes at same current density, reducing conduction loss by ~15%
Low thermal resistance packaging	M-FLAT™ package with exposed cathode pad provides direct thermal path to PCB, enabling 135°C/W on standard FR-4
High surge current rating	40 A non-repetitive peak supports robust startup and overload protection in consumer-grade adapters
Wide operating temperature range	−40°C to +125°C junction rating allows deployment in battery packs and enclosed industrial modules

Applications

USB-C Power Delivery Adapter	Wireless Charging Transmitter
Use Scenario: Secondary-side rectification in 20–30 W GaN-based USB-C PD adapters operating at 100–300 kHz. IC Role / Device Role / Timing Role: Synchronous rectifier replacement for MOSFET gate drive complexity reduction; functions as uncontrolled low-V_F rectifier. Use Value: Enables <0.4 V forward drop at 3 A, cutting conduction loss by 0.36 W vs. silicon diode alternatives and improving full-load efficiency by 1.2%.	Use Scenario: Output rectification in 15 W Qi-compliant wireless charging transmitters with 125 kHz carrier frequency. IC Role / Device Role / Timing Role: High-speed, low-loss rectifier converting AC from resonant tank to regulated DC output. Use Value: 170 pF junction capacitance minimizes high-frequency displacement current, reducing EMI and improving coil Q-factor stability.
Bluetooth Headset Battery Charger	Industrial IoT Sensor Node Power Supply
Use Scenario: Linear-regulated charging path for single-cell Li-ion batteries in ultra-compact wearable devices. IC Role / Device Role / Timing Role: Reverse-polarity protection and input rectification in low-current (<1 A avg) trickle-charge circuit. Use Value: 0.023 g mass and 3.0 mm × 1.4 mm footprint enable integration into sub-10 cm³ enclosures without thermal derating.	Use Scenario: Input-stage rectification in wide-temperature (-40°C to +85°C ambient) 24 V DC-powered sensor nodes with isolated DC/DC converters. IC Role / Device Role / Timing Role: Primary rectifier in auxiliary bias supply; handles intermittent 3 A surges during radio transmission bursts. Use Value: 40 A IFSM and −40°C to +125°C Tj rating ensure reliability across extended outdoor deployments without active cooling.

USB-C Power Delivery Adapter

Wireless Charging Transmitter

Use Scenario: Secondary-side rectification in 20–30 W GaN-based USB-C PD adapters operating at 100–300 kHz.

IC Role / Device Role / Timing Role: Synchronous rectifier replacement for MOSFET gate drive complexity reduction; functions as uncontrolled low-V_F rectifier.

Use Value: Enables <0.4 V forward drop at 3 A, cutting conduction loss by 0.36 W vs. silicon diode alternatives and improving full-load efficiency by 1.2%.

Use Scenario: Output rectification in 15 W Qi-compliant wireless charging transmitters with 125 kHz carrier frequency.

IC Role / Device Role / Timing Role: High-speed, low-loss rectifier converting AC from resonant tank to regulated DC output.

Use Value: 170 pF junction capacitance minimizes high-frequency displacement current, reducing EMI and improving coil Q-factor stability.

Bluetooth Headset Battery Charger

Industrial IoT Sensor Node Power Supply

Use Scenario: Linear-regulated charging path for single-cell Li-ion batteries in ultra-compact wearable devices.

IC Role / Device Role / Timing Role: Reverse-polarity protection and input rectification in low-current (<1 A avg) trickle-charge circuit.

Use Value: 0.023 g mass and 3.0 mm × 1.4 mm footprint enable integration into sub-10 cm³ enclosures without thermal derating.

Use Scenario: Input-stage rectification in wide-temperature (-40°C to +85°C ambient) 24 V DC-powered sensor nodes with isolated DC/DC converters.

IC Role / Device Role / Timing Role: Primary rectifier in auxiliary bias supply; handles intermittent 3 A surges during radio transmission bursts.

Use Value: 40 A IFSM and −40°C to +125°C Tj rating ensure reliability across extended outdoor deployments without active cooling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SS33H (ON Semiconductor)	V_RRM = 30 V, I_F(AV) = 3.0 A, V_F = 0.50 V (max) at 3 A - higher forward drop than CMS02(TE12L)	Higher conduction loss limits use in thermally constrained 30 W+ designs	Select when cost sensitivity outweighs efficiency targets and thermal margin exceeds 15°C
RB055LAM-30 (ROHM)	V_RRM = 30 V, I_F(AV) = 3.0 A, V_F = 0.39 V (max) at 3 A, R_th(j-a) = 120°C/W - slightly better thermal performance	Compatible footprint but different marking and tape/reel orientation	Prefer when tighter thermal budget exists and board space allows minor layout adjustment for tape feed direction

Compared with SS33H and RB055LAM-30, the CMS02(TE12L) offers the lowest published V_F (0.40 V max) among 3 A/30 V Schottky rectifiers in M-FLAT™, delivering superior conduction efficiency in space-constrained, high-frequency SMPS where thermal resistance is managed via optimized pad layout.

Availability

CMS02(TE12L) is available at Aetrix Electronics and suitable for switching mode power supply applications, portable equipment battery applications, and compact DC/DC converter designs requiring stable component supply and consistent parametric performance across production lots.

Supply support for CMS02(TE12L) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power devices, logic ICs, and memory solutions, with deep expertise in discrete power components for energy-efficient systems.

The CMS02(TE12L) belongs to Toshiba's trench Schottky rectifier product line, engineered specifically for high-frequency, low-voltage DC/DC conversion in space- and efficiency-critical consumer and industrial power supplies.

FAQ

What is the maximum junction temperature rating for CMS02(TE12L)?

The CMS02(TE12L) has a specified junction temperature range of −40°C to +125°C. Operation above +125°C risks irreversible degradation of the Schottky barrier interface. For reliable long-term use, Toshiba recommends limiting T_j to ≤100°C under continuous load, especially when mounted on standard FR-4 boards with limited copper area.

Does CMS02(TE12L) have a specified thermal resistance from junction to lead (R_th(j-ℓ))?

Yes, the CMS02(TE12L) datasheet specifies R_th(j-ℓ) = 16°C/W. This value reflects heat transfer from the silicon die to the cathode terminal metal, independent of PCB layout. It is used alongside R_th(ℓ-a) (lead-to-ambient) to model total thermal path in designs where lead-frame conduction dominates over PCB conduction.

Is CMS02(TE12L) RoHS compliant?

Yes, CMS02(TE12L) complies with the EU RoHS Directive. Toshiba confirms lead-free termination and absence of restricted substances per Annex II of Directive 2011/65/EU. Full compliance documentation, including material declarations and test reports, is available through authorized Toshiba distributors upon request.

What is the typical forward voltage of CMS02(TE12L) at 1.0 A?

The typical forward voltage of CMS02(TE12L) at I_F = 1.0 A and T_a = 25°C is 0.30 V, as measured under pulsed conditions to avoid self-heating. This value is confirmed in the Electrical Characteristics table and supports accurate loss modeling in 1–2 A output stage designs.

Can CMS02(TE12L) be used in automotive applications?

No - CMS02(TE12L) is not qualified for automotive applications. Toshiba explicitly restricts its use to general electronics (e.g., consumer, office, industrial robots, home appliances) and prohibits deployment in automotive systems, including powertrain, ADAS, or infotainment, due to lack of AEC-Q101 qualification and absence of automotive-grade reliability testing data.

CMS02(TE12L) Specifications

Product attributes: Attribute value

Manufacturer:: Toshiba Semiconductor and Storage

Series:: -

Package/Case:: SOD-128

Packaging:: Cut Tape (CT)

Product Status:: Obsolete

Technology:: Schottky

Voltage - DC Reverse (Vr) (Max):: 30 V

Current - Average Rectified (Io):: 3A

Voltage - Forward (Vf) (Max) @ If:: 400 mV @ 3 A

Speed:: Fast Recovery =< 500ns, > 200mA (Io)

Reverse Recovery Time (trr):: -

Current - Reverse Leakage @ Vr:: 500 µA @ 30 V

Capacitance @ Vr, F:: -

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: M-FLAT (2.4x3.8)

Operating Temperature - Junction:: -40°C ~ 125°C

CMS02(TE12L) FAQ

1.How can I place an order for CMS02(TE12L) through Aetrix?

Please submit a Request for Quotation (RFQ) for CMS02(TE12L) on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CMS02(TE12L) reliable?

The price and inventory of CMS02(TE12L) are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CMS02(TE12L) is usually 5 days.

3.What payment methods are accepted for CMS02(TE12L)?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CMS02(TE12L) transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CMS02(TE12L)?

CMS02(TE12L) orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CMS02(TE12L) order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CMS02(TE12L)?

For technical support, including CMS02(TE12L) datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CMS02(TE12L) requirements.

6.How does Aetrix verify that CMS02(TE12L) is sourced from the original manufacturer or authorized distributors?

All CMS02(TE12L) products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CMS02(TE12L) meets industry standards.

7.What is the process for return or replacement of CMS02(TE12L)?

All CMS02(TE12L) units undergo pre-shipment inspection (PSI). If there is an issue with CMS02(TE12L), returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CMS02(TE12L) part is unused and in its original packaging.

Return procedure for CMS02(TE12L):

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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