Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Diodes > Rectifiers > Single Diodes

Toshiba Semiconductor and Storage CMS09(TE12L,Q,M)

Name: CMS09(TE12L,Q,M)
Brand: Toshiba Semiconductor and Storage
SKU: CMS09(TE12L,Q,M)
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: CMS09(TE12L,Q,M)

Manufacturer:: Toshiba Semiconductor and Storage

Category:: Single Diodes

Package:: SOD-128

Datasheet:: CMS09(TE12L,Q,M).pdf

Description:: DIODE SCHOTTKY 30V 1A M-FLAT

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,976

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

CMS09(TE12L,Q,M) from TOSHIBA is a surface-mount Schottky barrier rectifier optimized for low-loss DC/DC conversion in compact power supplies and battery-powered devices. It delivers 1.0 A average forward current, 30 V repetitive peak reverse voltage, and a maximum forward voltage of 0.45 V at 1.0 A - enabling high-efficiency operation in portable equipment battery charging circuits and switching mode power supplies.

For engineers reviewing the CMS09(TE12L,Q,M) datasheet, CMS09(TE12L,Q,M) pinout, CMS09(TE12L,Q,M) application, or CMS09(TE12L,Q,M) equivalent, key selection criteria include its low V_F performance at 1 A, thermal resistance of 135°C/W on standard FR-4 PCBs, M-FLAT™ package footprint compatibility, and suitability for space-constrained 5 V–12 V input SMPS designs.

Technical Context

The CMS09(TE12L,Q,M) employs a planar Schottky barrier structure with low-junction capacitance (70 pF at 10 V), enabling fast switching and minimal reverse recovery loss. Its junction temperature range spans −40°C to +150°C, supporting operation in thermally demanding environments such as enclosed portable chargers and industrial battery management modules.

Designed for surface-mount assembly on glass-epoxy boards (50 mm × 50 mm, 6 mm × 6 mm solder land), it achieves 135°C/W junction-to-ambient thermal resistance. The device exhibits a 0.1%/°C temperature coefficient for V_RRM, requiring derating below 30 V at sub-zero ambient temperatures.

Key Specifications

Parameter	Value and Actual Design Meaning
V_RRM	30 V - supports input rails up to 24 V nominal with margin against transients in battery-fed systems
I_F(AV)	1.0 A at T_a = 51°C - defines continuous output capability in compact SMT layouts without forced cooling
V_FM	0.45 V max at I_F = 1.0 A - reduces conduction loss by ~30% vs. comparable 1 A silicon rectifiers
I_FSM	25 A non-repetitive (50 Hz) - withstands brief inrush currents during hot-plug or cold-start events
C_j	70 pF at V_R = 10 V, 1 MHz - limits capacitive switching loss and EMI in high-frequency (>100 kHz) converters
R_th(j-a)	135°C/W on standard FR-4 - requires ≥6 mm × 6 mm copper pad for safe 1 A operation at T_a ≤ 51°C
T_j Range	−40°C to +150°C - enables deployment in automotive cabin electronics and industrial handheld tools

Pinout & Package

Package: M-FLAT™ (TOSHIBA proprietary small-outline surface-mount package, JEITA 3-4E1A, 3.0 mm × 1.4 mm × 1.0 mm, weight 0.023 g).

Pin/Terminal	Circuit Role	Design Meaning
Anode	Forward current entry point	Connected to input/high-side rail; must be routed with low-inductance trace for high di/dt stability
Cathode	Forward current exit point	Connected to output/low-side node; requires thermal pad connection to ground plane for heat dissipation

Key Features

Feature	Design Value
Low forward voltage drop	V_FM = 0.40 V typ. at 1.0 A - directly lowers power loss and improves efficiency in 5–12 V buck converter outputs
Compact M-FLAT™ package	3.0 mm × 1.4 mm footprint - fits into <5 mm² board area, ideal for ultra-thin USB-C PD adapters and wearables
High surge current rating	I_FSM = 25 A - sustains repeated capacitor-charging pulses without degradation in battery charger front-ends
Low junction capacitance	C_j = 70 pF - minimizes switching node ringing and EMI generation in >500 kHz synchronous rectifier applications
Wide operating temperature	T_j = −40°C to +150°C - eliminates need for external thermal derating in sealed consumer enclosures

Applications

USB-C Power Delivery Adapter	Wireless Charging Transmitter
Use Scenario: Secondary-side rectification in 20–30 W GaN-based USB-C PD adapters with 5–20 V output range. IC Role / Device Role / Timing Role: Low-V_F Schottky rectifier replacing conventional silicon diodes to reduce conduction loss and improve thermal headroom. Use Value: Enables 94%+ efficiency at full load while maintaining <55°C case temperature in 25 mm × 25 mm form factor.	Use Scenario: Rectifying AC output from resonant inverter in Qi-compliant 15 W wireless charging pads. IC Role / Device Role / Timing Role: High-speed unidirectional current path with minimal reverse recovery charge to preserve ZVS timing integrity. Use Value: Reduces rectifier-induced phase shift and maintains >85% end-to-end system efficiency across 0–15 W load range.
Portable Medical Monitor Battery Charger	Industrial Handheld Scanner Power Supply
Use Scenario: Input-stage rectification in dual-battery backup chargers for Class II medical devices operating from 9–15 V wall adapters. IC Role / Device Role / Timing Role: Reverse-polarity protection and AC/DC conversion element with guaranteed 30 V blocking under transient overvoltage conditions. Use Value: Eliminates need for separate TVS diode due to robust 25 A surge rating and 150°C junction limit.	Use Scenario: Output rectification in isolated flyback supply powering 3.3 V logic and 5 V motor drivers in ruggedized barcode scanners. IC Role / Device Role / Timing Role: Compact, thermally efficient rectifier enabling conformal coating and sealed enclosure design. Use Value: Maintains stable 1.0 A output under 60°C ambient with no heatsink, reducing BOM count and assembly cost.

USB-C Power Delivery Adapter

Wireless Charging Transmitter

Use Scenario: Secondary-side rectification in 20–30 W GaN-based USB-C PD adapters with 5–20 V output range.

IC Role / Device Role / Timing Role: Low-V_F Schottky rectifier replacing conventional silicon diodes to reduce conduction loss and improve thermal headroom.

Use Value: Enables 94%+ efficiency at full load while maintaining <55°C case temperature in 25 mm × 25 mm form factor.

Use Scenario: Rectifying AC output from resonant inverter in Qi-compliant 15 W wireless charging pads.

IC Role / Device Role / Timing Role: High-speed unidirectional current path with minimal reverse recovery charge to preserve ZVS timing integrity.

Use Value: Reduces rectifier-induced phase shift and maintains >85% end-to-end system efficiency across 0–15 W load range.

Portable Medical Monitor Battery Charger

Industrial Handheld Scanner Power Supply

Use Scenario: Input-stage rectification in dual-battery backup chargers for Class II medical devices operating from 9–15 V wall adapters.

IC Role / Device Role / Timing Role: Reverse-polarity protection and AC/DC conversion element with guaranteed 30 V blocking under transient overvoltage conditions.

Use Value: Eliminates need for separate TVS diode due to robust 25 A surge rating and 150°C junction limit.

Use Scenario: Output rectification in isolated flyback supply powering 3.3 V logic and 5 V motor drivers in ruggedized barcode scanners.

IC Role / Device Role / Timing Role: Compact, thermally efficient rectifier enabling conformal coating and sealed enclosure design.

Use Value: Maintains stable 1.0 A output under 60°C ambient with no heatsink, reducing BOM count and assembly cost.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
RB050M-30TR	Same 30 V V_RRM, but 0.5 A I_F(AV); larger SOD-123FL package (3.7 mm × 1.6 mm)	Limited to ≤0.5 A loads; unsuitable for 1 A USB-C PD secondary side	Select only when board space allows larger footprint and current demand is ≤0.5 A
SS13-E3/5AT	1.0 A I_F(AV), 30 V V_RRM, but V_FM = 0.49 V max at 1 A; SMA package (4.5 mm × 2.7 mm)	Higher conduction loss; requires 2× PCB area vs. M-FLAT™	Acceptable where thermal margin exists and layout cannot accommodate M-FLAT™ outline

Compared with RB050M-30TR and SS13-E3/5AT, the CMS09(TE12L,Q,M) provides superior current density (1.0 A in 4.2 mm² vs. 0.5 A in 5.9 mm² or 1.0 A in 12.2 mm²), lower forward voltage at rated current, and tighter thermal resistance control - making it optimal for miniaturized, high-efficiency 1 A rectification tasks.

Availability

CMS09(TE12L,Q,M) is available at Aetrix Electronics and suitable for switching mode power supply applications, portable equipment battery applications, and compact industrial DC/DC modules requiring stable component supply and long-term lifecycle support.

Supply support for CMS09(TE12L,Q,M) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in discrete power devices, analog ICs, and memory solutions for industrial, automotive, and consumer markets.

The CMS09(TE12L,Q,M) belongs to Toshiba's M-FLAT™ Schottky rectifier product line, engineered specifically for space-constrained, high-efficiency low-voltage DC/DC conversion in battery-powered and portable electronics.

FAQ

What is the maximum allowable ambient temperature for continuous 1.0 A operation of CMS09(TE12L,Q,M)?

The CMS09(TE12L,Q,M) supports 1.0 A average forward current at an ambient temperature of 51°C when mounted on a standard glass-epoxy board (50 mm × 50 mm, 6 mm × 6 mm solder land). Exceeding this temperature requires derating per the Ta_max–I_F(AV) curve in the datasheet. At 25°C ambient, the device can sustain higher current briefly, but steady-state design must respect the 51°C limit for full 1.0 A loading. Thermal simulation using R_th(j-a) = 135°C/W is recommended for custom layouts.

Does CMS09(TE12L,Q,M) have a specified junction-to-lead thermal resistance?

Yes, the CMS09(TE12L,Q,M) specifies R_th(j-ℓ) = 16°C/W - the thermal resistance from junction to lead - which is critical for estimating local heating at solder joints during pulse operation. This value is measured under standardized test conditions and supports transient thermal analysis when the device experiences short-duration surges like I_FSM. It complements the junction-to-ambient value (135°C/W) for comprehensive thermal modeling in compact PCB assemblies.

Is CMS09(TE12L,Q,M) RoHS compliant and halogen-free?

Yes, CMS09(TE12L,Q,M) complies with the EU RoHS Directive and is halogen-free per Toshiba's environmental specifications. The device uses lead-free terminations and meets JEDEC J-STD-020 moisture sensitivity level (MSL) requirements for reflow soldering. Full compliance documentation, including material declarations and test reports, is available through Toshiba's official environmental portal upon request.

Can CMS09(TE12L,Q,M) be used in reverse polarity protection circuits?

Yes, CMS09(TE12L,Q,M) is commonly deployed in low-drop reverse polarity protection configurations, where the cathode connects to the positive supply rail and the anode to the load. Its 30 V V_RRM and low 0.45 V V_FM minimize voltage loss and power dissipation. However, designers must ensure that reverse leakage (≤500 μA at 30 V) does not compromise system standby current budgets - especially in battery-critical applications.

What is the marking code for CMS09(TE12L,Q,M) on the device body?

The CMS09(TE12L,Q,M) is marked with the abbreviation code "S9" on its top surface, consistent with Toshiba's standard labeling for this part number. This marking appears alongside the Toshiba logo and date code, and is legible under 20× magnification. The "S9" identifier is used for visual inspection and automated optical recognition (AOI) during SMT assembly verification.

CMS09(TE12L,Q,M) Specifications

Product attributes: Attribute value

Manufacturer:: Toshiba Semiconductor and Storage

Series:: -

Package/Case:: SOD-128

Packaging:: Tape & Reel (TR)

Product Status:: Active

Technology:: Schottky

Voltage - DC Reverse (Vr) (Max):: 30 V

Current - Average Rectified (Io):: 1A

Voltage - Forward (Vf) (Max) @ If:: 450 mV @ 1 A

Speed:: Fast Recovery =< 500ns, > 200mA (Io)

Reverse Recovery Time (trr):: -

Current - Reverse Leakage @ Vr:: 500 µA @ 30 V

Capacitance @ Vr, F:: 70pF @ 10V, 1MHz

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: M-FLAT (2.4x3.8)

Operating Temperature - Junction:: -40°C ~ 150°C

CMS09(TE12L,Q,M) FAQ

1.How can I place an order for CMS09(TE12L,Q,M) through Aetrix?

Please submit a Request for Quotation (RFQ) for CMS09(TE12L,Q,M) on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CMS09(TE12L,Q,M) reliable?

The price and inventory of CMS09(TE12L,Q,M) are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CMS09(TE12L,Q,M) is usually 5 days.

3.What payment methods are accepted for CMS09(TE12L,Q,M)?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CMS09(TE12L,Q,M) transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CMS09(TE12L,Q,M)?

CMS09(TE12L,Q,M) orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CMS09(TE12L,Q,M) order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CMS09(TE12L,Q,M)?

For technical support, including CMS09(TE12L,Q,M) datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CMS09(TE12L,Q,M) requirements.

6.How does Aetrix verify that CMS09(TE12L,Q,M) is sourced from the original manufacturer or authorized distributors?

All CMS09(TE12L,Q,M) products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CMS09(TE12L,Q,M) meets industry standards.

7.What is the process for return or replacement of CMS09(TE12L,Q,M)?

All CMS09(TE12L,Q,M) units undergo pre-shipment inspection (PSI). If there is an issue with CMS09(TE12L,Q,M), returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CMS09(TE12L,Q,M) part is unused and in its original packaging.

Return procedure for CMS09(TE12L,Q,M):

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-09 Counterfeit Electronic Components: How to Detect, Authenticate, and Test Suspect Parts

Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…