Toshiba Semiconductor and Storage CMS11(TE12L)
- Part No.:
- CMS11(TE12L)
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Single Diodes
- Package:
- SOD-128
- Datasheet:
-
CMS11(TE12L).pdf
- Description:
- DIODE SCHOTTKY 40V 2A MFLAT
- Quantity:
- Payment:

- Shipping:

Inventory:7,860
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Product details
Overview
CMS11(TE12L) from Toshiba is a Schottky barrier rectifier optimized for low-loss DC/DC conversion in compact power supplies, delivering 2.0 A average forward current at ≤0.55 V peak forward voltage (IFM = 2.0 A), with 40 V repetitive peak reverse voltage rating and thermal resistance of 60 °C/W when mounted on ceramic board. It serves as a primary output rectifier in switching mode power supplies and battery charging circuits for portable electronics.
For engineers reviewing the CMS11(TE12L) datasheet, CMS11(TE12L) pinout, CMS11(TE12L) application, or CMS11(TE12L) equivalent, key selection criteria include verified VFM performance at rated IF, junction-to-ambient thermal resistance under defined PCB mounting conditions, reverse leakage at full VRRM, and compatibility with high-frequency SMPS topologies requiring fast recovery and low conduction loss.
Technical Context
The CMS11(TE12L) employs a planar Schottky barrier structure enabling zero minority-carrier storage and ultrafast switching with no reverse recovery charge. Its forward voltage is characterized across three test currents (0.5 A, 1.0 A, 2.0 A), confirming monotonic rise to 0.55 V max at full-rated 2.0 A.
Thermal performance is explicitly defined for two mounting configurations: 60 °C/W on ceramic board (50 mm × 50 mm, 2 mm × 2 mm pad) and 135 °C/W on glass-epoxy board (6 mm × 6 mm pad), directly linking layout decisions to safe operating area limits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 40 V - Maximum reverse blocking capability; defines usable input/output voltage range in buck, flyback, or OR-ing applications |
| IF(AV) | 2.0 A - Continuous DC output current handling capacity at Ta = 34°C on ceramic board; derating required above ambient |
| VFM (max) | 0.55 V at IFM = 2.0 A - Directly determines conduction loss (Pcond ≈ 1.1 W at full load), critical for efficiency in battery-powered systems |
| IRRM | 500 μA at VRRM = 40 V - Reverse leakage sets minimum off-state power loss and impacts standby efficiency |
| Cj | 95 pF at VR = 10 V, 1 MHz - Junction capacitance influences high-frequency switching noise and EMI filter design |
| Rth(j-a) | 60 °C/W on ceramic board - Enables thermal design with known ΔTj-a = 120°C at 2.0 A (assuming 1.1 W loss), defining minimum heatsinking requirement |
| Tj range | −40 to +150°C - Specifies operational junction temperature envelope; reliability derating recommended below 120°C continuous |
Pinout & Package
Package: M-FLAT™ (Toshiba proprietary surface-mount package, JEITA 3-4E1A footprint, 3.0 × 1.4 × 2.1 mm, 0.023 g). Two-terminal device: Anode and Cathode only.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Input terminal for forward conduction | Connected to higher-potential node (e.g., transformer secondary, switch node); polarity must match layout to prevent catastrophic failure |
| Cathode | Output terminal for forward conduction | Connected to lower-potential node (e.g., output capacitor, ground return); carries full load current and defines reference for VRRM stress |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low forward voltage | VFM ≤ 0.55 V at 2.0 A enables >90% efficiency in 3.3–5 V output SMPS where diode loss dominates |
| Fast switching with no reverse recovery | Schottky architecture eliminates Qrr, reducing switching losses and EMI in high-frequency (≥300 kHz) converters |
| Compact M-FLAT™ package | 3.0 × 1.4 mm footprint saves PCB area in space-constrained portable equipment and wearables |
| Controlled thermal resistance | 60 °C/W on ceramic board allows predictable junction temperature rise without external heatsink in moderate-power apps |
| Low junction capacitance | 95 pF minimizes displacement current during voltage transitions, easing EMI compliance in Class B designs |
Applications
| USB-C Power Delivery Adapter | Wireless Charging Transmitter |
|---|---|
Use Scenario: Secondary-side synchronous rectification in 20–30 W USB-C PD adapters using quasi-resonant flyback topology. IC Role / Device Role / Timing Role: Output rectifier replacing MOSFET gate driver complexity; conducts during transformer demagnetization phase. Use Value: Delivers 2.0 A at <0.55 V drop, reducing conduction loss by ~40% vs. standard PN diodes, improving full-load efficiency to ≥89%. | Use Scenario: Rectifying AC output from resonant inverter in 5–15 W Qi-compliant wireless charging transmitters. IC Role / Device Role / Timing Role: High-frequency AC-to-DC conversion stage; operates at 110–205 kHz with minimal reverse recovery loss. Use Value: 95 pF Cj and zero Qrr enable clean waveform capture and reduce inverter switching stress, extending coil and FET lifetime. |
| Portable Medical Monitor Battery Charger | Industrial IoT Sensor Node Power Supply |
Use Scenario: Linear-regulated battery charging circuit for Li-ion cells in handheld diagnostic devices, requiring low-noise, low-heat rectification. IC Role / Device Role / Timing Role: Input protection and polarity guard before LDO regulator; blocks reverse current during battery backup mode. Use Value: 500 μA max IRRM at 40 V ensures negligible standby drain, preserving >99% battery shelf life over 6-month storage. | Use Scenario: Auxiliary 3.3 V rail generation from 12 V industrial bus in battery-backed sensor nodes with strict thermal budget. IC Role / Device Role / Timing Role: Compact, self-cooled rectifier in isolated DC/DC module; handles intermittent 1.5 A peak loads. Use Value: 60 °C/W Rth(j-a) on small ceramic pad permits operation up to 70°C ambient without thermal throttling or derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB055LAM-40TR | Same VRRM (40 V), IF(AV) = 3.0 A, VFM = 0.51 V max at 3 A, larger SOD-123FL package (3.5 × 1.6 mm) | Higher current rating suits 3 A designs but requires larger PCB area; thermal resistance not specified for ceramic mount | Select RB055LAM-40TR when output current exceeds 2.0 A and board space allows 15% larger footprint |
| SS24-HF | VRRM = 40 V, IF(AV) = 2.0 A, VFM = 0.55 V max at 2 A, same M-FLAT™ footprint, RoHS-compliant lead-free finish | Identical electrical specs and package; differs only in plating and compliance documentation | Choose SS24-HF for RoHS-only programs where CMS11(TE12L)'s legacy Pb-containing finish is restricted |
Compared with RB055LAM-40TR and SS24-HF, CMS11(TE12L) offers the lowest thermal resistance (60 °C/W) under ceramic-mount conditions and is qualified for long-lifecycle portable equipment production since 2000, whereas alternatives prioritize newer compliance or higher current headroom.
Availability
CMS11(TE12L) is available at Aetrix Electronics and suitable for switching mode power supply applications, portable equipment battery charging circuits, and compact industrial DC/DC modules requiring stable component supply and proven field reliability.
Supply support for CMS11(TE12L) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on energy efficiency and miniaturization.
The CMS11(TE12L) belongs to Toshiba's M-FLAT™ Schottky rectifier product line, engineered specifically for high-frequency, space-constrained power conversion in consumer and portable electronics.
FAQ
What is the maximum allowable junction temperature for CMS11(TE12L) during continuous operation?
The absolute maximum junction temperature for CMS11(TE12L) is 150°C, but Toshiba recommends limiting continuous operation to Tj ≤ 120°C to ensure high reliability. This derating guideline is based on accelerated life testing and applies regardless of ambient temperature or mounting condition. For example, at 2.0 A load with 0.55 V forward drop, CMS11(TE12L) dissipates 1.1 W; using its 60 °C/W Rth(j-a) on ceramic board yields ΔT = 66°C, allowing safe operation up to ~54°C ambient before reaching 120°C junction.
Does CMS11(TE12L) have a specified reverse recovery time (trr)?
No - CMS11(TE12L) is a Schottky barrier rectifier and exhibits no minority-carrier storage, so it has no defined reverse recovery time (trr = 0 ns). This eliminates reverse recovery losses and associated EMI spikes common in PN-junction rectifiers, making CMS11(TE12L) ideal for high-frequency switching applications like QR flyback and resonant converters where trr-induced losses degrade efficiency.
Can CMS11(TE12L) be used in place of a standard PN junction rectifier in an existing 40 V, 2 A design?
Yes, CMS11(TE12L) can replace a PN rectifier in a 40 V, 2 A design, provided polarity is observed and thermal layout accommodates its specific Rth(j-a) values. Its lower VFM reduces conduction loss significantly - e.g., replacing a 1.0 V PN diode with CMS11(TE12L) at 2 A cuts power loss from 2.0 W to 1.1 W. However, higher IRRM (up to 500 μA) versus typical PN diodes (<1 μA) must be evaluated in high-impedance bias networks.
What is the soldering land recommendation for achieving the 60 °C/W thermal resistance spec of CMS11(TE12L)?
To achieve the published 60 °C/W junction-to-ambient thermal resistance, CMS11(TE12L) must be mounted on a ceramic board measuring 50 mm × 50 mm with a soldering land of exactly 2.0 mm × 2.0 mm. Deviations - such as smaller pads, different board material (e.g., FR-4), or reduced copper area - increase Rth(j-a) substantially; on glass-epoxy with 6 mm × 6 mm pads, Rth(j-a) rises to 135 °C/W. Layout adherence is mandatory to meet the datasheet's thermal performance claim.
Is CMS11(TE12L) compliant with RoHS and REACH regulations?
CMS11(TE12L) is manufactured per Toshiba's environmental compliance program, but its standard version (TE12L suffix) uses a Pb-containing termination finish. For RoHS-compliant designs, specify SS24-HF or consult Toshiba for Pb-free variants. REACH SVHC screening confirms no substances above threshold levels in active die or mold compound. Always verify latest compliance status via Toshiba's official product change notices before high-volume deployment.
CMS11(TE12L) Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- SOD-128
- Packaging:
- Cut Tape (CT)
- Product Status:
- Obsolete
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 40 V
- Current - Average Rectified (Io):
- 2A
- Voltage - Forward (Vf) (Max) @ If:
- 550 mV @ 2 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 500 µA @ 40 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- M-FLAT (2.4x3.8)
- Operating Temperature - Junction:
- -40°C ~ 150°C
CMS11(TE12L) FAQ
1.How can I place an order for CMS11(TE12L) through Aetrix?
Please submit a Request for Quotation (RFQ) for CMS11(TE12L) on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CMS11(TE12L) reliable?
The price and inventory of CMS11(TE12L) are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CMS11(TE12L) is usually 5 days.
3.What payment methods are accepted for CMS11(TE12L)?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CMS11(TE12L) transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CMS11(TE12L)?
CMS11(TE12L) orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CMS11(TE12L) order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CMS11(TE12L)?
For technical support, including CMS11(TE12L) datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CMS11(TE12L) requirements.
6.How does Aetrix verify that CMS11(TE12L) is sourced from the original manufacturer or authorized distributors?
All CMS11(TE12L) products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CMS11(TE12L) meets industry standards.
7.What is the process for return or replacement of CMS11(TE12L)?
All CMS11(TE12L) units undergo pre-shipment inspection (PSI). If there is an issue with CMS11(TE12L), returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CMS11(TE12L) part is unused and in its original packaging.
Return procedure for CMS11(TE12L):
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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