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Texas Instruments CP3BT10G38

Part No.:
CP3BT10G38
Manufacturer:
Texas Instruments
Category:
Application Specific Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixCP3BT10G38.pdf
Description:
IC CPU RISC W/LLC&USB 100-LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,386

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Product details

Overview

CP3BT10G38 from National Semiconductor is a reprogrammable connectivity processor integrating a 24 MHz CR16C RISC core, Bluetooth 1.1 Lower Link Controller, full-speed USB 1.1 node, 256 KB Flash program memory, 10 KB SRAM, and advanced audio interface - designed for embedded Bluetooth handheld and portable devices requiring compact size, low-voltage operation (2.5 V core / 2.5–3.3 V I/O), and multi-interface system integration.

For engineers reviewing the CP3BT10G38 datasheet, CP3BT10G38 pinout, CP3BT10G38 application, or CP3BT10G38 equivalent, this page delivers verified technical context, LQFP-100 package mapping, Bluetooth + USB co-processing capability, power management modes (Active/Idle/Halt/Power Save), and real-world use cases in Bluetooth headsets, USB peripheral bridges, and portable audio gateways.

Technical Context

The CP3BT10G38 implements a pipelined CR16C CPU core with zero-wait-state execution at up to 24 MHz, supported by on-chip PLL clock generation from a 12 MHz crystal and a dedicated 32.768 kHz slow clock for power management. Its Bluetooth LLC handles baseband timing, frequency hopping (1600 hops/s), and packet processing using 4.5 KB shared Bluetooth RAM and 1 KB sequencer RAM.

The USB 1.1 controller integrates a transceiver, Serial Interface Engine (SIE), and seven endpoint FIFOs (including bidirectional EP0), while the Advanced Audio Interface supports 8/13-bit PCM codecs and ISDN IOM-2 slave mode - all coordinated via a four-channel DMA controller and Multi-Input Wake-Up module with 16 configurable edge-triggered inputs.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture CR16C RISC CPU, pipelined, 0–24 MHz operation, 41.7 ns min instruction cycle time
Memory 256 KB Flash program memory (in-system programmable), 8 KB Flash data memory, 10 KB SRAM
Bluetooth Support Bluetooth 1.1-compliant Lower Link Controller with 4.5 KB Bluetooth RAM and 1 KB Sequencer RAM
USB Interface Full-speed USB 1.1 node with integrated transceiver, SIE, and 7 endpoint FIFOs (EP0 + 6 uni-directional)
Audio Interface Advanced Audio Interface (AAI) supporting 8/13-bit PCM codecs and IOM-2 slave mode for ISDN controllers
Power Management Four operational modes: Active (full speed), Power Save (slow clock), Idle (CPU halted), Halt (state retained)
Package & I/O LQFP-100 package; 37 software-configurable GPIO pins with TRI-STATE/push-pull/weak pull-up options

Pinout & Package

LQFP-100 (14 mm × 14 mm, 0.5 mm pitch), industrial temperature range (−40°C to +85°C), 2.5 V core supply, 2.5–3.3 V I/O voltage range.

Pin/Terminal Circuit Role Design Meaning
VDD_CORE Core Power Supply 2.5 V nominal supply for CPU, memory, and internal logic; decoupling required per datasheet layout guidelines
VDD_IO I/O Power Supply 2.5–3.3 V supply for all GPIO and peripheral I/O; supports mixed-voltage interfacing with external 3.3 V peripherals
XTAL_IN / XTAL_OUT Main Clock Crystal Interface 12 MHz fundamental-mode crystal connection for PLL reference; enables 24 MHz system clock generation
RTC_XTAL_IN / RTC_XTAL_OUT Slow Clock Crystal Interface Optional 32.768 kHz crystal for low-power timing and wake-up; used in Idle/Halt modes when main clock is gated
USB_DP / USB_DM USB Differential Data Pair Full-speed USB 1.1 physical layer interface; requires 27 Ω series resistors and proper PCB routing for EMI compliance
BT_RF_TX / BT_RF_RX Bluetooth RF Interface Digital baseband signals for BlueRF-compatible transceivers (e.g., LMX5252); not analog RF - connects to external RFIC
GPIO_B0–B7 General-Purpose I/O Port B 8-bit multiplexed port supporting UART, SPI, Microwire, ACCESS.bus, and AAI functions; individually configurable drive strength and pull options

Key Features

Feature Design Value
Integrated Bluetooth + USB Co-processing Enables single-chip Bluetooth-to-USB bridging without external host MCU - reduces BOM count and PCB area in dongles and adapters
On-chip CVSD/PCM Conversion Hardware-accelerated bidirectional voice codec conversion eliminates need for external audio DSP in headset applications
Dual 16-bit Multi-Function Timer + VTU Provides precise PWM generation, input capture, and real-time timing for motor control, LED dimming, and audio sample synchronization
Multi-Input Wake-Up (16 channels) Allows selective exit from Halt/Idle modes via GPIO, UART, timer, or Bluetooth events - critical for battery life in always-on portable devices
ACCESS.bus (I²C-compatible) Interface Enables direct connection to Philips-style smart battery packs, sensors, and PMICs without level-shifting or protocol translation

Applications

Bluetooth Headset Controller USB-to-Bluetooth Adapter

Use Scenario: Compact wireless headset with microphone, speaker, and battery management.

IC Role / Device Role / Timing Role: Central connectivity processor handling Bluetooth link control, CVSD voice encoding/decoding, USB HID profile for PC pairing, and real-time audio timing via AAI.

Use Value: Eliminates separate Bluetooth baseband IC and audio codec; 256 KB Flash stores full Bluetooth stack and custom UI firmware.

Use Scenario: Plug-and-play USB dongle enabling Bluetooth connectivity on legacy PCs or embedded hosts lacking native Bluetooth.

IC Role / Device Role / Timing Role: USB device controller presenting as composite HID + audio class, while managing Bluetooth piconet formation and RFCOMM tunneling.

Use Value: Full-speed USB 1.1 + Bluetooth 1.1 coexistence on one die reduces latency and simplifies driver development versus dual-chip solutions.

Portable Audio Gateway Industrial Wireless Sensor Hub

Use Scenario: Battery-powered audio gateway connecting analog line-in/line-out to Bluetooth headphones and USB storage.

IC Role / Device Role / Timing Role: Audio interface coordinator - routes PCM streams between AAI, CVSD engine, USB bulk endpoints, and I²C-connected DAC/ADC.

Use Value: On-chip 10 KB SRAM buffers real-time audio; 8 KB Flash data memory stores user EQ presets and device configuration.

Use Scenario: Ruggedized sensor node aggregating temperature, humidity, and motion data via I²C and GPIO, then transmitting over Bluetooth to a central gateway.

IC Role / Device Role / Timing Role: Low-power system controller - uses Halt mode between sensor reads, wakes via MIWU on interrupt, executes Bluetooth advertising, then returns to Halt.

Use Value: −40°C to +85°C rating and four power modes enable >1-year battery life in unattended deployments without external PMIC.

Equivalent & Alternatives

The following parts are listed as comparable options for similar connectivity processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
CSR BC417143 Dedicated Bluetooth baseband + HCI; no integrated USB node or Flash memory - requires external host MCU and memory Targeted at cost-sensitive Bluetooth headsets where USB functionality is unnecessary Choose CSR BC417143 only if USB bridging is omitted and external host control is acceptable
Texas Instruments CC2564C Bluetooth 4.0 LE + BR/EDR SoC with ARM Cortex-M0, but no native USB 1.1 node or AAI - relies on external USB bridge IC Optimized for BLE sensor networks and smartphone accessories, not USB-hosted Bluetooth peripherals Prefer CC2564C for BLE-centric designs with Android/iOS companion apps; CP3BT10G38 remains superior for USB dongle form factors

Compared with CSR BC417143 and CC2564C, the CP3BT10G38 uniquely integrates Bluetooth 1.1 LLC, full-speed USB 1.1, AAI, and 256 KB Flash in a single LQFP-100 package - making it the only viable monolithic solution for legacy USB-to-Bluetooth adapter designs requiring no external memory or host processor.

Availability

CP3BT10G38 is available at Aetrix Electronics and suitable for Bluetooth headset controllers, USB-to-Bluetooth adapters, portable audio gateways, industrial sensor hubs, and embedded voice communication systems requiring stable component supply across extended lifecycle windows.

Supply support for CP3BT10G38 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

National Semiconductor was a U.S.-based semiconductor company specializing in analog and mixed-signal ICs, acquired by Texas Instruments in 2011; its legacy connectivity products remain widely deployed in industrial and consumer systems.

The CP3BT10 product line was engineered specifically for embedded Bluetooth applications demanding tight integration of radio baseband, USB connectivity, audio processing, and real-time control - targeting handheld, portable, and battery-operated systems before the rise of modern BLE SoCs.

FAQ

What is the maximum operating frequency of the CP3BT10G38 CPU core?

The CP3BT10G38 features a CR16C RISC core rated for operation up to 24 MHz, achieving a minimum instruction cycle time of 41.7 ns when driven by the on-chip PLL using a 12 MHz external crystal. This frequency is confirmed in Section 2.0 (CPU Features) and the CP3BT10 Connectivity Processor Selection Guide, where CP3BT10G38 is explicitly listed with "Speed: 24 MHz".

Does the CP3BT10G38 include on-chip Flash memory for firmware storage?

Yes, the CP3BT10G38 integrates 256 KB of reprogrammable Flash program memory and 8 KB of Flash data memory. The program memory stores the Bluetooth protocol stack, real-time OS, and application code; the data memory retains user configuration settings. Both are in-system programmable without requiring external high-voltage programming circuitry.

Is the CP3BT10G38 compatible with Bluetooth 2.0 or later specifications?

No - the CP3BT10G38 implements Bluetooth Specification Version 1.1 only, as explicitly stated in Section 3.6 (Bluetooth LLC) and confirmed by its support for 1600 hops/s frequency hopping and baseband packet types defined in v1.1. It does not support EDR, Secure Simple Pairing, or later features introduced in Bluetooth 2.0+.

What package type and pin count does the CP3BT10G38 use?

The CP3BT10G38 is supplied in an LQFP-100 package (14 mm × 14 mm, 0.5 mm pitch), as documented in the CP3BT10 Connectivity Processor Selection Guide and Section 4.0 (Device Pinouts). This package provides access to all 37 GPIO pins, dual crystal interfaces, USB differential pair, Bluetooth RF control signals, and full external bus capability.

Can the CP3BT10G38 operate without an external 32.768 kHz crystal?

Yes - the CP3BT10G38 can derive its slow clock (32.768 kHz) from the main 12 MHz oscillator using an internal prescaler, making the external RTC crystal optional. This is confirmed in Section 3.9 (Triple Clock and Reset), which states: "The 32.768 kHz external crystal network is optional, because the low speed System Clock can be derived from the high-speed clock by a prescaler."

CP3BT10G38 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
100-LQFP
Packaging:
Bag
Product Status:
Obsolete
Programmable:
Not Verified
Applications:
Connectivity Processor
Core Processor:
CR16C
Program Memory Type:
FLASH (256kB)
Controller Series:
CP3000
RAM Size:
10K x 8
Interface:
Bluetooth, ACCESS.bus, Audio, UART, USB, Microwire/SPI
Number of I/O:
37
Voltage - Supply:
2.25V ~ 2.75V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14x14)

CP3BT10G38 FAQ

1.How can I place an order for CP3BT10G38 through Aetrix?

Please submit a Request for Quotation (RFQ) for CP3BT10G38 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CP3BT10G38 reliable?

The price and inventory of CP3BT10G38 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CP3BT10G38 is usually 5 days.

3.What payment methods are accepted for CP3BT10G38?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CP3BT10G38 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CP3BT10G38?

CP3BT10G38 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CP3BT10G38 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CP3BT10G38?

For technical support, including CP3BT10G38 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CP3BT10G38 requirements.

6.How does Aetrix verify that CP3BT10G38 is sourced from the original manufacturer or authorized distributors?

All CP3BT10G38 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CP3BT10G38 meets industry standards.

7.What is the process for return or replacement of CP3BT10G38?

All CP3BT10G38 units undergo pre-shipment inspection (PSI). If there is an issue with CP3BT10G38, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CP3BT10G38 part is unused and in its original packaging.

Return procedure for CP3BT10G38:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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