Toshiba Semiconductor and Storage CRG09(TE85L,Q,M)

Overview

CRG09(TE85L,Q,M) from TOSHIBA is a silicon diffused general-purpose surface-mount rectifier diode in the S-FLAT^TM package, rated for 400 V repetitive peak reverse voltage (V_RRM), 1.0 A average forward current (I_F(AV)), and 1.1 V maximum forward voltage at 0.7 A. It delivers high ESD robustness (25 kV per IEC 61000-4-2) and supports compact power supply designs in consumer and industrial AC/DC converters.

For engineers reviewing the CRG09(TE85L,Q,M) datasheet, CRG09(TE85L,Q,M) pinout, CRG09(TE85L,Q,M) application, or CRG09(TE85L,Q,M) equivalent, key selection criteria include thermal resistance (R_th(j-a) = 65 °C/W on ceramic board), surge capability (I_FSM = 15 A at 50 Hz), junction temperature range (−40 to +150 °C), and S-FLAT^TM footprint compatibility with high-density PCB layouts.

Technical Context

The CRG09(TE85L,Q,M) is a single-phase, standard recovery silicon rectifier optimized for low-cost, space-constrained AC/DC front-end stages. Its diffusion process ensures stable V_F performance across temperature, with typical forward voltage of 0.95 V at 0.7 A and 1.00 V at 1.0 A under pulse test conditions.

Thermal design is critical: R_th(j-a) varies significantly with PCB mounting-65 °C/W on 2 mm × 2 mm ceramic land versus 130 °C/W on 6 mm × 6 mm glass-epoxy land. The device requires derating above 66 °C ambient per I_F(AV) specification and must be operated below 120 °C junction temperature for high reliability.

Key Specifications

Pinout & Package

The CRG09(TE85L,Q,M) uses the S-FLAT^TM surface-mount package (JEITA code 3-2A1A), measuring 3.5 mm × 2.6 mm × 0.98 mm with 0.65 mm lead pitch. It features two terminals: anode and cathode, marked with polarity indicator on the top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar general-purpose rectifier applications.

Compared with ROHM RB050M-40 and ON Semiconductor MUR1040, the CRG09(TE85L,Q,M) offers optimal balance of ESD hardness, SMT footprint, and thermal performance on ceramic substrates-making it preferred for cost-sensitive, space-limited, and ESD-prone consumer power supplies.

Availability

CRG09(TE85L,Q,M) is available at Aetrix Electronics and suitable for AC/DC wall adapters, LED driver input rectification, and industrial control power supplies requiring stable component supply, consistent parametric performance, and RoHS-compliant sourcing.

Supply support for CRG09(TE85L,Q,M) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in discrete devices, power ICs, and memory solutions, with global manufacturing and quality systems certified to ISO 9001 and IATF 16949.

The CRG09(TE85L,Q,M) belongs to Toshiba's general-purpose rectifier family designed for cost-effective, reliable AC/DC conversion in consumer electronics, industrial equipment, and white goods-emphasizing manufacturability, ESD resilience, and thermal predictability.

FAQ

What is the maximum allowable junction temperature for CRG09(TE85L,Q,M)?

The absolute maximum junction temperature for CRG09(TE85L,Q,M) is +150 °C, but Toshiba recommends limiting operation to ≤120 °C for high reliability. This derating guideline is based on accelerated life testing and applies regardless of ambient temperature or mounting condition. Exceeding 120 °C continuously may accelerate parameter drift and reduce lifetime. The CRG09(TE85L,Q,M) datasheet provides Ta–IF(AV) curves to assist in selecting appropriate derating margins.

Is CRG09(TE85L,Q,M) RoHS compliant?

Yes, CRG09(TE85L,Q,M) meets the EU RoHS Directive 2011/65/EU requirements for restricted substances. Toshiba confirms compliance via material declarations and internal testing; the device contains no lead, mercury, cadmium, hexavalent chromium, PBB, or PBDE above threshold limits. Full compliance documentation, including Certificate of Conformance, is available upon request for CRG09(TE85L,Q,M) orders placed through authorized channels.

What does the marking "G9" indicate on CRG09(TE85L,Q,M)?

The marking "G9" on the top surface of CRG09(TE85L,Q,M) is the Toshiba abbreviation code identifying the device as the CRG09 rectifier. It appears alongside the cathode band and lot code. This marking is standardized across Toshiba's S-FLAT^TM rectifier series and is used for visual inspection and traceability during assembly and field service. No functional or parametric difference exists between CRG09(TE85L,Q,M) units bearing the G9 mark.

Can CRG09(TE85L,Q,M) replace a 1N4007 in SMT designs?

No-CRG09(TE85L,Q,M) is not a direct SMT replacement for the through-hole 1N4007. While both share 1.0 A I_F(AV) and 1000 V V_RRM (1N4007) vs. 400 V (CRG09), the CRG09(TE85L,Q,M) has lower voltage rating, different package (S-FLAT^TM vs. DO-41), and distinct thermal characteristics. Substitution requires redesigning the PCB footprint, verifying voltage margin, and revalidating thermal performance. CRG09(TE85L,Q,M) targets space-constrained applications where 400 V suffices.

What is the thermal resistance from junction to lead (R_th(j-ℓ)) for CRG09(TE85L,Q,M)?

The junction-to-lead thermal resistance R_th(j-ℓ) for CRG09(TE85L,Q,M) is 20 °C/W, measured under standard test conditions. This value reflects heat transfer path from die to solder joint and is independent of PCB layout. It is used in transient thermal analysis and helps estimate localized heating at the pad interface during pulsed operation. For steady-state design, R_th(j-a) (65 °C/W on ceramic board) remains the primary metric for CRG09(TE85L,Q,M) thermal management.