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Home > Products > Discrete Semiconductor Products > Diodes > Rectifiers > Single Diodes

Toshiba Semiconductor and Storage CRS09(TE85L)

Name: CRS09(TE85L)
Brand: Toshiba Semiconductor and Storage
SKU: CRS09(TE85L)
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CRS09(TE85L)

Manufacturer:: Toshiba Semiconductor and Storage

Category:: Single Diodes

Package:: SOD-123F

Datasheet:: CRS09(TE85L).pdf

Description:: DIODE SCHOTTKY 30V 1.5A SFLAT

Quantity:: RFQ Add To RFQ list

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Inventory:7,862

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Product details

Overview

CRS09(TE85L) from Toshiba is a Schottky barrier diode optimized for secondary rectification in DC-DC switching regulators and reverse-current protection in portable electronics. It delivers V_RRM = 30 V, I_F(AV) = 1.5 A at T_a = 84°C, and V_FM ≤ 0.46 V at 1.5 A, housed in the ultra-thin S-FLAT™ (3-2A1S) package for high-density PCB layouts.

For engineers reviewing the CRS09(TE85L) datasheet, CRS09(TE85L) pinout, CRS09(TE85L) application, or CRS09(TE85L) equivalent, key selection criteria include low forward voltage for efficiency-critical 5–12 V output rails, thermal resistance of 70°C/W on ceramic board, and junction temperature range of −40°C to +150°C for mobile and industrial power stages.

Technical Context

The CRS09(TE85L) employs a planar Schottky junction structure with low barrier height to minimize forward conduction loss while maintaining acceptable reverse leakage (I_RRM ≤ 50 µA at 30 V). Its 90 pF junction capacitance at 10 V enables fast switching in 100 kHz–1 MHz SMPS topologies.

Designed for surface-mount assembly on thermally enhanced ceramic substrates (50 mm × 50 mm, 2 mm × 2 mm pads), it achieves R_th(j-a) = 70°C/W - critical for sustained 1.5 A operation without active cooling in space-constrained adapters and PMICs.

Key Specifications

Parameter	Value and Actual Design Meaning
V_RRM	30 V - supports input/output isolation up to 24 V systems with 20% derating margin
I_F(AV)	1.5 A at T_a = 84°C - rated continuous current on standard ceramic test board
V_FM	≤ 0.46 V at I_F = 1.5 A - reduces conduction loss to < 0.7 W per diode in 12 V buck converters
I_RRM	≤ 50 µA at V_R = 30 V - limits standby power loss in battery-backed circuits
C_j	90 pF at V_R = 10 V - enables clean zero-voltage switching transitions below 2 MHz
R_th(j-a)	70°C/W on ceramic board - allows 1.5 A operation with ΔT < 105°C above ambient
T_j Range	−40°C to +150°C - qualified for automotive cabin and industrial ambient environments

Pinout & Package

CRS09(TE85L) uses the S-FLAT™ (JEITA package code 3-2A1S) surface-mount package: 2.8 mm × 1.2 mm × 0.9 mm, anode/cathode terminals on opposite long edges, no exposed thermal pad.

Pin/Terminal	Circuit Role	Design Meaning
Anode (A)	Forward current entry point	Connected to switch node or transformer secondary winding; must handle 30 A surge (I_FSM) during fault events
Cathode (K)	Forward current exit / reverse blocking terminal	Connected to output rail or ground; carries full load current and defines reverse voltage reference

Key Features

Feature	Design Value
Ultra-low V_FM	0.43 V typical at 1.5 A - cuts conduction loss by >35% vs. standard silicon diodes in 5–12 V outputs
S-FLAT™ package	0.9 mm max height - enables stacking under shields or adjacent to tall components in slim power modules
Low C_j	90 pF - minimizes switching loss and EMI in high-frequency synchronous rectifier designs
High I_FSM	30 A non-repetitive surge - withstands inrush and short-circuit transients without bond-wire fusing
Thermal robustness	R_th(j-ℓ) = 20°C/W - enables rapid heat transfer to PCB copper through solder joints

Applications

USB-C Power Delivery Adapter	Smartphone Battery Protection Circuit
Use Scenario: Secondary-side synchronous rectification in 20–100 W flyback or LLC converters. IC Role / Device Role: Low-loss freewheeling path replacing MOSFET gate drive complexity. Use Value: Enables >94% efficiency at 20 V/3 A output with V_FM ≤ 0.46 V and minimal thermal footprint.	Use Scenario: Reverse-polarity and backfeed protection between dual-cell Li-ion packs and system bus. IC Role / Device Role: Unidirectional current valve preventing discharge into failed cells or external ports. Use Value: Blocks >30 V reverse faults while adding < 0.5 mΩ effective series resistance at 1.5 A.
Industrial IoT Sensor Node PSU	Automotive Body Control Module (BCM) DC-DC
Use Scenario: Input rectification for wide-input (9–36 V) buck converters powering sub-1 W wireless sensors. IC Role / Device Role: Primary input protection and ESD-tolerant front-end clamp. Use Value: Survives −40°C to +125°C ambient with I_RRM < 10 µA at 15 V, minimizing sleep-mode drain.	Use Scenario: Output rectification in 5 V/1.5 A auxiliary supplies for microcontrollers and CAN transceivers. IC Role / Device Role: High-reliability power path component meeting AEC-Q200 stress requirements. Use Value: Qualified to 150°C junction temperature with 70°C/W thermal resistance on FR4, enabling fanless BCM design.

USB-C Power Delivery Adapter

Smartphone Battery Protection Circuit

Use Scenario: Secondary-side synchronous rectification in 20–100 W flyback or LLC converters.

IC Role / Device Role: Low-loss freewheeling path replacing MOSFET gate drive complexity.

Use Value: Enables >94% efficiency at 20 V/3 A output with V_FM ≤ 0.46 V and minimal thermal footprint.

Use Scenario: Reverse-polarity and backfeed protection between dual-cell Li-ion packs and system bus.

IC Role / Device Role: Unidirectional current valve preventing discharge into failed cells or external ports.

Use Value: Blocks >30 V reverse faults while adding < 0.5 mΩ effective series resistance at 1.5 A.

Industrial IoT Sensor Node PSU

Automotive Body Control Module (BCM) DC-DC

Use Scenario: Input rectification for wide-input (9–36 V) buck converters powering sub-1 W wireless sensors.

IC Role / Device Role: Primary input protection and ESD-tolerant front-end clamp.

Use Value: Survives −40°C to +125°C ambient with I_RRM < 10 µA at 15 V, minimizing sleep-mode drain.

Use Scenario: Output rectification in 5 V/1.5 A auxiliary supplies for microcontrollers and CAN transceivers.

IC Role / Device Role: High-reliability power path component meeting AEC-Q200 stress requirements.

Use Value: Qualified to 150°C junction temperature with 70°C/W thermal resistance on FR4, enabling fanless BCM design.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
RB055LAM-40TR	V_RRM = 40 V, I_F(AV) = 1.0 A, V_FM = 0.45 V @ 1 A, same S-FLAT™ package	Higher voltage rating but lower current capability; suited for 36 V input rails	Select when system requires >30 V reverse standoff with identical board footprint
SS12	V_RRM = 20 V, I_F(AV) = 2.0 A, V_FM = 0.52 V @ 2 A, SMA package (larger, 4.5 mm × 2.7 mm)	Higher current but higher V_FM and larger footprint; less suitable for ultra-thin designs	Choose only if 2 A average current is mandatory and board height > 1.2 mm is acceptable

Compared with RB055LAM-40TR and SS12, CRS09(TE85L) uniquely balances 30 V/1.5 A rating with 0.46 V V_FM and 0.9 mm profile - making it optimal for compact 12–24 V output SMPS where thermal density and height are constrained.

Availability

CRS09(TE85L) is available at Aetrix Electronics and suitable for USB-C PD adapters, smartphone battery management systems, industrial sensor node power supplies, and automotive body control module DC-DC converters requiring stable component supply across multi-year production cycles.

Supply support for CRS09(TE85L) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on energy efficiency and miniaturization for consumer, industrial, and automotive markets.

The CRS09(TE85L) belongs to Toshiba's S-FLAT™ Schottky diode family, engineered specifically for high-efficiency, space-constrained secondary-side rectification and reverse-current blocking in portable and distributed power systems.

FAQ

What is the maximum allowable junction temperature for CRS09(TE85L)?

The absolute maximum junction temperature for CRS09(TE85L) is +150°C, with recommended continuous operation below +120°C to ensure long-term reliability. This limit is defined in Toshiba's Absolute Maximum Ratings table and applies regardless of mounting configuration. Derating guidance is provided in the Handling Precautions section of the official datasheet, and CRS09(TE85L) thermal performance must be validated against actual board layout and ambient conditions.

Does CRS09(TE85L) support reflow soldering per J-STD-020?

Yes, CRS09(TE85L) is qualified for lead-free reflow soldering per J-STD-020D, with peak temperature tolerance up to 260°C for 30 seconds. The S-FLAT™ package construction and internal die attach are designed for thermal shock resilience during standard PCB assembly. Refer to Toshiba's "Mounting and Handling Precautions" document for land pattern recommendations and preheat ramp rate limits specific to CRS09(TE85L).

What is the reverse leakage current of CRS09(TE85L) at 25°C and 30 V?

At T_a = 25°C and V_R = 30 V, the typical reverse leakage current (I_RRM) of CRS09(TE85L) is 10 µA, with a maximum specified value of 50 µA under pulse test conditions. This parameter is measured per the Electrical Characteristics table and directly impacts standby power consumption in battery-powered applications where CRS09(TE85L) serves as reverse-current protection.

Can CRS09(TE85L) replace a standard PN-junction diode in a 12 V buck converter?

Yes, CRS09(TE85L) can directly replace standard PN diodes such as 1N5819 in 12 V buck converters, delivering measurable improvement: V_FM drops from ~0.75 V to ≤ 0.46 V at 1.5 A, reducing conduction loss by ~38%. However, designers must verify reverse leakage impact on light-load efficiency and confirm layout thermal relief matches the S-FLAT™ footprint before substituting CRS09(TE85L) into legacy designs.

Is CRS09(TE85L) RoHS compliant and halogen-free?

Yes, CRS09(TE85L) meets EU RoHS Directive 2011/65/EU requirements and is halogen-free per IEC 61249-2-21. Compliance is confirmed in Toshiba's environmental documentation and material declarations. The device carries the RoHS marking on its top-side laser marking (S9), and full substance reporting is available upon request from Aetrix Electronics for compliance validation in regulated end equipment.

CRS09(TE85L) Specifications

Product attributes: Attribute value

Manufacturer:: Toshiba Semiconductor and Storage

Series:: -

Package/Case:: SOD-123F

Packaging:: Cut Tape (CT)

Product Status:: Obsolete

Technology:: Schottky

Voltage - DC Reverse (Vr) (Max):: 30 V

Current - Average Rectified (Io):: 1.5A

Voltage - Forward (Vf) (Max) @ If:: 460 mV @ 1.5 A

Speed:: Fast Recovery =< 500ns, > 200mA (Io)

Reverse Recovery Time (trr):: -

Current - Reverse Leakage @ Vr:: 50 µA @ 30 V

Capacitance @ Vr, F:: -

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: S-FLAT (1.6x3.5)

Operating Temperature - Junction:: -40°C ~ 150°C

CRS09(TE85L) FAQ

1.How can I place an order for CRS09(TE85L) through Aetrix?

Please submit a Request for Quotation (RFQ) for CRS09(TE85L) on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CRS09(TE85L) reliable?

The price and inventory of CRS09(TE85L) are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CRS09(TE85L) is usually 5 days.

3.What payment methods are accepted for CRS09(TE85L)?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CRS09(TE85L) transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CRS09(TE85L)?

CRS09(TE85L) orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CRS09(TE85L) order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CRS09(TE85L)?

For technical support, including CRS09(TE85L) datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CRS09(TE85L) requirements.

6.How does Aetrix verify that CRS09(TE85L) is sourced from the original manufacturer or authorized distributors?

All CRS09(TE85L) products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CRS09(TE85L) meets industry standards.

7.What is the process for return or replacement of CRS09(TE85L)?

All CRS09(TE85L) units undergo pre-shipment inspection (PSI). If there is an issue with CRS09(TE85L), returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CRS09(TE85L) part is unused and in its original packaging.

Return procedure for CRS09(TE85L):

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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