Toshiba Semiconductor and Storage CRS15I30B(TE85L,QM
- Part No.:
- CRS15I30B(TE85L,QM
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Single Diodes
- Package:
- SOD-123F
- Datasheet:
-
CRS15I30B(TE85L,QM.pdf
- Description:
- DIODE SCHOTTKY 30V 1.5A S-FLAT
- Quantity:
- Payment:

- Shipping:

Inventory:5,995
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Product details
Overview
CRS15I30B from Toshiba is a Schottky barrier diode optimized for secondary rectification and reverse-current protection in compact DC-DC converters and mobile power rails, with VRRM = 30 V, IF(AV) = 1.5 A, VFM ≤ 0.4 V at 1.5 A, Rth(j-a) = 70 °C/W (ceramic board), and housed in the ultra-thin 3-2A1S (S-FLAT) package.
For engineers reviewing the CRS15I30B datasheet, CRS15I30B pinout, CRS15I30B application, or CRS15I30B equivalent, key selection factors include low forward voltage for efficiency-critical 3.3 V/5 V output stages, thermal performance under high-density PCB layout constraints, and suitability for space-constrained portable electronics where junction-to-ambient thermal resistance and peak surge current handling (IFSM = 30 A) are design-critical.
Technical Context
The CRS15I30B employs a planar Schottky junction structure to achieve fast switching (no minority-carrier storage) and low conduction loss, targeting high-frequency synchronous rectifier replacement in buck converters operating up to 1 MHz. Its 30 V VRRM rating aligns with 24 V input systems derated to 15–20 V working voltage.
Thermal design relies on direct cathode-lead heat path (Rth(j-ℓ) = 20 °C/W) and requires careful land pattern sizing per Fig. 9.1; junction temperature must be limited to ≤120 °C under worst-case ambient and load conditions to ensure reliability, per Toshiba's derating guidance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 30 V - Maximum reverse blocking voltage; sets upper limit for input/output rail separation in isolated/non-isolated converters. |
| IF(AV) | 1.5 A - Continuous average forward current; defines steady-state power delivery capability in secondary-side rectification. |
| VFM (max) | 0.40 V @ 1.5 A - Peak forward voltage; directly determines conduction loss (Pcond ≈ 0.6 W at 1.5 A), critical for thermal budget. |
| IFSM | 30 A - Non-repetitive surge current (50 Hz half-sine); supports brief inrush or fault-current events without failure. |
| Rth(j-a) | 70 °C/W - Junction-to-ambient thermal resistance on 50 mm × 50 mm ceramic board; used to calculate ΔTj under real PCB thermal conditions. |
| Cj | 82 pF @ 10 V - Junction capacitance; impacts high-frequency switching noise and EMI in fast-edge applications. |
Pinout & Package
Package: 3-2A1S (Toshiba S-FLAT), surface-mount, ultra-thin profile (0.6 mm max height), 0.013 g typical weight, optimized for high-density assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode | Input terminal for forward conduction; connects to switch node or higher-potential rail in rectifier configuration. |
| 2 | Cathode | Output terminal for forward conduction; ties to output capacitor or ground return; primary thermal path to PCB via solder land. |
Key Features
| Feature | Design Value |
|---|---|
| Low VFM | VFM ≤ 0.4 V at 1.5 A reduces conduction loss by >30% vs. standard silicon diodes, improving efficiency in 3.3 V/5 V output stages. |
| S-FLAT Package | 3-2A1S footprint enables <10 mm² board area usage and supports automated optical inspection (AOI) due to coplanar leads. |
| High IFSM Rating | 30 A non-repetitive surge withstand allows use in systems with high-capacitance outputs or transient-limited input stages without external fusing. |
| Controlled Cj | 82 pF junction capacitance minimizes reverse recovery ringing and EMI generation during hard-switching transitions. |
Applications
| USB Power Delivery Adapter | Smartphone PMIC Output Stage |
|---|---|
Use Scenario: Secondary-side rectification in 20–30 W GaN-based USB PD adapters operating at 200–500 kHz. IC Role / Device Role: Freewheeling diode replacing synchronous MOSFET in cost-sensitive designs; handles reverse recovery during high-side switch turn-off. Use Value: Low VFM ensures ≥94% efficiency at full load while maintaining thermal safety on compact 2-layer PCBs. | Use Scenario: Reverse-current protection between battery and system rail in dual-battery smartphones. IC Role / Device Role: Unidirectional isolation diode preventing backfeed during hot-swap or charger insertion events. Use Value: 30 V VRRM provides 2× margin over 12 V battery stack; thin S-FLAT package fits within 0.8 mm Z-height constraints. |
| Industrial IoT Sensor Node | Wearable Charging Circuit |
Use Scenario: Input rectification for 5 V buck-boost converter powering sub-GHz RF modules in battery-operated gateways. IC Role / Device Role: Input-side Schottky clamp limiting reverse leakage during sleep mode and enabling fast wake-up response. Use Value: 14 µA IRRM at 5 V ensures <1 µA standby drain, extending 10-year battery life targets. | Use Scenario: Output rectification in miniature wireless charging receiver ICs delivering regulated 3.3 V to BLE SoCs. IC Role / Device Role: Low-loss output diode minimizing voltage drop across tight 3.3 V ±5% tolerance rails. Use Value: 0.34 V typical VFM at 1.0 A maintains ≥3.1 V output under 1 A load, avoiding brownout resets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB055LAM-30TR | VRRM = 30 V, IF(AV) = 1.5 A, VFM = 0.45 V (max) @ 1.5 A, same 3-2A1S package | Higher VFM increases conduction loss by ~0.075 W at 1.5 A; slightly lower IFSM (25 A) | Acceptable where 50 mV higher VFM is tolerable and thermal margin exists. |
| SS13-E3/5AT | VRRM = 30 V, IF(AV) = 1.0 A, VFM = 0.5 V (max) @ 1.0 A, SMA package (larger footprint) | Lower current rating and larger package require PCB redesign; 30% higher conduction loss at rated current | Only suitable if board space permits SMA and load current remains ≤1.0 A. |
Compared with RB055LAM-30TR and SS13-E3/5AT, the CRS15I30B delivers the lowest VFM in its class and smallest footprint, making it optimal for thermally constrained, high-efficiency 1.5 A rectification where minimal voltage drop and board area are prioritized.
Availability
CRS15I30B is available at Aetrix Electronics and suitable for USB PD adapters, smartphone power management IC output stages, and industrial IoT sensor nodes requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production lots.
Supply support for CRS15I30B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on energy efficiency, miniaturization, and automotive-grade reliability.
The CRS15I30B belongs to Toshiba's S-FLAT Schottky diode product line, engineered specifically for high-density, high-efficiency DC-DC conversion in portable and battery-powered electronics where low forward voltage and ultra-thin packaging are essential.
FAQ
What is the maximum junction temperature specification for the CRS15I30B?
The absolute maximum junction temperature (Tj) for the CRS15I30B is 150 °C, but Toshiba recommends limiting operation to ≤120 °C under worst-case conditions to ensure long-term reliability. This derating guideline applies regardless of whether the device is mounted on ceramic or glass-epoxy PCBs and is based on thermal stress analysis in the Toshiba Semiconductor Reliability Handbook. The CRS15I30B must be thermally modeled using its specified Rth(j-a) = 70 °C/W (ceramic) or Rth(j-a) = 140 °C/W (glass-epoxy) to verify compliance.
Does the CRS15I30B have a specified reverse recovery time (trr)?
No - the CRS15I30B is a Schottky barrier diode and exhibits no minority-carrier storage, so it has no defined reverse recovery time (trr). Instead, its switching behavior is governed by junction capacitance (Cj = 82 pF @ 10 V) and series resistance, enabling clean, fast turn-off with negligible switching loss. This characteristic makes the CRS15I30B especially suitable for high-frequency DC-DC converters where trr-related losses dominate in PN-junction diodes.
What is the marking code printed on the CRS15I30B package?
Each CRS15I30B unit is laser-marked with the code "SP" on the top surface of the 3-2A1S package, as confirmed in Toshiba's official marking diagram (Fig. 7.1). This two-character code uniquely identifies the CRS15I30B variant within Toshiba's S-FLAT Schottky family and is used for traceability and counterfeit detection during incoming inspection.
Can the CRS15I30B be used in automotive applications?
The CRS15I30B is not qualified to AEC-Q101 or any automotive-grade reliability standard and is explicitly excluded from unintended use in automotive systems per Toshiba's restrictions. Its datasheet does not specify automotive temperature range (−40 °C to +125 °C), nor does it provide PPAP documentation or automotive-specific failure rate data. For automotive applications, engineers must select a formally qualified part such as the Toshiba TPSCRS15I30BQ or equivalent AEC-Q101-compliant Schottky diode instead of the CRS15I30B.
How does the thermal resistance of the CRS15I30B vary with PCB mounting conditions?
Rth(j-a) for the CRS15I30B varies significantly with PCB construction: it is 70 °C/W when mounted on a 50 mm × 50 mm ceramic board with 2 mm × 2 mm solder lands, but rises to 140 °C/W on a standard 50 mm × 50 mm glass-epoxy board with 6 mm × 6 mm lands. This 2× difference means thermal design must reference the exact board material, thickness, and land pattern dimensions used - Toshiba provides land pattern Fig. 9.1 strictly for reference, and actual Rth(j-a) must be measured or simulated for the target layout. The CRS15I30B's Rth(j-ℓ) = 20 °C/W remains stable and provides a reliable baseline for cathode-lead thermal modeling.
CRS15I30B(TE85L,QM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- SOD-123F
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 1.5A
- Voltage - Forward (Vf) (Max) @ If:
- 400 mV @ 1.5 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 100 µA @ 30 V
- Capacitance @ Vr, F:
- 82pF @ 10V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- S-FLAT (1.6x3.5)
- Operating Temperature - Junction:
- 150°C (Max)
CRS15I30B(TE85L,QM FAQ
1.How can I place an order for CRS15I30B(TE85L,QM through Aetrix?
Please submit a Request for Quotation (RFQ) for CRS15I30B(TE85L,QM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CRS15I30B(TE85L,QM reliable?
The price and inventory of CRS15I30B(TE85L,QM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CRS15I30B(TE85L,QM is usually 5 days.
3.What payment methods are accepted for CRS15I30B(TE85L,QM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CRS15I30B(TE85L,QM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CRS15I30B(TE85L,QM?
CRS15I30B(TE85L,QM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CRS15I30B(TE85L,QM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CRS15I30B(TE85L,QM?
For technical support, including CRS15I30B(TE85L,QM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CRS15I30B(TE85L,QM requirements.
6.How does Aetrix verify that CRS15I30B(TE85L,QM is sourced from the original manufacturer or authorized distributors?
All CRS15I30B(TE85L,QM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CRS15I30B(TE85L,QM meets industry standards.
7.What is the process for return or replacement of CRS15I30B(TE85L,QM?
All CRS15I30B(TE85L,QM units undergo pre-shipment inspection (PSI). If there is an issue with CRS15I30B(TE85L,QM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CRS15I30B(TE85L,QM part is unused and in its original packaging.
Return procedure for CRS15I30B(TE85L,QM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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