Toshiba Semiconductor and Storage CRS20I40B(TE85L,QM
- Part No.:
- CRS20I40B(TE85L,QM
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Single Diodes
- Package:
- SOD-123F
- Datasheet:
-
CRS20I40B(TE85L,QM.pdf
- Description:
- DIODE SCHOTTKY 40V 2A S-FLAT
- Quantity:
- Payment:

- Shipping:

Inventory:4,727
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CRS20I40B from Toshiba Electronic Devices & Storage Corporation is a Schottky barrier diode optimized for secondary rectification and reverse-current protection in compact DC-DC converters and mobile power circuits. It delivers VRRM = 40 V, IF(AV) = 2.0 A, VFM ≤ 0.52 V at 2.0 A, Rth(j-a) = 70 °C/W (on ceramic board), and uses the ultra-thin S-FLAT (3-2A1S) surface-mount package.
For engineers reviewing the CRS20I40B datasheet, CRS20I40B pinout, CRS20I40B application, or CRS20I40B equivalent, this page provides verified electrical specs, thermal behavior under real mounting conditions, junction-to-lead thermal resistance data, and validated use cases in high-density portable power systems.
Technical Context
This Schottky diode employs a low-barrier metal-semiconductor junction to minimize forward conduction loss while maintaining fast switching response-critical for high-frequency synchronous rectification in buck converters operating above 300 kHz. Its 40 V VRRM rating targets 5–24 V output rails where low VF directly improves efficiency over silicon PN diodes.
The S-FLAT package enables direct thermal coupling to PCB copper via cathode lead, with Rth(j-ℓ) = 20 °C/W enabling effective heat extraction in space-constrained layouts. Junction temperature must be derated per Toshiba's reliability guidelines when ambient exceeds 85 °C or surge current exceeds 25 A.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 40 V - supports input/output voltage rails up to 32 V DC with 20 % safety margin per Toshiba derating guidance |
| IF(AV) | 2.0 A - continuous DC current handling at Ta = 25 °C on 50 mm × 50 mm ceramic board |
| VFM (max) | 0.52 V @ 2.0 A - reduces conduction loss to ≤1.04 W, critical for thermal management in sealed enclosures |
| IFSM | 25 A - non-repetitive surge rating for startup/short-circuit events in battery-powered systems |
| Rth(j-a) | 70 °C/W - measured on 50 mm × 50 mm ceramic board with 2 mm × 2 mm solder land |
| Cj | 62 pF @ 10 V - limits switching noise and EMI in high-dv/dt applications like USB PD adapters |
| Tj (max) | 150 °C - defines absolute upper limit; design target is ≤120 °C per Toshiba derating recommendations |
Pinout & Package
Package: S-FLAT (TOSHIBA designation 3-2A1S), ultra-thin surface-mount package with exposed cathode lead for thermal enhancement. Dimensions: 2.9 mm × 1.6 mm × 0.6 mm (L × W × H), weight 0.013 g (typ.).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode | Forward current entry point; connects to switch node in synchronous rectifier topology |
| 2 | Cathode | Current exit and primary thermal path; soldered to large copper pour for heat dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Low forward voltage | VFM ≤ 0.52 V at 2.0 A enables ≥2 % efficiency gain vs. standard silicon diodes in 5 V/2 A outputs |
| S-FLAT thin-package integration | 0.6 mm height allows stacking under shields or in ultra-slim mobile device power modules |
| Junction-to-lead thermal resistance | Rth(j-ℓ) = 20 °C/W supports >1.5 W power dissipation with minimal PCB copper area |
| Controlled reverse leakage | IRRM ≤ 100 µA at 40 V ensures stable biasing in low-power standby circuits |
Applications
| USB-C Power Delivery Adapter | Smartphone PMIC Secondary Rectifier |
|---|---|
Use Scenario: Secondary-side rectification in 20–45 W GaN-based USB-C adapters operating at 200–500 kHz switching frequency. IC Role / Device Role / Timing Role: Low-loss freewheeling diode replacing synchronous MOSFETs in cost-sensitive designs. Use Value: Reduces BOM count and control complexity while maintaining >92 % efficiency at full load due to sub-0.52 V VFM. | Use Scenario: Reverse-current blocking between battery and system rail during charging and discharging cycles in smartphone power management ICs. IC Role / Device Role / Timing Role: Unidirectional isolation element preventing backfeed from LDOs or DC-DC outputs into battery path. Use Value: Eliminates risk of battery drain during sleep mode with <100 µA IRRM at 4.4 V, extending standby time by >15 %. |
| Industrial IoT Sensor Node Power | Wearable Device Charging Circuit |
Use Scenario: Input rectification for 3.3 V/1.2 A isolated flyback supplies powering wireless sensor nodes in factory automation. IC Role / Device Role / Timing Role: High-reliability output rectifier operating continuously at 65 °C ambient with minimal derating. Use Value: Enables 10-year field life with junction temperature maintained ≤115 °C using 6 mm × 6 mm land on FR-4, per Toshiba reliability handbook derating curves. | Use Scenario: Reverse-polarity protection and charge-path isolation in compact earbud charging cases with Li-ion battery and 5 V USB input. IC Role / Device Role / Timing Role: Fail-safe blocking diode placed between USB port and linear charger IC input. Use Value: Prevents damage from accidental reverse connection while adding only 0.013 g mass and 2.9 mm × 1.6 mm footprint. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB055LAM-40TR | VRRM = 40 V, IF(AV) = 3.0 A, VFM = 0.45 V (typ.) @ 3 A, SOD-123FL package (1.7 mm × 2.8 mm) | Larger footprint and higher IF(AV) suit higher-current 12 V rails; not suitable for <3 mm width constraints | Select when average current exceeds 2.0 A and board space permits larger land pattern |
| SS24-HF | VRRM = 40 V, IF(AV) = 2.0 A, VFM = 0.5 V (max) @ 2 A, SMA package (4.5 mm × 2.7 mm) | 3× taller (2.2 mm) and 50 % larger footprint; lacks low-profile thermal path of S-FLAT cathode lead | Choose only if existing SMA footprint reuse is required and thermal performance margin is ≥25 °C |
Compared with RB055LAM-40TR and SS24-HF, the CRS20I40B uniquely balances ultra-low profile (0.6 mm), precise 2.0 A rating, and optimized thermal resistance for space-limited mobile and wearable power stages-making it irreplaceable where Z-height and PCB copper area are constrained.
Availability
CRS20I40B is available at Aetrix Electronics and suitable for USB-C PD adapters, smartphone PMIC subsystems, and industrial IoT sensor node power supplies requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.
Supply support for CRS20I40B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on energy efficiency, miniaturization, and automotive-grade reliability.
The CRS20I40B belongs to Toshiba's S-FLAT Schottky diode product line, engineered specifically for high-density DC-DC converter secondary-side rectification and reverse-current protection in portable and battery-powered electronics.
FAQ
What is the maximum allowable junction temperature for CRS20I40B during continuous operation?
The absolute maximum junction temperature (Tj) for CRS20I40B is 150 °C. However, Toshiba recommends limiting steady-state Tj to ≤120 °C (80 % of rating) to ensure long-term reliability. This requires proper PCB thermal design-especially using the cathode lead for heat transfer-and derating IF(AV) when ambient temperature exceeds 85 °C. The CRS20I40B datasheet provides Ta(max)-IF(AV) derating curves for both ceramic and FR-4 board conditions.
Does CRS20I40B support high-frequency switching applications such as those found in GaN-based USB-C PD adapters?
Yes, CRS20I40B is explicitly designed for high-frequency switching applications. Its Schottky structure provides negligible reverse recovery time, enabling efficient operation at frequencies up to 1 MHz. The 62 pF junction capacitance at 10 V and low VFM make it suitable for 200–500 kHz GaN-based USB-C PD adapters where low conduction loss and minimal switching noise are critical. CRS20I40B has been validated in secondary rectification roles in commercial 45 W adapters.
What is the thermal resistance from junction to ambient (Rth(j-a)) for CRS20I40B, and how does mounting affect it?
CRS20I40B exhibits Rth(j-a) = 70 °C/W when mounted on a 50 mm × 50 mm ceramic board with 2 mm × 2 mm solder land. On a standard 50 mm × 50 mm FR-4 board with 6 mm × 6 mm land, Rth(j-a) rises to 140 °C/W. Mounting directly impacts thermal performance: increasing cathode land size or adding internal copper layers lowers Rth(j-a), while insufficient copper area risks exceeding Tj limits. CRS20I40B's Rth(j-ℓ) = 20 °C/W highlights its reliance on cathode-to-PCB conduction.
Can CRS20I40B be used as a direct replacement for conventional silicon diodes in existing 5 V/2 A power supplies?
CRS20I40B can replace silicon diodes in 5 V/2 A supplies-but only after verifying layout compatibility and thermal margins. Its S-FLAT package (2.9 mm × 1.6 mm × 0.6 mm) differs from common SOD-123 or SMA footprints. Electrical benefits include lower VFM (0.52 V vs. ~0.7–1.1 V), reducing conduction loss by ~0.4 W. However, higher reverse leakage (≤100 µA) requires checking if downstream circuitry tolerates it. CRS20I40B is not a drop-in mechanical replacement without land pattern revision.
What marking code identifies CRS20I40B on the physical device?
The CRS20I40B is marked with the code "SU" on its top surface, per Toshiba's official marking specification. This two-character laser mark appears adjacent to the cathode band and is consistent across all production lots. The full part number "CRS20I40B" appears in Toshiba's packaging labels and reel documentation, but only "SU" is laser-etched on the S-FLAT package body for traceability and space constraints.
CRS20I40B(TE85L,QM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- SOD-123F
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 40 V
- Current - Average Rectified (Io):
- 2A
- Voltage - Forward (Vf) (Max) @ If:
- 520 mV @ 2 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 100 µA @ 40 V
- Capacitance @ Vr, F:
- 62pF @ 10V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- S-FLAT (1.6x3.5)
- Operating Temperature - Junction:
- 150°C (Max)
CRS20I40B(TE85L,QM FAQ
1.How can I place an order for CRS20I40B(TE85L,QM through Aetrix?
Please submit a Request for Quotation (RFQ) for CRS20I40B(TE85L,QM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CRS20I40B(TE85L,QM reliable?
The price and inventory of CRS20I40B(TE85L,QM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CRS20I40B(TE85L,QM is usually 5 days.
3.What payment methods are accepted for CRS20I40B(TE85L,QM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CRS20I40B(TE85L,QM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CRS20I40B(TE85L,QM?
CRS20I40B(TE85L,QM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CRS20I40B(TE85L,QM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CRS20I40B(TE85L,QM?
For technical support, including CRS20I40B(TE85L,QM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CRS20I40B(TE85L,QM requirements.
6.How does Aetrix verify that CRS20I40B(TE85L,QM is sourced from the original manufacturer or authorized distributors?
All CRS20I40B(TE85L,QM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CRS20I40B(TE85L,QM meets industry standards.
7.What is the process for return or replacement of CRS20I40B(TE85L,QM?
All CRS20I40B(TE85L,QM units undergo pre-shipment inspection (PSI). If there is an issue with CRS20I40B(TE85L,QM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CRS20I40B(TE85L,QM part is unused and in its original packaging.
Return procedure for CRS20I40B(TE85L,QM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CRS20I40B(TE85L,QM Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
