Toshiba Semiconductor and Storage CUHS15S30,H3F
- Part No.:
- CUHS15S30,H3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Single Diodes
- Package:
- 2-SMD, Flat Leads
- Datasheet:
-
CUHS15S30,H3F.pdf
- Description:
- DIODE SCHOTTKY 30V 1.5A US2H
- Quantity:
- Payment:

- Shipping:

Inventory:41,474
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CUHS15S30 from Toshiba Electronic Devices & Storage Corporation is a silicon epitaxial Schottky barrier diode optimized for high-speed switching in low-voltage DC/DC converters and power management circuits, with 30 V reverse voltage rating, 1.5 A average rectified current, 0.37 V forward voltage at 1.5 A, and US2H surface-mount package.
For engineers reviewing the CUHS15S30 datasheet, CUHS15S30 pinout, CUHS15S30 application, or CUHS15S30 equivalent, key selection considerations include thermal resistance (105 °C/W), reverse leakage (500 µA at 30 V), junction temperature limit (150 °C), and US2H footprint compatibility in space-constrained power stages.
Technical Context
This Schottky diode uses a low-barrier silicon epitaxial structure to minimize forward conduction loss while maintaining fast recovery characteristics essential for high-frequency switching topologies. Its 10 A non-repetitive surge rating supports transient load conditions in buck and boost converters.
The device exhibits typical capacitance of 200 pF at 0 V and 1 MHz, enabling stable operation in noise-sensitive applications; thermal design must account for its 105 °C/W junction-to-ambient resistance on standard FR4 PCBs with 645 mm² copper pad.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 30 V - Maximum blocking voltage before breakdown; defines usable input range in 24 V systems. |
| Average Rectified Current (IO) | 1.5 A - Continuous DC current handling capacity under specified thermal conditions. |
| Forward Voltage (VF) | 0.37 V max at 1.5 A - Directly determines conduction loss and efficiency in power stage. |
| Surge Current (IFSM) | 10 A at 10 ms - Supports short-duration inrush or fault currents without failure. |
| Junction Temperature (Tj) | 150 °C max - Sets upper thermal operating limit for reliability-critical designs. |
| Thermal Resistance (Rth(j-a)) | 105 °C/W - Quantifies heat dissipation capability on standard FR4 board; guides heatsinking decisions. |
| Reverse Leakage (IR) | 500 µA max at 30 V - Critical for standby power budget and thermal runaway risk assessment. |
Pinout & Package
Package: US2H - ultra-small surface-mount package (5.4 mg typical weight), dimensions per Toshiba spec, suitable for automated assembly and high-density layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode | Connected to higher-potential node; carries return current path in forward bias. |
| 2 | Anode | Connected to lower-potential node; source of forward conduction current flow. |
Key Features
| Feature | Design Value |
|---|---|
| Low Forward Voltage | 0.37 V max at 1.5 A reduces conduction loss and improves converter efficiency. |
| High Surge Withstand | 10 A non-repetitive peak current enables robustness against startup surges and load transients. |
| Compact US2H Package | Enables high-density power layout with minimal PCB area and thermal mass. |
| Controlled Reverse Leakage | 500 µA max at 30 V allows predictable thermal modeling in ambient temperatures up to 125 °C. |
Applications
| DC/DC Buck Converter Output Stage | USB Power Delivery Clamp |
|---|---|
Use Scenario: Synchronous rectification in 5–24 V input buck regulators delivering up to 1.5 A. IC Role / Device Role / Timing Role: Freewheeling diode providing low-loss current path during high-side switch off-time. Use Value: 0.37 V VF minimizes power loss and thermal rise, supporting >92% efficiency at 1 A output. | Use Scenario: Reverse-polarity and overvoltage protection in USB-C PD sink ports. IC Role / Device Role / Timing Role: Low-capacitance (200 pF) clamping diode shunting transient energy to ground. Use Value: Fast response and low leakage preserve signal integrity while limiting standby current to <500 µA. |
| Industrial Sensor Power Rail | LED Driver Flyback Snubber |
Use Scenario: Input rectification for 12 V sensor modules operating in -40 to 85 °C ambient. IC Role / Device Role / Timing Role: Primary AC/DC interface diode converting transformer output to regulated DC. Use Value: 150 °C Tj rating and -55 to 150 °C storage range ensure long-term reliability in unventilated enclosures. | Use Scenario: Snubbing diode across flyback transformer secondary in constant-current LED drivers. IC Role / Device Role / Timing Role: Absorbs leakage inductance energy during MOSFET turn-off with minimal voltage overshoot. Use Value: 10 A IFSM withstands repetitive snub pulses; 200 pF Ct avoids resonance with driver gate loop. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB055LAM-40 | 40 V VR, 0.5 A IO, same US2H package but lower current rating. | Suitable only for sub-500 mA loads; insufficient for 1.5 A continuous use. | Select RB055LAM-40 only when system current demand is ≤0.5 A and higher VR margin is required. |
| SS12 | 20 V VR, 1.0 A IO, DO-214AC package - larger footprint and higher VF (0.5 V). | Requires PCB redesign due to different package; higher conduction loss impacts efficiency. | Choose SS12 only if US2H footprint is unavailable and 20 V VR suffices for the application. |
Compared with RB055LAM-40 and SS12, the CUHS15S30 uniquely balances 30 V VR, 1.5 A IO, and US2H compactness-enabling higher-power density in space-limited buck converters without sacrificing thermal margin or leakage control.
Availability
CUHS15S30 is available at Aetrix Electronics and suitable for DC/DC converters, USB power delivery interfaces, industrial sensor power rails, and LED driver snubbers requiring stable component supply and consistent parametric performance across production batches.
Supply support for CUHS15S30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on reliability, efficiency, and miniaturization.
The CUHS15S30 belongs to Toshiba's high-speed Schottky diode product line, engineered specifically for low-loss, high-frequency power conversion in compact consumer, industrial, and automotive-qualified systems.
FAQ
What is the maximum junction temperature for the CUHS15S30?
The CUHS15S30 has a maximum junction temperature (Tj) rating of 150 °C. This limit must not be exceeded during operation to maintain reliability and prevent accelerated degradation. Thermal design should use the specified 105 °C/W junction-to-ambient thermal resistance on an FR4 board with 645 mm² copper pad to calculate allowable power dissipation. The CUHS15S30 datasheet confirms this value under Absolute Maximum Ratings.
Does the CUHS15S30 have a documented pinout, and how is it configured?
Yes, the CUHS15S30 has a confirmed two-terminal pinout in the US2H package: Pin 1 is the cathode and Pin 2 is the anode. This configuration is explicitly defined in Toshiba's official documentation under "Packaging and Internal Circuit." The CUHS15S30 marking code "8D" aligns with this terminal assignment, and the device operates as a unidirectional rectifier with conventional Schottky polarity.
What is the forward voltage of the CUHS15S30 at 1.5 A, and why does it matter?
The CUHS15S30 has a maximum forward voltage (VF) of 0.37 V at 1.5 A and 25 °C, per its Electrical Characteristics table. This low VF directly reduces conduction loss (P = VF × IO), improving power stage efficiency and lowering thermal stress. In a 1.5 A buck converter, this translates to ≤0.56 W dissipation-critical for thermally constrained layouts where the CUHS15S30 is commonly deployed.
Can the CUHS15S30 replace standard PN-junction diodes in high-frequency applications?
Yes, the CUHS15S30 is specifically designed to replace slower PN diodes in high-frequency switching applications such as DC/DC converters. Its Schottky construction eliminates minority-carrier storage delay, enabling near-zero reverse recovery time. Unlike PN diodes, the CUHS15S30 avoids switching losses associated with reverse recovery charge-making it suitable for >500 kHz topologies where the CUHS15S30 delivers measurable efficiency gains.
Is the CUHS15S30 RoHS compliant and lead-free?
Yes, the CUHS15S30 is RoHS compliant and lead-free, as confirmed by Toshiba's environmental compliance documentation and product markings. It meets EU Directive 2011/65/EU requirements and contains no restricted substances above threshold limits. For full material declarations and test reports, refer to Toshiba's official environmental data portal-where the CUHS15S30 is listed with full substance disclosure and conformity statements.
CUHS15S30,H3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 2-SMD, Flat Leads
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 1.5A
- Voltage - Forward (Vf) (Max) @ If:
- 430 mV @ 1.5 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 500 µA @ 30 V
- Capacitance @ Vr, F:
- 200pF @ 0V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- US2H
- Operating Temperature - Junction:
- 150°C
CUHS15S30,H3F FAQ
1.How can I place an order for CUHS15S30,H3F through Aetrix?
Please submit a Request for Quotation (RFQ) for CUHS15S30,H3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CUHS15S30,H3F reliable?
The price and inventory of CUHS15S30,H3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CUHS15S30,H3F is usually 5 days.
3.What payment methods are accepted for CUHS15S30,H3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CUHS15S30,H3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CUHS15S30,H3F?
CUHS15S30,H3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CUHS15S30,H3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CUHS15S30,H3F?
For technical support, including CUHS15S30,H3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CUHS15S30,H3F requirements.
6.How does Aetrix verify that CUHS15S30,H3F is sourced from the original manufacturer or authorized distributors?
All CUHS15S30,H3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CUHS15S30,H3F meets industry standards.
7.What is the process for return or replacement of CUHS15S30,H3F?
All CUHS15S30,H3F units undergo pre-shipment inspection (PSI). If there is an issue with CUHS15S30,H3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CUHS15S30,H3F part is unused and in its original packaging.
Return procedure for CUHS15S30,H3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CUHS15S30,H3F Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

