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Toshiba Semiconductor and Storage CUHS15S40,H3F
- Part No.:
- CUHS15S40,H3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Single Diodes
- Package:
- 2-SMD, Flat Leads
- Datasheet:
-
CUHS15S40,H3F.pdf
- Description:
- DIODE SCHOTTKY 40V 1.5A US2H
- Quantity:
- Payment:
- Shipping:
Inventory:5,711
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Product details
Overview
CUHS15S40 from Toshiba Electronic Devices & Storage Corporation is a silicon epitaxial Schottky barrier diode optimized for high-speed switching in DC-DC converters and power supply rectification. It features 40 V reverse voltage rating, 1.5 A average rectified current, 10 A non-repetitive peak forward surge current, and low forward voltage drop (0.31–0.45 V at 0.5–1.5 A), enabling efficient operation in compact, thermally constrained designs.
For engineers reviewing the CUHS15S40 datasheet, CUHS15S40 pinout, CUHS15S40 application, or CUHS15S40 equivalent, key selection considerations include its US2H surface-mount package, thermal resistance of 105 °C/W on FR4, reverse leakage behavior under high VR/Tj, and suitability for low-loss output rectification in buck converters and OR-ing circuits.
Technical Context
The CUHS15S40 employs a planar Schottky junction structure with silicon epitaxial construction to achieve fast recovery (inherently <10 ns) and minimal reverse recovery charge. Its low VF and moderate IR balance conduction loss and leakage-driven thermal risk across ambient temperatures up to 150 °C.
Designed for surface-mount assembly on standard FR4 PCBs with 645 mm² copper pad, the device's thermal performance is validated under defined mounting conditions (25.4 × 25.4 × 1.6 mm board), and its capacitance (170 pF at 0 V, 1 MHz) supports stable high-frequency switching node behavior in synchronous rectifier topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 40 V - Maximum blocking capability without breakdown; sets upper limit for input/output rail voltage in step-down converters. |
| Average Rectified Current (IO) | 1.5 A - Continuous DC current handling at Ta = 25 °C on specified FR4 board; derates with temperature per Fig. 9.6. |
| Forward Voltage (VF) | 0.31–0.45 V @ 0.5–1.5 A - Low conduction loss reduces I²R heating; enables >90% efficiency in 5–12 V output stages. |
| Reverse Current (IR) | 80–200 µA @ 10–40 V - Higher than PN diodes; requires thermal-aware layout to avoid runaway at elevated Tj. |
| Junction-to-Ambient Rth | 105 °C/W - Thermal impedance under defined FR4 mounting; informs heatsinking need for >0.8 A continuous operation. |
| Total Capacitance (Ct) | 170 pF @ 0 V, 1 MHz - Limits high-frequency ringing and EMI in fast-switching nodes; compatible with 500 kHz–1 MHz SMPS. |
Pinout & Package
Package: US2H - ultra-small surface-mount plastic package (5.4 mg typical weight), dimensions per Toshiba spec sheet, designed for automated placement and reflow soldering on standard PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode | Connected to higher-potential node (e.g., switch node in buck converter); carries full load current during conduction. |
| 2 | Anode | Connected to lower-potential node (e.g., output capacitor ground); polarity-sensitive for correct rectification direction. |
Key Features
| Feature | Design Value |
|---|---|
| Low Forward Voltage | VF = 0.31 V @ 0.5 A enables reduced conduction loss vs. standard PN diodes, improving light-load efficiency in portable power supplies. |
| High Surge Current Rating | IFSM = 10 A (10 ms pulse) supports robust startup and transient overload handling in industrial DC-DC modules. |
| Thermally Optimized Package | US2H footprint with exposed cathode pad enhances heat transfer to PCB copper, critical for maintaining Tj ≤ 150 °C in sealed enclosures. |
| Controlled Reverse Leakage | IR ≤ 200 µA @ 40 V allows predictable thermal modeling-essential for reliability validation per Toshiba Reliability Handbook. |
Applications
| DC-DC Buck Converter Output Rectification | OR-ing Diode in Redundant Power Supplies |
|---|---|
Use Scenario: Used as freewheeling diode in non-synchronous 5–12 V buck converters powering FPGAs or microcontrollers. IC Role / Device Role / Timing Role: Provides unidirectional current path during low-side switch off-time; conducts continuously during 50–90% duty cycle operation. Use Value: Low VF minimizes power loss (≤0.675 W at 1.5 A), reducing thermal stress on adjacent ICs and enabling smaller heatsinks. | Use Scenario: Placed in parallel power rails to prevent backfeed between redundant 3.3 V/5 V supplies in telecom line cards. IC Role / Device Role / Timing Role: Acts as passive isolation element; blocks reverse current while supporting fast turn-on for seamless switchover. Use Value: Fast switching (<10 ns) and low forward drop ensure minimal voltage offset (<450 mV) between rails, preserving system-level voltage margin. |
| AC-DC Adapter Secondary-Side Rectification | USB-C Power Delivery Synchronous Rectifier Auxiliary Diode |
Use Scenario: Rectifies 5–20 V secondary outputs in compact wall adapters with strict size constraints. IC Role / Device Role / Timing Role: Conducts during transformer demagnetization phase; handles repetitive 100/120 Hz ripple plus high-frequency noise. Use Value: 150 °C max junction temperature and 105 °C/W Rth allow operation in sealed plastic housings without forced air cooling. | Use Scenario: Used alongside active MOSFETs in USB-C PD 3.0 sink designs to clamp gate drive transients or provide bootstrap path redundancy. IC Role / Device Role / Timing Role: Functions as fast clamping diode during gate driver transitions; responds within nanoseconds to suppress overshoot. Use Value: 170 pF capacitance and low VF stabilize gate node voltage without introducing significant delay or ringing in 300–600 kHz control loops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB055LAM-40TR | Lower VF (0.29 V @ 1 A), higher IR (300 µA @ 40 V), same US2H package and 40 V VR. | Better conduction efficiency but greater thermal sensitivity; requires tighter Tj control in high-ambient environments. | Select RB055LAM-40TR when minimizing conduction loss dominates over leakage management. |
| SS14-E3/5AT | Different package (SMA), higher IO (1.4 A), same VR (40 V); VF slightly higher (0.5 V @ 1 A), Rth ~120 °C/W. | Larger footprint and higher thermal resistance limit use in ultra-dense layouts where US2H's 5.4 mg mass and low profile are critical. | Choose SS14-E3/5AT only if SMA compatibility or legacy board reuse outweighs size and thermal advantages of CUHS15S40. |
Compared with RB055LAM-40TR and SS14-E3/5AT, the CUHS15S40 delivers a balanced trade-off of low VF, controlled IR, and ultra-compact US2H packaging-making it optimal for space-constrained, thermally managed DC-DC and OR-ing applications where both efficiency and reliability must be sustained across -55 to 150 °C.
Availability
CUHS15S40 is available at Aetrix Electronics and suitable for DC-DC buck converters, redundant power OR-ing circuits, and AC-DC adapter secondary-side rectification requiring stable component supply and long-term manufacturability.
Supply support for CUHS15S40 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on energy efficiency and reliability for industrial and consumer systems.
The CUHS15S40 belongs to Toshiba's high-speed Schottky diode product line, engineered specifically for low-loss, high-frequency rectification in compact power conversion stages where thermal management and board space are critical constraints.
FAQ
What is the maximum junction temperature rating for the CUHS15S40?
The CUHS15S40 has a maximum junction temperature (Tj) rating of 150 °C, verified under specified mounting conditions (FR4 board, 645 mm² Cu pad). Operation beyond this limit risks accelerated degradation per Toshiba's Reliability Handbook. Derating is required above 25 °C ambient, with IO dropping to ~0.8 A at 100 °C ambient per Fig. 9.6 in the CUHS15S40 datasheet.
Does the CUHS15S40 have a specified reverse recovery time?
The CUHS15S40 does not specify reverse recovery time (trr) because it is a Schottky barrier diode with majority-carrier conduction-its recovery is effectively instantaneous (<10 ns). This eliminates reverse recovery loss and EMI associated with minority-carrier PN diodes, making the CUHS15S40 especially suitable for high-frequency switching applications like 1 MHz DC-DC converters.
What is the marking code printed on the CUHS15S40 package?
Each CUHS15S40 device is laser-marked with the code "7D" on the top surface of the US2H package, as shown in Figure 6.1 of the official CUHS15S40 datasheet. This marking identifies the part unambiguously during visual inspection and automated optical recognition in SMT lines.
Can the CUHS15S40 be used in automotive applications?
The CUHS15S40 is not qualified to AEC-Q101 or automotive-grade reliability standards. While its operating temperature range (-55 to 150 °C) overlaps with some automotive requirements, Toshiba explicitly states that the CUHS15S40 is not intended for safety-critical or high-reliability automotive systems such as engine control or ADAS. Use in automotive infotainment or body electronics requires customer-specific qualification per the CUHS15S40 reliability data and handling precautions.
What is the thermal resistance from junction to ambient for the CUHS15S40?
The CUHS15S40 has a maximum junction-to-ambient thermal resistance (Rth(j-a)) of 105 °C/W when mounted on a standard FR4 PCB (25.4 × 25.4 × 1.6 mm) with a 645 mm² copper pad, as measured per JEDEC JESD51-2. This value is critical for calculating steady-state junction temperature rise and must be applied with actual power dissipation (VF × IO) to ensure Tj remains within 150 °C in the final CUHS15S40 design.
CUHS15S40,H3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 2-SMD, Flat Leads
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 40 V
- Current - Average Rectified (Io):
- 1.5A
- Voltage - Forward (Vf) (Max) @ If:
- 510 mV @ 1.5 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 200 µA @ 40 V
- Capacitance @ Vr, F:
- 170pF @ 0V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- US2H
- Operating Temperature - Junction:
- 150°C (Max)
CUHS15S40,H3F FAQ
1.How can I place an order for CUHS15S40,H3F through Aetrix?
Please submit a Request for Quotation (RFQ) for CUHS15S40,H3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CUHS15S40,H3F reliable?
The price and inventory of CUHS15S40,H3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CUHS15S40,H3F is usually 5 days.
3.What payment methods are accepted for CUHS15S40,H3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CUHS15S40,H3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CUHS15S40,H3F?
CUHS15S40,H3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CUHS15S40,H3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CUHS15S40,H3F?
For technical support, including CUHS15S40,H3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CUHS15S40,H3F requirements.
6.How does Aetrix verify that CUHS15S40,H3F is sourced from the original manufacturer or authorized distributors?
All CUHS15S40,H3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CUHS15S40,H3F meets industry standards.
7.What is the process for return or replacement of CUHS15S40,H3F?
All CUHS15S40,H3F units undergo pre-shipment inspection (PSI). If there is an issue with CUHS15S40,H3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CUHS15S40,H3F part is unused and in its original packaging.
Return procedure for CUHS15S40,H3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CUHS15S40,H3F Tags
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