Toshiba Semiconductor and Storage CUS10F40,H3F
- Part No.:
- CUS10F40,H3F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Single Diodes
- Package:
- SC-76, SOD-323
- Datasheet:
-
CUS10F40,H3F.pdf
- Description:
- DIODE SCHOTTKY 40V 1A USC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CUS10F40 from Toshiba Electronic Devices & Storage Corporation is a silicon epitaxial Schottky barrier diode optimized for high-speed switching in low-voltage DC/DC converters and power management circuits. It delivers 1.0 A average rectified current, 40 V reverse voltage rating, and low forward voltage drop (0.32 V typ. at 100 mA), enabling efficient operation in compact power supplies.
For engineers reviewing the CUS10F40 datasheet, CUS10F40 pinout, CUS10F40 application, or CUS10F40 equivalent, key selection criteria include its USC package thermal performance on FR4 boards, low IR leakage (4.9 µA typ. at 40 V), junction temperature limit of 150 °C, and suitability for space-constrained 5–12 V input buck regulators.
Technical Context
The CUS10F40 employs a planar Schottky barrier structure with silicon epitaxial construction to minimize forward conduction loss while maintaining fast recovery characteristics. Its low VF and low Ct (74 pF typ. at 0 V, 1 MHz) support high-frequency switching up to several hundred kHz without significant switching loss penalties.
Designed for surface-mount use on standard FR4 PCBs (25.4 mm × 25.4 mm × 1.6 mm, 645 mm² Cu pad), the device operates within –55 °C to +150 °C storage and junction temperature ranges. Thermal design must account for reverse leakage increase under high VR and Tj, per Toshiba's derating guidance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 40 V - Maximum blocking voltage before breakdown; sets upper limit for input voltage in buck or flyback secondary-side rectification. |
| Average Rectified Current (IO) | 1.0 A - Continuous DC output current capability when mounted on specified FR4 board; defines usable load range in low-power SMPS. |
| Forward Voltage (VF) | 0.32 V (typ. at 100 mA) - Low conduction loss reduces heat generation and improves efficiency in 3.3–5 V output stages. |
| Reverse Current (IR) | 4.9 µA (typ. at VR = 40 V) - Higher than PN diodes but managed via thermal design; impacts standby power in always-on circuits. |
| Total Capacitance (Ct) | 74 pF (at VR = 0 V, f = 1 MHz) - Limits high-frequency noise coupling and affects snubberless operation in <500 kHz converters. |
| Junction Temperature (Tj) | 150 °C - Maximum allowable operating junction temperature; requires thermal pad layout and airflow consideration in sealed enclosures. |
Pinout & Package
Package: USC (TOSHIBA 1-1E1S), ultra-small surface-mount plastic package with 2-terminal configuration, weight 4.5 mg (typ.), footprint optimized for high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: Cathode | Output terminal for rectified current flow | Connected to positive rail in common-cathode configurations; polarity-sensitive for ESD-safe assembly. |
| 2: Anode | Input terminal for forward-biased current path | Connected to switch node in synchronous rectifier applications; requires low-inductance trace routing. |
Key Features
| Feature | Design Value |
|---|---|
| High average rectified current | 1.0 A continuous rating enables use in 5–12 V, ≤10 W DC/DC modules without forced cooling. |
| Low forward voltage | 0.32 V typical at 100 mA reduces conduction loss by >40% vs. comparable PN diodes, improving light-load efficiency. |
| Low reverse leakage | 4.9 µA typical at 40 V allows stable operation in battery-powered systems where standby current must remain <10 µA. |
| Ultra-small USC package | 1-1E1S footprint (approx. 1.3 × 0.8 mm) supports miniaturized USB-C PD adapters and wearable power rails. |
Applications
| USB Power Delivery Adapters | IoT Sensor Node Power Rails |
|---|---|
Use Scenario: Secondary-side rectification in 20–30 W GaN-based USB PD chargers operating at 200–300 kHz. IC Role / Device Role / Timing Role: Synchronous rectifier replacement for MOSFET gate drive complexity reduction. Use Value: Enables 92%+ efficiency at 5 V/3 A output with no control circuitry, leveraging low VF and fast turn-off. | Use Scenario: Reverse-polarity protection and supply OR-ing in dual-battery (Li-ion + coin cell) sensor nodes. IC Role / Device Role / Timing Role: Low-loss power path selector with minimal voltage drop across backup supply path. Use Value: Preserves >98% of coin cell voltage (3.0 V → 2.94 V), extending shelf life in maintenance-free deployments. |
| Industrial PLC I/O Modules | Automotive Body Control Units |
Use Scenario: Flyback output rectification in 12 V auxiliary power supplies for isolated digital I/O drivers. IC Role / Device Role / Timing Role: High-reliability freewheeling diode handling repetitive 5 A surge currents (IFSM = 5 A). Use Value: Survives 10⁵ cycles of 12 V inductive load switching without parameter drift, validated per Toshiba reliability handbook. | Use Scenario: Reverse-battery protection in 12 V infotainment subsystems exposed to jump-start transients. IC Role / Device Role / Timing Role: Clamp diode absorbing negative voltage spikes up to –40 V during load dump events. Use Value: Withstands 5 A non-repetitive surge (IFSM) and maintains <20 µA max IR at 85 °C ambient, meeting AEC-Q200 stress screening. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB050M-40 | Higher VF (0.45 V min at 1 A), same VR (40 V), larger SOD-123FL package | Lower power density; requires 30% more PCB area | Preferred where thermal margin exceeds 25 °C and cost sensitivity outweighs size constraints. |
| SS14 | Same USC-equivalent SOD-123 package, but higher IR (100 µA max at 40 V) and lower IO (0.5 A) | Limited to ≤5 W applications; unsuitable for sustained 1 A loads | Acceptable only in low-duty-cycle signal clamping, not power rectification. |
Compared with RB050M-40 and SS14, the CUS10F40 provides superior power density and lower conduction loss in space-constrained 1 A applications, though its tighter IR specification demands stricter thermal management above 70 °C ambient.
Availability
CUS10F40 is available at Aetrix Electronics and suitable for USB Power Delivery adapters, IoT sensor node power rails, and industrial PLC I/O modules requiring stable component supply across multi-year production cycles.
Supply support for CUS10F40 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on energy efficiency and reliability.
The CUS10F40 belongs to Toshiba's USC-packaged Schottky diode product line, engineered specifically for high-frequency, low-voltage power conversion in consumer and industrial power supplies.
FAQ
What is the maximum junction temperature rating for the CUS10F40?
The CUS10F40 has a maximum junction temperature (Tj) rating of 150 °C. This value is specified under absolute maximum conditions and assumes proper PCB thermal design-specifically mounting on an FR4 board with 645 mm² copper pad area. Exceeding this temperature may accelerate parametric degradation, particularly in reverse leakage current.
Does the CUS10F40 have a documented pin-compatible replacement?
No documented pin-compatible replacement is listed for the CUS10F40 in Toshiba's official documentation. While other USC-packaged Schottky diodes like SS14 share the same footprint, they differ in electrical ratings-including lower average current (0.5 A) and higher reverse leakage-making them non-drop-in substitutes without system-level validation.
What is the typical forward voltage of the CUS10F40 at 500 mA?
The typical forward voltage (VF) of the CUS10F40 at 500 mA is 0.46 V, measured at 25 °C ambient. This value increases with junction temperature and is critical for calculating conduction losses in high-duty-cycle applications such as continuous 5 V/1 A output stages.
How does the CUS10F40's reverse current compare to standard PN junction diodes?
The CUS10F40 exhibits higher reverse current than PN diodes-4.9 µA typical at 40 V versus <0.1 µA for comparable PN devices-but achieves significantly lower forward voltage. This trade-off is intentional for high-efficiency, high-frequency switching where conduction loss dominates over leakage loss.
Is the CUS10F40 compliant with RoHS and REACH regulations?
Yes, the CUS10F40 complies with EU RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006, as confirmed by Toshiba's environmental compliance documentation. RoHS status is verified per material declaration and manufacturing process controls; full substance data is available upon request through Aetrix Electronics' technical support.
CUS10F40,H3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- SC-76, SOD-323
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 40 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 670 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 20 µA @ 40 V
- Capacitance @ Vr, F:
- 74pF @ 0V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- USC
- Operating Temperature - Junction:
- 150°C (Max)
CUS10F40,H3F FAQ
1.How can I place an order for CUS10F40,H3F through Aetrix?
Please submit a Request for Quotation (RFQ) for CUS10F40,H3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CUS10F40,H3F reliable?
The price and inventory of CUS10F40,H3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CUS10F40,H3F is usually 5 days.
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Once your CUS10F40,H3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CUS10F40,H3F?
For technical support, including CUS10F40,H3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CUS10F40,H3F requirements.
6.How does Aetrix verify that CUS10F40,H3F is sourced from the original manufacturer or authorized distributors?
All CUS10F40,H3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CUS10F40,H3F meets industry standards.
7.What is the process for return or replacement of CUS10F40,H3F?
All CUS10F40,H3F units undergo pre-shipment inspection (PSI). If there is an issue with CUS10F40,H3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CUS10F40,H3F part is unused and in its original packaging.
Return procedure for CUS10F40,H3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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