Infineon Technologies CYUSB2014-BZXC
- Part No.:
- CYUSB2014-BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 121-TFBGA
- Datasheet:
-
CYUSB2014-BZXC.pdf
- Description:
- IC EZ-USB BRIDGE FX3 3.0 121BGA
- Quantity:
- Payment:

- Shipping:

Inventory:245
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Product details
Overview
CYUSB2014-BZXC from Infineon is a USB 3.2 Gen 1/USB 2.0 SuperSpeed USB controller IC featuring an ARM926EJ-S core running at 200 MHz, 256 KB embedded SRAM, and a programmable 100-MHz GPIF II interface supporting 8-/16-/24-/32-bit buses. It integrates USB 3.2 Gen 1 PHY (5 Gbps), HS-OTG host/peripheral capability, and multiple serial interfaces (SPI up to 33 MHz, UART up to 4 Mbps, I²C at 1 MHz, I²S transmitter). Used in high-bandwidth video capture cards and industrial cameras for real-time sensor-to-PC data streaming.
For engineers reviewing the CYUSB2014-BZXC datasheet, CYUSB2014-BZXC pinout, CYUSB2014-BZXC application, or CYUSB2014-BZXC equivalent, key selection criteria include GPIF II bus width configurability, USB 3.2 Gen 1 compliance (TID #340800007), ARM926EJ-S firmware extensibility, low-power core-down mode (<60 µA), and BGA-121 package compatibility with FPGA/video sensor interconnects.
Technical Context
The CYUSB2014-BZXC implements a dual-mode USB controller with independent USB 3.2 Gen 1 (5 Gbps) and USB 2.0 (480 Mbps) PHY layers, enabling simultaneous SuperSpeed and High-Speed enumeration. Its ARM926EJ-S CPU executes firmware directly from on-chip SRAM and supports RTOS-based development via ThreadX v5 in the EZ-USB SDK.
GPIF II operates as a synchronous state-machine-driven parallel interface with configurable clocking (up to 100 MHz), 16 programmable control signals, and support for Slave FIFO, SRAM, and custom timing protocols-enabling direct connection to image sensors, FPGAs, and ADCs without external glue logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| USB Compliance | USB 3.2 Gen 1 (5 Gbps) and USB 2.0; certified TID #340800007 - ensures interoperability with host controllers and certified peripherals. |
| CPU Core | ARM926EJ-S @ 200 MHz - enables real-time firmware processing of USB descriptors, endpoint management, and GPIF II state transitions. |
| Embedded Memory | 256 KB SRAM - sufficient for full UVC-compliant video streaming firmware plus buffer space for 1080p60 YUV422 payloads. |
| GPIF II Bus Width | Configurable 8/16/24/32-bit - matches common image sensor output buses (e.g., OV5640 16-bit parallel, AR0330 24-bit RAW). |
| Serial Interfaces | SPI master (33 MHz), UART (4 Mbps), I²C (1 MHz), I²S TX (8–192 kHz sampling) - supports sensor configuration, debug logging, and audio sync in multimodal devices. |
| Power Modes | Core power-down <60 µA (VBATT on) - extends battery life in portable surveillance cameras and handheld medical imagers. |
Pinout & Package
Package: 121-ball, 10 mm × 10 mm, 0.8 mm pitch Pb-free BGA (ball grid array). Thermal pad exposed on underside for enhanced heat dissipation in sustained USB 3.2 data transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[31:0] | GPIF II Data Bus | 32-bit bidirectional parallel interface; configured as input/output per state machine definition for sensor/FPGA handshake. |
| CTL[15:0] | GPIF II Control Signals | 16 programmable control lines (e.g., SLRD, SLWR, FLAGA) - implement custom read/write strobes and status signaling. |
| CLK | GPIF II Clock Input | Accepts externally generated 100-MHz clock or internal PLL-derived clock - determines maximum parallel data throughput. |
| USBDP/USBDM | USB 3.2 Gen 1 Differential Pair | 5-Gbps SuperSpeed transmit/receive path; requires controlled-impedance 90-Ω differential routing and ESD protection. |
| VBUS_DET | USB VBUS Detection Input | Monitors host-supplied 5 V; triggers OTG role negotiation and power management state transitions. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable GPIF II Interface | Graphically configurable via GPIF II Designer tool; eliminates need for external FPGA or ASIC to bridge parallel sensors to USB. |
| ARM926EJ-S Firmware Execution | Full 32-bit RISC processor enables custom descriptor handling, multi-interface coordination (e.g., I²C sensor config + GPIF II video capture + USB streaming), and field-upgradable behavior. |
| USB 3.2 Gen 1 + USB 2.0 Dual PHY | Backward-compatible operation ensures plug-and-play with legacy hosts while delivering 5× bandwidth over USB 2.0 for uncompressed video. |
| Ultra-Low-Power Core-Down Mode | Sub-60 µA retention current with VBATT active - enables always-on camera wake-on-motion without compromising battery runtime. |
Applications
| Video Capture Cards | Industrial Cameras |
|---|---|
Use Scenario: Real-time HDMI/SDI-to-USB3 conversion for PC-based vision analytics. IC Role / Device Role / Timing Role: USB controller with GPIF II acting as parallel video sink; ARM9 core manages UVC descriptors and frame buffering. Use Value: Eliminates external bridge ICs; achieves 1080p60 YUV422 streaming using only on-chip SRAM and configurable timing. | Use Scenario: High-resolution inspection systems requiring deterministic sensor-to-host latency. IC Role / Device Role / Timing Role: Master interface between CMOS image sensor (e.g., Sony IMX series) and host PC via USB 3.2 Gen 1. Use Value: GPIF II synchronous read mode delivers sub-microsecond timing control for precise exposure synchronization. |
| Surveillance Cameras | Medical Imaging Devices |
Use Scenario: Multi-sensor IP camera with onboard motion-triggered recording. IC Role / Device Role / Timing Role: USB device controller managing video streaming, sensor configuration (via I²C), and event logging (via UART). Use Value: Integrated ARM9 core replaces separate microcontroller, reducing BOM count and PCB area. | Use Scenario: Portable ultrasound or endoscopy probe transmitting raw RF data to workstation. IC Role / Device Role / Timing Role: High-throughput data pipe with deterministic USB transfer scheduling and low-jitter GPIF II clocking. Use Value: 5-Gbps link sustains >300 MB/s sustained payload - sufficient for uncompressed 12-bit 4K@30 video streams. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYUSB3014-BZXI | Same die, industrial temperature grade (–40°C to +85°C) vs. commercial (0°C to +70°C); identical pinout and firmware compatibility. | Required for outdoor surveillance or factory-floor industrial cameras where ambient exceeds 70°C. | Select when extended temperature operation is mandatory; no firmware or layout changes needed. |
| CX3-EBZ | Dedicated MIPI CSI-2 to USB 3.0 bridge; no ARM CPU, fixed-function pipeline; smaller 81-ball BGA. | Optimized for single-sensor mobile camera modules; lacks GPIF II flexibility and firmware programmability. | Choose only for cost-sensitive, fixed-configuration MIPI sensor designs without need for custom logic or multi-interface coordination. |
Compared with CYUSB3014-BZXI, CYUSB2014-BZXC offers identical functionality at lower cost but limits operating temperature range; versus CX3-EBZ, it trades MIPI-native integration for full programmability and broader peripheral support-making it suitable for heterogeneous sensor fusion and field-upgradable systems.
Availability
CYUSB2014-BZXC is available at Aetrix Electronics and suitable for video capture cards, industrial cameras, surveillance systems, and medical imaging devices requiring stable component supply across long-lifecycle embedded programs.
Supply support for CYUSB2014-BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.
CYUSB2014-BZXC belongs to the EZ-USB FX3 family-designed specifically to enable high-bandwidth, firmware-programmable USB 3.2 Gen 1 connectivity for vision, test equipment, and data acquisition systems.
FAQ
What boot options does CYUSB2014-BZXC support?
CYUSB2014-BZXC supports four boot modes: USB, SPI Flash, I²C EEPROM, and Parallel NOR Flash. Boot source is selected via GPIO strap pins at reset. USB boot enables firmware download directly from host PC during development; SPI Flash is most common in production for fast, reliable startup with minimal external components.
Does CYUSB2014-BZXC require an external crystal?
Yes - it requires a 19.2 MHz fundamental-mode crystal connected to XIN/XOUT pins for USB 3.2 Gen 1 PHY clock generation and system timing. The crystal must meet ±50 ppm frequency tolerance and load capacitance matching per Infineon's hardware design guidelines (AN70707).
Can CYUSB2014-BZXC operate as a USB host?
Yes - it supports USB On-The-Go (OTG) Supplement v2.0 in HS-OTG mode, allowing dynamic role switching between host and peripheral. Host capability is limited to single downstream port and requires external VBUS control circuitry and ID pin detection per USB OTG specifications.
Is GPIF II configuration done in hardware or firmware?
GPIF II configuration is defined in firmware using Cypress's GPIF II Designer tool, which generates C header files and initialization code. The resulting state machine is loaded into on-chip RAM at runtime; no hardware reconfiguration or external PROM is required - enabling field-upgradable interface timing and protocol behavior.
CYUSB2014-BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- EZ-USB FX3™
- Package/Case:
- 121-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- SuperSpeed USB Peripheral Controller
- Core Processor:
- ARM9®
- Program Memory Type:
- External Program Memory
- Controller Series:
- CYUSB
- RAM Size:
- 512K x 8
- Interface:
- I2C, I2S, MMC/SD, SPI, UART, USB
- Number of I/O:
- 59
- Voltage - Supply:
- 1.15V ~ 1.25V
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 121-FBGA (10x10)
CYUSB2014-BZXC FAQ
1.How can I place an order for CYUSB2014-BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CYUSB2014-BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYUSB2014-BZXC reliable?
The price and inventory of CYUSB2014-BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB2014-BZXC is usually 5 days.
3.What payment methods are accepted for CYUSB2014-BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB2014-BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYUSB2014-BZXC?
CYUSB2014-BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYUSB2014-BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYUSB2014-BZXC?
For technical support, including CYUSB2014-BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB2014-BZXC requirements.
6.How does Aetrix verify that CYUSB2014-BZXC is sourced from the original manufacturer or authorized distributors?
All CYUSB2014-BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB2014-BZXC meets industry standards.
7.What is the process for return or replacement of CYUSB2014-BZXC?
All CYUSB2014-BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB2014-BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYUSB2014-BZXC part is unused and in its original packaging.
Return procedure for CYUSB2014-BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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