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Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Infineon Technologies CYUSB3013-BZXC

Name: CYUSB3013-BZXC
Brand: Infineon Technologies
SKU: CYUSB3013-BZXC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYUSB3013-BZXC

Manufacturer:: Infineon Technologies

Category:: Application Specific Microcontrollers

Package:: 121-TFBGA

Datasheet:: CYUSB3013-BZXC.pdf

Description:: IC ARM9 USB3 CONTROLLER 121FBGA

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Product details

Overview

CYUSB3013-BZXC from Infineon is a USB 3.2 Gen 1 (5 Gbps) and USB 2.0 compliant SuperSpeed USB controller IC with ARM926EJ-S core running at 200 MHz, 512 KB embedded SRAM, and programmable GPIF II interface supporting 8-/16-/24-/32-bit buses. It integrates USB PHY, OTG host/peripheral capability, SPI (33 MHz), UART (4 Mbps), I²C (1 MHz), and I²S (up to 192 kHz), targeting high-bandwidth video and data acquisition systems.

For engineers reviewing the CYUSB3013-BZXC datasheet, CYUSB3013-BZXC pinout, CYUSB3013-BZXC application, or CYUSB3013-BZXC equivalent, key selection criteria include USB 3.2 Gen 1 PHY compliance, GPIF II configurability for FPGA/ASIC interfacing, low-power core domain operation (1.2 V), dual-voltage I/O support (1.8–3.3 V), and BGA-121 package compatibility with high-density PCB layouts.

Technical Context

The CYUSB3013-BZXC implements a dedicated USB 3.2 Gen 1 physical layer with integrated 5-Gbps SerDes and link training logic, alongside a full-speed USB 2.0 transceiver. Its ARM926EJ-S CPU executes firmware in on-chip SRAM and supports boot from SPI flash, I²C EEPROM, or USB host.

GPIF II operates at up to 100 MHz with fully programmable state machines, enabling direct connection to image sensors, FPGAs, or memory buffers without external glue logic. Clocking supports 19.2 MHz crystal input or external 19.2/26/38.4/52 MHz reference.

Key Specifications

Parameter	Value and Actual Design Meaning
USB Compliance	USB 3.2 Gen 1 (5 Gbps) and USB 2.0; TID #340800007 certified - ensures interoperability with host controllers and hubs.
CPU Core	ARM926EJ-S @ 200 MHz - enables real-time firmware processing for protocol translation and data streaming.
Embedded Memory	512 KB SRAM - sufficient for UVC/UAC firmware, descriptor tables, and DMA buffer management without external RAM.
GPIF II Bus Width	8/16/24/32-bit programmable - matches common sensor output buses (e.g., 16-bit CMOS image sensors) and FPGA data paths.
I/O Voltage Range	I²S/UART/SPI: 1.8–3.3 V; I²C: 1.2–3.3 V - allows direct interfacing with mixed-voltage peripherals without level shifters.
Power Modes	Core power-down: <60 µA (VBATT on); <20 µA (VBATT off) - supports battery-backed suspend in portable imaging devices.
Package	121-ball BGA, 10 mm × 10 mm, 0.8 mm pitch - enables compact, high-I/O-count layout for USB-centric edge devices.

Pinout & Package

CYUSB3013-BZXC is housed in a 121-ball Pb-free BGA package (10 mm × 10 mm, 0.8 mm pitch) with 1.2 V core and dual-voltage I/O domains. Pin functions are validated per Infineon datasheet Rev. *Z (pages 28–31).

Pin/Terminal	Circuit Role	Design Meaning
USB_DP / USB_DM	SuperSpeed differential pair	5-Gbps USB 3.2 Gen 1 signaling path; requires controlled 90-Ω differential impedance routing.
USBDP / USBDN	High-speed USB 2.0 pair	Backward-compatible 480-Mbps USB 2.0 interface; shared pins with SuperSpeed PHY.
GPIF_DATA[31:0]	Programmable parallel data bus	Configurable as 8/16/24/32-bit interface to FPGA, sensor, or memory; timing-synchronized via PCLK.
PCLK	GPIF II clock input	Drives GPIF II state machine at up to 100 MHz; sourced externally or derived from internal PLL.
I2C_SDA / I2C_SCL	I²C master interface	Configurable 1.2–3.3 V I²C bus for configuring external sensors, EEPROMs, or PMICs.
UART_TXD / UART_RXD	Asynchronous serial interface	Supports up to 4 Mbps; used for debug logging, host command channel, or sensor telemetry.

Key Features

Feature	Design Value
Programmable GPIF II	Graphically configurable 100-MHz parallel interface eliminates need for external FIFO or bridge ASIC in sensor-to-USB pipelines.
USB OTG Support	HS-OTG host/peripheral mode enables dual-role operation - e.g., camera acting as USB device or host for SD card reader.
Multi-protocol Peripherals	Integrated SPI (33 MHz), UART (4 Mbps), I²C (1 MHz), and I²S (192 kHz) reduce external component count for sensor/audio subsystems.
Flexible Boot Sources	Supports boot from SPI flash, I²C EEPROM, or USB host - simplifies firmware updates and field recovery in deployed systems.
Dual Power Domains	Independent 1.2-V core and scalable I/O voltage (1.2–3.3 V) allow safe interfacing with legacy and modern peripherals without level-shifting circuitry.

Applications

Industrial Machine Vision

Medical Endoscopy Imaging

Use Scenario: High-resolution CMOS image sensor streams raw video over USB 3.2 to host PC for real-time analysis.

IC Role / Device Role / Timing Role: USB controller bridges sensor GPIF II interface to host; manages isochronous UVC transfers with precise frame timing.

Use Value: Eliminates FPGA-based USB bridge; 512 KB SRAM buffers full HD frames at 60 fps while maintaining USB bandwidth integrity.

Use Scenario: Miniaturized endoscopic camera captures 4K video and transmits via USB to surgical workstation.

IC Role / Device Role / Timing Role: Acts as UVC-compliant endpoint with embedded descriptor handling and low-latency GPIF II sensor interface.

Use Value: Reduces BOM by integrating USB PHY, ARM processor, and sensor interface - critical for space-constrained medical housings.

Test & Measurement Data Capture

Surveillance IP Camera

Use Scenario: Oscilloscope digitizes analog signals and streams 16-bit samples at 100 MS/s to host for waveform reconstruction.

IC Role / Device Role / Timing Role: Configures GPIF II as synchronous slave FIFO to accept parallel ADC data; schedules bulk transfers with minimal CPU overhead.

Use Value: Achieves sustained >350 MB/s USB throughput using DMA and dual-buffered GPIF II - exceeds USB 2.0 limits by 7×.

Use Scenario: Outdoor security camera encodes H.265 video and delivers compressed streams over USB to NVR or edge AI box.

IC Role / Device Role / Timing Role: Hosts firmware that manages sensor control (I²C), audio sync (I²S), and USB streaming; handles renumerations for multi-camera enumeration.

Use Value: Enables single-chip USB video + audio transport without external microcontroller - lowers system latency and power consumption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 3.2 Gen 1 controller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CYUSB3014-BZXI	Same die, industrial temperature range (–40°C to +85°C) vs. commercial (0°C to +70°C); identical pinout and firmware compatibility.	Required for outdoor surveillance or factory-floor deployment where ambient temperature exceeds 70°C.	Select when extended thermal operation is mandatory; no firmware or layout changes needed.
CX3-EBZ	Image-specific USB 3.0 controller with MIPI CSI-2 receiver; lacks ARM CPU, GPIF II, and general-purpose peripherals.	Optimized for direct CMOS/CCD sensor attachment only; not suitable for non-video or custom interface applications.	Choose only for MIPI-based camera designs; not a drop-in replacement for GPIF II or CPU-dependent use cases.

Compared with CYUSB3014-BZXI, CYUSB3013-BZXC trades temperature margin for lower cost in climate-controlled environments; versus CX3-EBZ, it provides full programmability and peripheral flexibility at the expense of MIPI-native sensor integration.

Availability

CYUSB3013-BZXC is available at Aetrix Electronics and suitable for industrial machine vision, medical endoscopy imaging, and test & measurement data capture requiring stable component supply across multi-year production cycles.

Supply support for CYUSB3013-BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.

CYUSB3013-BZXC belongs to the EZ-USB FX3 family - designed specifically to enable high-bandwidth, firmware-programmable USB 3.2 Gen 1 connectivity for embedded vision, instrumentation, and data-intensive peripheral applications.

FAQ

Does CYUSB3013-BZXC require an external crystal?

Yes - it supports a 19.2 MHz fundamental-mode crystal connected to XIN/XOUT pins for primary clock generation. The internal PLL derives all required frequencies (e.g., 400 MHz for CPU, 100 MHz for GPIF II) from this source. External clock input (19.2/26/38.4/52 MHz) is also supported as an alternative.

Can CYUSB3013-BZXC operate as a USB host?

Yes - it implements USB On-The-Go (OTG) Supplement v2.0, enabling HS-OTG host mode. In host configuration, it can enumerate and communicate with USB 2.0 peripherals like flash drives or HID devices, using its integrated USB 2.0 transceiver and firmware-managed stack.

What development tools are officially supported for firmware creation?

Infineon's EZ-USB FX3 SDK (v1.3.4+) is the official toolset, including GCC-based ARM toolchain, ThreadX RTOS framework, GPIF II Designer GUI, and firmware examples for UVC, UAC, bulk transfer, and SPI/I²C sensor control. Visual Studio host examples in C++ and C# are included for rapid PC-side validation.

Is the 121-ball BGA package compatible with standard reflow profiles?

Yes - the Pb-free 121-ball BGA (JEDEC MO-271AB) is qualified for IPC/JEDEC J-STD-020D reflow profiles. Peak temperature must not exceed 260°C for ≤60 seconds; recommended stencil aperture is 0.25 mm with 50% area ratio to ensure reliable solder joint formation across all balls.

CYUSB3013-BZXC Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: EZ-USB FX3™

Package/Case:: 121-TFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Applications:: SuperSpeed USB Peripheral Controller

Core Processor:: ARM9®

Program Memory Type:: External Program Memory

Controller Series:: CYUSB

RAM Size:: 512K x 8

Interface:: GPIF, I2C, I2S, SPI, UART, USB

Number of I/O:: 60

Voltage - Supply:: 1.15V ~ 1.25V

Operating Temperature:: 0°C ~ 70°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 121-FBGA (10x10)

CYUSB3013-BZXC FAQ

1.How can I place an order for CYUSB3013-BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3013-BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3013-BZXC reliable?

The price and inventory of CYUSB3013-BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3013-BZXC is usually 5 days.

3.What payment methods are accepted for CYUSB3013-BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3013-BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3013-BZXC?

CYUSB3013-BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3013-BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3013-BZXC?

For technical support, including CYUSB3013-BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3013-BZXC requirements.

6.How does Aetrix verify that CYUSB3013-BZXC is sourced from the original manufacturer or authorized distributors?

All CYUSB3013-BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3013-BZXC meets industry standards.

7.What is the process for return or replacement of CYUSB3013-BZXC?

All CYUSB3013-BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3013-BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3013-BZXC part is unused and in its original packaging.

Return procedure for CYUSB3013-BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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