My Inquiry
My Account
Infineon Technologies CYUSB3014-BZXC
- Part No.:
- CYUSB3014-BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 121-TFBGA
- Datasheet:
-
CYUSB3014-BZXC.pdf
- Description:
- IC ARM9 USB3 CONTROLLER 121FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,048
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYUSB3014-BZXC from Infineon is a USB 3.2 Gen 1 (5 Gbps) and USB 2.0 compliant SuperSpeed USB controller IC with ARM926EJ-S core (200 MHz), 512 KB SRAM, programmable GPIF II interface (8/16/24/32-bit, 100 MHz), and integrated USB PHY. It serves as a bridge between high-bandwidth peripherals (e.g., image sensors, FPGAs) and host systems in embedded vision and data acquisition applications.
For engineers reviewing the CYUSB3014-BZXC datasheet, CYUSB3014-BZXC pinout, CYUSB3014-BZXC application, or CYUSB3014-BZXC equivalent, key selection criteria include GPIF II timing configurability, USB 3.2 Gen 1 compliance (TID #340800007), 121-ball BGA package compatibility, low-power core mode (<60 µA), and I²S master support at 192 kHz sampling rate.
Technical Context
The CYUSB3014-BZXC implements a dual-mode USB controller with full hardware support for USB 3.2 Gen 1 (5 Gbps) and USB 2.0 (480 Mbps), including HS-OTG host/peripheral operation per OTG Supplement v2.0. Its ARM926EJ-S CPU executes firmware directly from on-chip SRAM and manages endpoint buffers for 32 physical USB endpoints.
GPIF II operates as a fully programmable parallel interface with synchronous/asynchronous modes, configurable bus widths (8–32 bit), and up to 16 control signals - enabling direct connection to FPGA logic, CMOS image sensors, and external memory without glue logic. Clocking supports 19.2/26/38.4/52 MHz crystal or oscillator inputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| USB Compliance | USB 3.2 Gen 1 (5 Gbps) and USB 2.0; certified TID #340800007 - ensures interoperability with standard hosts and hubs. |
| CPU Core | ARM926EJ-S @ 200 MHz - enables real-time firmware processing of USB descriptors, endpoint management, and GPIF state machine control. |
| On-chip Memory | 512 KB SRAM - sufficient for dual-buffered UVC video streaming (e.g., 1080p30) and firmware execution without external RAM. |
| GPIF II Speed | 100 MHz programmable interface - supports sustained 800 MB/s throughput in 32-bit synchronous mode for sensor/FPGA bridging. |
| I²S Support | Master-only, 8–192 kHz sample rates - enables direct audio sensor interfacing (e.g., MEMS mics) alongside video streams. |
| Power Modes | Core power-down: <60 µA (VBATT on); independent 1.2 V core / 1.8–3.3 V I/O domains - simplifies mixed-voltage board design. |
| Boot Sources | Internal ROM + SPI Flash, I²C EEPROM, USB, or UART - enables field firmware updates and secure boot via external nonvolatile storage. |
Pinout & Package
Package: 121-ball, 10 mm × 10 mm, 0.8 mm pitch Pb-free BGA (ball map per Infineon datasheet Rev. *Z, Table 24 and Section 16).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[31:0] | GPIF II Data Bus | 32-bit bidirectional data path for synchronous/asynchronous slave FIFO or SRAM interfaces; configurable timing via GPIF Designer. |
| CTL[15:0] | GPIF II Control Signals | 16 programmable control lines (e.g., RD#, WR#, CS#, ADDR) - mapped to physical pins for custom peripheral handshaking. |
| USB_DP/DM | USB 3.2 Gen 1 Differential Pair | Integrated 5-Gbps SuperSpeed PHY differential I/O - requires controlled 90-Ω impedance routing and on-die termination. |
| VBUS_DET | USB VBUS Detection Input | Monitors host-supplied 5 V to enable OTG role switching and power management - supports Carkit UART mode when asserted. |
| CLKIN | Primary Clock Input | Accepts 19.2/26/38.4/52 MHz crystal or oscillator - drives USB PLL, CPU, and GPIF clocks; 19.2 MHz enables USB suspend/resume timing accuracy. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable GPIF II Interface | Graphically configurable via GPIF II Designer tool - eliminates need for external logic or FPGA glue logic when interfacing to custom sensors or ASICs. |
| USB Re-numeration Support | Runtime device descriptor reconfiguration - allows single firmware binary to emulate multiple USB classes (e.g., UVC + CDC ACM) without host driver changes. |
| Slave FIFO Mode | Hardware-accelerated zero-CPU-overhead data transfer - enables continuous 5-Gbps USB streaming from image sensors while CPU handles metadata and control. |
| Multi-protocol Peripherals | Integrated SPI (33 MHz), UART (4 Mbps), I²C (1 MHz), and I²S (192 kHz) - reduces external component count for sensor fusion and debug interfaces. |
| Boot Flexibility | Supports SPI Flash, I²C EEPROM, USB, and UART boot - enables secure firmware loading, field upgrades, and factory programming without JTAG. |
Applications
| Industrial Machine Vision | Medical Imaging Devices |
|---|---|
Use Scenario: High-resolution CMOS image sensor (e.g., 4K@30fps) connected to embedded vision system via parallel bus. IC Role / Device Role / Timing Role: USB bridge controller with GPIF II configured as synchronous slave FIFO - captures raw pixel data and forwards over USB 3.2 Gen 1. Use Value: Achieves >350 MB/s sustained bandwidth using 32-bit 100-MHz GPIF, eliminating frame drops during real-time inspection. | Use Scenario: Portable ultrasound probe transmitting RF beamformed data to tablet host. IC Role / Device Role / Timing Role: Dual-role USB device supporting UVC class for video streaming and CDC ACM for control commands. Use Value: Enables simultaneous high-fidelity imaging data transfer and real-time parameter adjustment without separate control channels. |
| Test & Measurement Equipment | Surveillance Camera Systems |
Use Scenario: 16-channel logic analyzer capturing digital signals at 100 MHz sample rate. IC Role / Device Role / Timing Role: Host-facing USB 3.2 Gen 1 endpoint with DMA-managed bulk transfers - offloads captured waveform data to PC software. Use Value: Sustains 500+ MB/s aggregate throughput across multiple endpoints, matching multi-lane FPGA capture buffers. | Use Scenario: Outdoor IP camera with H.265 encoding ASIC and local SD card storage. IC Role / Device Role / Timing Role: USB peripheral controller interfacing ASIC via 16-bit GPIF II - streams encoded video and relays motion-trigger events. Use Value: Reduces BOM cost by replacing discrete USB transceiver + microcontroller combo with single-chip solution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB 3.0 bridge controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYUSB3011-BZXI | Same architecture but with 256 KB SRAM and industrial temperature range (–40°C to +85°C). | Limited buffer depth restricts sustained 4K video streaming duration without external memory. | Select when operating in extended temperature environments and application firmware fits within 256 KB. |
| CX3-EBZ | MIPI CSI-2 receiver + USB 3.0 transmitter; no general-purpose GPIF II or ARM CPU. | Fixed sensor interface - only supports MIPI cameras, not parallel/FPGA/custom peripherals. | Select only for MIPI-based camera modules requiring minimal firmware development. |
Compared with CYUSB3011-BZXI, CYUSB3014-BZXC provides double on-chip SRAM for longer video buffering and higher USB throughput headroom; versus CX3-EBZ, it offers full programmability for non-MIPI interfaces but requires more firmware effort.
Availability
CYUSB3014-BZXC is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging devices, test and measurement equipment, and surveillance camera systems requiring stable component supply and long-term lifecycle support.
Supply support for CYUSB3014-BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and connectivity solutions, with global R&D and manufacturing infrastructure.
The EZ-USB FX3 product line targets high-bandwidth embedded USB bridging applications - specifically designed to replace discrete USB PHY + microcontroller combinations in vision, instrumentation, and industrial data acquisition systems.
FAQ
Does CYUSB3014-BZXC support USB 3.2 Gen 2 (10 Gbps)?
No. The CYUSB3014-BZXC implements USB 3.2 Gen 1 (5 Gbps) only, as confirmed by its PHY specification and USB-IF certification TID #340800007. It does not include the enhanced signaling or lane aggregation required for Gen 2 operation.
Can GPIF II be used to interface with DDR3 memory?
No. GPIF II supports asynchronous and synchronous SRAM-style protocols only - it lacks DDR3-specific command sequences, DQS strobes, or refresh control. External FPGA or dedicated memory controller is required for DDR3 interfacing.
Is JTAG debugging supported on CYUSB3014-BZXC?
Yes. The device includes a dedicated 5-pin JTAG interface (TCK, TMS, TDI, TDO, TRST#) compliant with IEEE 1149.1, enabling full boundary-scan testing and ARM9 core debugging via standard tools like Segger J-Link or Cypress-provided utilities.
What clock sources are validated for USB suspend/resume compliance?
A 19.2 MHz crystal input is explicitly validated for USB suspend/resume timing accuracy in the datasheet (Section 10.1). Other frequencies (26/38.4/52 MHz) require external clock conditioning or PLL configuration to meet USB 3.2 low-power exit timing requirements.
CYUSB3014-BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- EZ-USB FX3™
- Package/Case:
- 121-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- SuperSpeed USB Peripheral Controller
- Core Processor:
- ARM9®
- Program Memory Type:
- External Program Memory
- Controller Series:
- CYUSB
- RAM Size:
- 512K x 8
- Interface:
- GPIF, I2C, I2S, SPI, UART, USB
- Number of I/O:
- 60
- Voltage - Supply:
- 1.15V ~ 1.25V
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 121-FBGA (10x10)
CYUSB3014-BZXC FAQ
1.How can I place an order for CYUSB3014-BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CYUSB3014-BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYUSB3014-BZXC reliable?
The price and inventory of CYUSB3014-BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3014-BZXC is usually 5 days.
3.What payment methods are accepted for CYUSB3014-BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3014-BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYUSB3014-BZXC?
CYUSB3014-BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYUSB3014-BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYUSB3014-BZXC?
For technical support, including CYUSB3014-BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3014-BZXC requirements.
6.How does Aetrix verify that CYUSB3014-BZXC is sourced from the original manufacturer or authorized distributors?
All CYUSB3014-BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3014-BZXC meets industry standards.
7.What is the process for return or replacement of CYUSB3014-BZXC?
All CYUSB3014-BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3014-BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYUSB3014-BZXC part is unused and in its original packaging.
Return procedure for CYUSB3014-BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYUSB3014-BZXC Tags
-
CYPD3175-24LQXQ
Infineon Technologies
-
SLB9672VU20FW1523XTMA1
Infineon Technologies
-
SLB9670VQ20FW785XTMA1
Infineon Technologies
-
SLB9672XU20FW1523XTMA1
Infineon Technologies
-
SLB9673XU20FW2613XTMA1
Infineon Technologies
-
CYPD3125-40LQXIT
Infineon Technologies
-
AT97SC3204-U2A1A-20
Microchip Technology
-
AT97SC3204-U2A1A-10
Microchip Technology
-
SLM9670AQ20FW1311XTMA1
Infineon Technologies
-
SLB9672XU20FW1613XTMA1
Infineon Technologies
-
SLB9672AU20FW1613XTMA1
Infineon Technologies
-
SLB9673AU20FW2613XTMA1
Infineon Technologies
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
