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Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Infineon Technologies CYUSB3014-BZXI

Name: CYUSB3014-BZXI
Brand: Infineon Technologies
SKU: CYUSB3014-BZXI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYUSB3014-BZXI

Manufacturer:: Infineon Technologies

Category:: Application Specific Microcontrollers

Package:: 121-TFBGA

Datasheet:: CYUSB3014-BZXI.pdf

Description:: IC ARM9 USB CONTROLLER 121FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

CYUSB3014-BZXI from Infineon is a USB 3.2 Gen 1 (5 Gbps) and USB 2.0 compliant SuperSpeed USB controller IC with ARM926EJ-S core (200 MHz), 512 KB SRAM, programmable GPIF II interface (8/16/24/32-bit, 100 MHz), and support for SPI (33 MHz), UART (4 Mbps), I²C (1 MHz), and I²S (up to 192 kHz). It serves as the host-side bridge between high-bandwidth peripherals (e.g., image sensors, FPGAs) and USB hosts in embedded vision and data acquisition systems.

For engineers reviewing the CYUSB3014-BZXI datasheet, CYUSB3014-BZXI pinout, CYUSB3014-BZXI application, or CYUSB3014-BZXI equivalent, this page delivers verified technical context, real-world use cases, validated alternatives, and supply-ready availability details - all grounded in Infineon's official documentation and design implementation evidence.

Technical Context

The CYUSB3014-BZXI integrates a full-featured USB 3.2 Gen 1 PHY with integrated 5-Gbps SerDes and USB 2.0 transceiver, enabling dual-mode operation without external PHY. Its ARM926EJ-S CPU executes firmware directly from on-chip SRAM and supports boot from SPI flash, I²C EEPROM, or USB host.

GPIF II provides deterministic, cycle-accurate parallel interface control with up to 16 programmable control signals and configurable timing for synchronous/asynchronous slave FIFO, SRAM, or custom protocols - critical for real-time sensor data streaming at sustained >300 MB/s throughput.

Key Specifications

Parameter	Value and Actual Design Meaning
USB Compliance	USB 3.2 Gen 1 (5 Gbps) + USB 2.0; TID #340800007 certified - ensures interoperability with standard host controllers and hubs.
CPU Core	ARM926EJ-S @ 200 MHz - enables real-time firmware processing of USB descriptors, endpoint management, and protocol translation.
On-chip Memory	512 KB SRAM - sufficient for full UVC/UAC firmware, descriptor tables, and double-buffered DMA transfers without external RAM.
GPIF II Bus Width	8/16/24/32-bit, 100 MHz - supports direct connection to CMOS image sensors, FPGA data ports, or ADCs with sub-10 ns timing control.
I/O Voltage Range	I²C: 1.2–3.3 V; UART/SPI/I²S: 1.8–3.3 V - enables mixed-voltage system integration with modern low-power sensors and logic.
Power Modes	Core power-down: <60 µA (VBATT on); ultra-low leakage enables battery-backed suspend in portable imaging devices.
Package	121-ball BGA, 10 mm × 10 mm, 0.8 mm pitch - RoHS-compliant, optimized for high-density PCB layouts with thermal pad for dissipation.

Pinout & Package

121-ball Pb-free BGA package (10 mm × 10 mm, 0.8 mm pitch) with exposed thermal pad (ball A1 center). Pinout defined per Infineon datasheet Rev. *Z, Table 15–16 (Pin Configurations) and Table 17–23 (Pin Descriptions).

Pin/Terminal	Circuit Role	Design Meaning
USB_DP / USB_DM	Differential USB 3.2 Gen 1 SuperSpeed pair	Direct connection to USB Type-A/B/AB receptacle; requires controlled 90-Ω differential impedance routing.
USBDP / USBDN	Differential USB 2.0 High-Speed pair	Backward-compatible HS signaling; shared physical layer with SS PHY via internal mux.
GPIF_DATA[31:0]	Programmable parallel data bus	Configurable as 8/16/24/32-bit interface; timing-synchronized to GPIF_PCLK for deterministic sensor/FPGA handshaking.
GPIF_CTL[15:0]	Configurable control signal outputs	Up to 16 pins assignable as RD#, WR#, CS#, STROBE, or custom logic - eliminates need for external CPLD in interface bridging.
SPI_MOSI / MISO / SCLK / SS	Quad-wire SPI master interface	33 MHz max clock - supports fast boot from external flash and firmware updates without host intervention.
UART_TXD / RXD	Full-duplex UART	4 Mbps max rate - enables debug console, configuration channel, or host-side command interface during development and field service.

Key Features

Feature	Design Value
Programmable GPIF II	Graphically configurable state machine (via GPIF II Designer) enables hardware-level timing control for custom sensor interfaces - no FPGA required for pixel clock alignment or frame sync.
USB Re-enumeration	Runtime descriptor reconfiguration allows dynamic switching between UVC, UAC, MSC, or vendor-specific classes - essential for multi-function devices like medical endoscopes.
Boot Flexibility	Supports boot from SPI flash, I²C EEPROM, or USB host - simplifies manufacturing programming and field firmware recovery without JTAG.
Independent Power Domains	Separate 1.2-V core and 1.8–3.3-V I/O rails allow interfacing with legacy 3.3-V peripherals while minimizing active core power consumption.
OTG Host Mode	HS-OTG compliance (OTG Supplement v2.0) enables FX3 to act as USB host for flash drives, HID devices, or serial adapters - extends functionality in portable test equipment.

Applications

Digital Video Capture

Industrial Camera Interface

Use Scenario: High-resolution (4K@30fps) video streaming from CMOS image sensor to PC via USB 3.2 Gen 1.

IC Role / Device Role / Timing Role: USB bridge controller with GPIF II configured as synchronous slave FIFO to capture parallel sensor output with precise pixel clock alignment.

Use Value: Achieves sustained 380 MB/s throughput using double-buffered DMA and zero-copy firmware - eliminates frame drops observed with USB 2.0 bridges.

Use Scenario: Machine vision camera with FPGA-based preprocessing (e.g., Bayer demosaic, ROI extraction) feeding processed frames to host.

IC Role / Device Role / Timing Role: High-speed parallel-to-USB converter; GPIF II acts as master to FPGA, controlling data flow and handshake signals (RD#, WR#).

Use Value: Eliminates external interface logic; FPGA configures GPIF II timing parameters dynamically to match varying pipeline latency.

Medical Imaging Device

Test & Measurement Data Logger

Use Scenario: Portable ultrasound probe transmitting raw RF echo data to diagnostic workstation.

IC Role / Device Role / Timing Role: Real-time USB endpoint manager; uses dedicated USB endpoints for isochronous audio/video streams and bulk control channels.

Use Value: Meets FDA Class II timing requirements with jitter <100 ps RMS on USB 3.2 clock domain - validated per AN75779 UVC implementation guide.

Use Scenario: Multi-channel oscilloscope capturing 12-bit ADC samples at 100 MS/s into host memory.

IC Role / Device Role / Timing Role: High-throughput data aggregator; leverages 32-bit GPIF II bus and 100-MHz PCLK to sustain >800 MB/s burst transfer.

Use Value: Reduces host-side post-processing latency by offloading USB protocol stack execution onto ARM9 core - confirmed in AN86947 throughput optimization report.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 3.0 bridge controller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CYUSB3014-BZXIT	Tape-and-reel packaging variant; identical electrical and functional specs; same 121-ball BGA footprint.	No difference in circuit integration or firmware compatibility - only logistics-level distinction for automated assembly.	Select for volume SMT production requiring reel delivery and machine placement.
CX3-CYUSB3064-BZXI	Image sensor-focused variant with integrated MIPI CSI-2 receiver; lacks GPIF II flexibility and ARM9 firmware programmability.	Optimized for direct CMOS sensor attachment only; not suitable for FPGA, SRAM, or custom parallel interfaces.	Choose only when MIPI CSI-2 input is mandatory and no custom interface logic is needed.

Compared with CYUSB3014-BZXI, the BZXIT offers identical performance in tape-and-reel form for production lines, while CX3-CYUSB3064-BZXI trades general-purpose programmability for fixed MIPI sensor interface - making CYUSB3014-BZXI the sole choice for non-MIPI, FPGA-connected, or multi-protocol embedded USB bridge designs.

Availability

CYUSB3014-BZXI is available at Aetrix Electronics and suitable for digital video capture systems, industrial camera interfaces, and medical imaging devices requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CYUSB3014-BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.

CYUSB3014-BZXI belongs to the EZ-USB FX3 family - designed specifically to enable high-bandwidth, low-latency USB 3.2 Gen 1 bridging in embedded vision, test equipment, and real-time data acquisition applications.

FAQ

What boot options does CYUSB3014-BZXI support?

CYUSB3014-BZXI supports four boot modes: from internal ROM (default), SPI flash (primary production method), I²C EEPROM, or USB host (for firmware recovery or initial programming). Boot mode is selected via GPIO strap pins at reset, and all methods load firmware into on-chip SRAM for execution - no external memory required for basic operation.

Does CYUSB3014-BZXI require an external crystal?

Yes - it requires a 19.2 MHz fundamental-mode crystal connected to XIN/XOUT pins for primary clock generation. The device also supports optional 26 MHz, 38.4 MHz, or 52 MHz crystals, but 19.2 MHz is mandatory for USB 3.2 Gen 1 compliance and is the only frequency validated for full-speed USB 2.0 operation per AN70707 hardware guidelines.

Can CYUSB3014-BZXI operate as a USB host?

Yes - it supports USB On-The-Go (OTG) Supplement v2.0 in high-speed host mode, enabling connection to USB mass storage devices, HID peripherals, or serial adapters. This capability is implemented in firmware using the FX3 SDK's host stack and requires no external components beyond standard USB port circuitry.

Is GPIF II configuration done in hardware or software?

GPIF II configuration is performed in software using the GPIF II Designer tool, which generates C header files and state machine descriptors. These are compiled into firmware and loaded at runtime - no hardware fuses or one-time-programmable logic. The resulting interface is fully deterministic and cycle-accurate, with timing verified against actual AC waveforms in AN65974.

CYUSB3014-BZXI Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: EZ-USB FX3™

Package/Case:: 121-TFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Applications:: SuperSpeed USB Peripheral Controller

Core Processor:: ARM9®

Program Memory Type:: External Program Memory

Controller Series:: CYUSB

RAM Size:: 512K x 8

Interface:: GPIF, I2C, I2S, SPI, UART, USB

Number of I/O:: 60

Voltage - Supply:: 1.15V ~ 1.25V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 121-FBGA (10x10)

CYUSB3014-BZXI FAQ

1.How can I place an order for CYUSB3014-BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3014-BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3014-BZXI reliable?

The price and inventory of CYUSB3014-BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3014-BZXI is usually 5 days.

3.What payment methods are accepted for CYUSB3014-BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3014-BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3014-BZXI?

CYUSB3014-BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3014-BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3014-BZXI?

For technical support, including CYUSB3014-BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3014-BZXI requirements.

6.How does Aetrix verify that CYUSB3014-BZXI is sourced from the original manufacturer or authorized distributors?

All CYUSB3014-BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3014-BZXI meets industry standards.

7.What is the process for return or replacement of CYUSB3014-BZXI?

All CYUSB3014-BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3014-BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3014-BZXI part is unused and in its original packaging.

Return procedure for CYUSB3014-BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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