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Infineon Technologies CYUSB3014-BZXIT

Part No.:
CYUSB3014-BZXIT
Manufacturer:
Infineon Technologies
Category:
Application Specific Microcontrollers
Package:
121-TFBGA
Datasheet:
AetrixCYUSB3014-BZXIT.pdf
Description:
IC ARM9 USB CONTROLLER 121FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,193

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Product details

Overview

CYUSB3014-BZXIT from Infineon is a USB 3.2 Gen 1 (5 Gbps) and USB 2.0 compliant SuperSpeed USB controller with ARM926EJ-S core (200 MHz), 512 KB SRAM, programmable GPIF II interface (8/16/24/32-bit, 100 MHz), and support for SPI (33 MHz), UART (4 Mbps), I²C (1 MHz), and I²S (up to 192 kHz). It serves as the host-side bridge between high-bandwidth peripherals-such as image sensors or FPGAs-and USB hosts in embedded vision and data acquisition systems.

For engineers reviewing the CYUSB3014-BZXIT datasheet, CYUSB3014-BZXIT pinout, CYUSB3014-BZXIT application, or CYUSB3014-BZXIT equivalent, key selection criteria include GPIF II timing configurability, dual-speed USB compliance, low-power core state (<60 µA), independent I/O voltage domains (1.2–3.3 V), and BGA-121 package compatibility with high-density PCB layouts.

Technical Context

The CYUSB3014-BZXIT implements a dedicated USB 3.2 Gen 1 PHY with full backward compatibility to USB 2.0, enabling simultaneous SuperSpeed and High-Speed device enumeration. Its ARM926EJ-S CPU executes firmware directly from on-chip SRAM and supports real-time USB video class (UVC) streaming via configurable GPIF II slave FIFO interfaces.

GPIF II operates at up to 100 MHz with fully programmable state machines, supporting synchronous/asynchronous SRAM, Slave FIFO, and custom protocols. Boot options include SPI Flash, I²C EEPROM, or USB-hosted firmware download-enabling field-upgradable operation without external programming hardware.

Key Specifications

ParameterValue and Actual Design Meaning
USB ComplianceUSB 3.2 Gen 1 (5 Gbps) + USB 2.0; TID #340800007 certified - ensures interoperability with standard host controllers and hubs.
CPU CoreARM926EJ-S @ 200 MHz - enables deterministic real-time firmware execution for UVC, bulk-transfer, and custom protocol handling.
On-chip Memory512 KB SRAM - sufficient for dual-buffered video pipelines, descriptor tables, and RTOS (ThreadX) with application code.
GPIF II Bus Width8/16/24/32-bit programmable - matches common sensor/FPGA data buses without glue logic or level shifters.
I/O Voltage RangeI²S/UART/SPI: 1.8–3.3 V; I²C: 1.2–3.3 V; Core: 1.2 V - allows direct interfacing with diverse peripheral voltage rails.
Power Consumption<60 µA in core power-down (VBATT on) - supports battery-backed suspend states in portable imaging devices.
Clock Inputs19.2 / 26 / 38.4 / 52 MHz crystal or oscillator - enables precise USB SOF timing and synchronization with external video clocks.

Pinout & Package

Package: 121-ball, 10 mm × 10 mm, 0.8 mm pitch Pb-free BGA (ball map per Infineon datasheet Rev. *Z, Table 24 and Section 16).

Pin/TerminalCircuit RoleDesign Meaning
DQ[31:0]GPIF II Data BusConfigurable 32-bit parallel interface for high-throughput sensor/FPGA data capture; supports synchronous/asynchronous timing modes.
CTL[15:0]GPIF II Control Signals16 programmable control lines (e.g., RD#, WR#, CS#, PCLK) - define custom handshake protocols without FPGA logic.
USB_DP / USB_DMUSB 3.2 Gen 1 Differential PairIntegrated 5-Gbps SuperSpeed transceiver; requires controlled 90-Ω differential impedance routing.
VBUS_DETUSB VBUS Monitoring InputDetects host-supplied 5 V to enable OTG role switching and power management decisions.
CLKINPrimary Clock InputAccepts 19.2 MHz crystal (with internal load caps) or external clock - critical for USB SOF accuracy and I²S sample rate stability.

Key Features

FeatureDesign Value
Programmable GPIF II InterfaceGraphical configuration via GPIF II Designer tool; eliminates FPGA-based interface logic and reduces BOM cost in camera modules.
USB Re-enumeration SupportAllows dynamic switching between device classes (e.g., UVC → MSC) without physical disconnect - essential for multi-function test equipment.
Independent Power DomainsCore (1.2 V) and I/O (1.2–3.3 V) supplies decoupled - enables mixed-voltage system integration without level translators.
Boot FlexibilitySupports SPI Flash, I²C EEPROM, or USB-host firmware download - simplifies production programming and field updates.
Ultra-Low-Power Suspend20 µA current draw with VBATT off - extends battery life in portable medical imagers and handheld scanners.

Applications

Digital Video CamcordersIndustrial Cameras

Use Scenario: Real-time 1080p60 video streaming from CMOS sensor to PC via USB 3.2 Gen 1.

IC Role / Device Role / Timing Role: USB bridge controller with GPIF II configured as synchronous Slave FIFO to absorb sensor pixel data at 120 MB/s.

Use Value: Eliminates need for external FIFO or FPGA; 512 KB SRAM buffers frame bursts during USB host latency spikes.

Use Scenario: High-resolution machine vision inspection using rolling-shutter global-reset sensors.

IC Role / Device Role / Timing Role: Timing-critical interface managing sensor trigger, exposure sync, and pixel clock alignment via GPIO and GPIF II control signals.

Use Value: Sub-microsecond jitter on CTL lines ensures precise exposure windowing and frame synchronization across multi-camera rigs.

Surveillance CamerasData Acquisition Systems

Use Scenario: Multi-stream H.264 encoding with metadata overlay (motion detection, timestamp) over USB.

IC Role / Device Role / Timing Role: Host-side USB controller coordinating sensor input, JPEG encoder (external), and USB packetization under ThreadX RTOS.

Use Value: Dual-speed USB ensures fallback to USB 2.0 if Gen 1 link degrades - maintains video continuity in electrically noisy environments.

Use Scenario: Simultaneous sampling from 16-channel ADCs at 1 MS/s with timestamping and error correction.

IC Role / Device Role / Timing Role: High-throughput data aggregator using GPIF II in 32-bit burst mode, feeding DMA into SRAM before USB bulk transfer.

Use Value: 100-MHz GPIF II clock sustains 400 MB/s peak throughput - exceeds typical 16-bit × 16-ch × 1-MS/s = 32 MB/s requirement by 12× margin.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB bridge controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CYUSB3014-BZXISame die, non-tape-and-reel packaging (tray); identical electrical specs and pinout.No functional difference; intended for prototyping or low-volume assembly.Select for evaluation or small-batch builds where reel packaging is unnecessary.
CYUSB3014-BZXCCommercial temperature grade (0°C to 70°C) vs. extended (-40°C to 85°C) for CYUSB3014-BZXIT.Not rated for industrial ambient extremes; unsuitable for outdoor surveillance or factory-floor DAQ.Choose only for indoor consumer electronics where thermal margins exceed spec limits.

Compared with CYUSB3014-BZXI and CYUSB3014-BZXC, the CYUSB3014-BZXIT offers guaranteed operation across -40°C to +85°C, full tape-and-reel delivery for SMT lines, and identical firmware compatibility - making it the sole choice for volume industrial deployments requiring traceable, temperature-qualified supply.

Availability

CYUSB3014-BZXIT is available at Aetrix Electronics and suitable for digital video camcorders, industrial cameras, and data acquisition systems requiring stable component supply, long-term lifecycle assurance, and full temperature-grade compliance.

Supply support for CYUSB3014-BZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and connectivity solutions, with global R&D and manufacturing infrastructure.

The EZ-USB FX3 product line delivers high-performance, firmware-programmable USB 3.x bridge controllers targeting embedded vision, test equipment, and industrial data transfer - emphasizing configurability, low-latency I/O, and seamless host integration.

FAQ

Does CYUSB3014-BZXIT support USB On-The-Go (OTG) functionality?

Yes, it supports HS-OTG host and peripheral modes per USB OTG Supplement v2.0. The device can dynamically switch roles using VBUS detection and ID pin sensing, enabling single-cable connectivity between cameras and mobile hosts without hub dependency. Firmware-controlled re-enumeration allows class switching (e.g., UVC to MSC) during operation.

What development tools are required to configure the GPIF II interface?

The Cypress-provided GPIF II Designer tool (included in EZ-USB FX3 SDK) is mandatory. It generates synthesizable HDL-like state machine code from graphical pin assignments, timing parameters, and bus-width selections. Output integrates directly into FX3 firmware build; no external synthesis tools or FPGA IDEs are needed.

Can CYUSB3014-BZXIT operate without external memory?

Yes - all firmware and data buffers execute from its 512 KB on-chip SRAM. No external RAM or Flash is required for basic UVC or bulk-transfer operation. External SPI Flash is optional for non-volatile firmware storage; I²C EEPROM may be used for device descriptors but is not mandatory.

Is the 19.2 MHz crystal input mandatory for USB 3.2 Gen 1 operation?

No - while 19.2 MHz is the reference clock for USB SOF generation and recommended for I²S synchronization, the device accepts 26 MHz, 38.4 MHz, or 52 MHz inputs. All supported frequencies derive exact 125 MHz USB reference clocks via internal PLL; 19.2 MHz remains preferred for lowest jitter in video timing-critical applications.

CYUSB3014-BZXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
EZ-USB FX3™
Package/Case:
121-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Applications:
SuperSpeed USB Peripheral Controller
Core Processor:
ARM9®
Program Memory Type:
External Program Memory
Controller Series:
CYUSB
RAM Size:
512K x 8
Interface:
GPIF, I2C, I2S, SPI, UART, USB
Number of I/O:
60
Voltage - Supply:
1.15V ~ 1.25V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
121-FBGA (10x10)

CYUSB3014-BZXIT FAQ

1.How can I place an order for CYUSB3014-BZXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3014-BZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3014-BZXIT reliable?

The price and inventory of CYUSB3014-BZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3014-BZXIT is usually 5 days.

3.What payment methods are accepted for CYUSB3014-BZXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3014-BZXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3014-BZXIT?

CYUSB3014-BZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3014-BZXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3014-BZXIT?

For technical support, including CYUSB3014-BZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3014-BZXIT requirements.

6.How does Aetrix verify that CYUSB3014-BZXIT is sourced from the original manufacturer or authorized distributors?

All CYUSB3014-BZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3014-BZXIT meets industry standards.

7.What is the process for return or replacement of CYUSB3014-BZXIT?

All CYUSB3014-BZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3014-BZXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3014-BZXIT part is unused and in its original packaging.

Return procedure for CYUSB3014-BZXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYUSB3014-BZXIT Tags

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