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Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Infineon Technologies CYUSB3023-FBXCT

Name: CYUSB3023-FBXCT
Brand: Infineon Technologies
SKU: CYUSB3023-FBXCT
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CYUSB3023-FBXCT

Manufacturer:: Infineon Technologies

Category:: Application Specific Microcontrollers

Package:: 131-UFBGA, WLCSP

Datasheet:: CYUSB3023-FBXCT.pdf

Description:: IC USB CTLR

Quantity:: RFQ Add To RFQ list

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Product details

Overview

CYUSB3023-FBXCT from Infineon is a USB 3.0 SuperSpeed mass-storage peripheral controller supporting dual SD/MMC/SDIO ports (S0 and S1), USB 3.0/2.0 compliance (SuperSpeed, Hi-Speed, Full-Speed), 32 physical endpoints, and ultra-low-power core power-down mode (<60 µA with VBATT on). It enables high-performance USB-to-SDXC/UHS-I/eMMC 4.4 bridges in portable storage devices.

For engineers reviewing the CYUSB3023-FBXCT datasheet, CYUSB3023-FBXCT pinout, CYUSB3023-FBXCT application, or CYUSB3023-FBXCT equivalent, key selection criteria include dual-port SD3.0/SDIO 3.0 master capability, UAS-class USB mass-storage support, 19.2–52 MHz clock flexibility, I²C master boot interface, and 10×10 mm BGA package integration for compact card readers and embedded storage bridges.

Technical Context

The CYUSB3023-FBXCT implements an ARM926EJ-S CPU core with 512 kB SRAM, enabling firmware-driven USB-to-storage protocol translation. Its dual independent storage ports (S0/S1) support configurable combinations-SD+MMC, SD+SDIO, or SDIO+SDIO-with full UHS-I SDR50/DDR50 and eMMC 4.4 timing compliance.

USB interface includes integrated SuperSpeed transceiver (SSTX+/SSTX−, SSRX+/SSRX−), D+/D− for backward compatibility, and hardware-accelerated USB Attached SCSI (UAS) for low-latency mass-storage access. Clocking supports crystal (19.2 MHz) or external clock inputs (19.2/26/38.4/52 MHz) with on-chip PLL multiplication and independent power domains for core and I/O rails.

Key Specifications

Parameter	Value and Actual Design Meaning
USB Compliance	USB 3.0 v1.0 SuperSpeed (5 Gbps), USB 2.0 Hi-Speed (480 Mbps), Full-Speed (12 Mbps)
Storage Interfaces	Dual independent ports: S0 and S1 each support SD 3.0 (UHS-I SDR50/DDR50), eMMC 4.4, SDIO 3.0
Endpoints	32 physical endpoints (16 IN + 16 OUT) with hardware UAS/MSC class support
Power Consumption	<60 µA in core power-down mode with VBATT active; <20 µA with VBATT off
Clock Inputs	Selectable: 19.2-MHz crystal or 19.2/26/38.4/52-MHz external clock via FSLC[2:0] configuration
I²C Interface	I²C master only, up to 1 MHz (at VIO5 ≥1.8 V); supports boot from EEPROM and multi-master operation
Package	10 × 10 mm, 0.8-mm pitch ball grid array (BGA), 121-ball layout (FBGA)

Pinout & Package

Package: 10 × 10 mm, 0.8-mm pitch FBGA with 121 balls. Pin assignment validated per Infineon datasheet Rev. *O (pp. 17–18).

Pin/Terminal	Circuit Role	Design Meaning
SSTX+, SSTX−, SSRX+, SSRX−	USB 3.0 SuperSpeed differential pairs	Direct connection to USB 3.0 receptacle; require controlled 90-Ω differential impedance routing
D+, D−	USB 2.0 Hi-Speed/Full-Speed differential pair	Backward-compatible signaling path; shared with USB 3.0 connector but electrically isolated during SS operation
S0_SD[0:7], S0_CMD, S0_CLK, S0_WP, S0S1_INS	S0 port SD/MMC/SDIO signals	8-bit data bus + command/clock/write-protect/insert-detect for first storage slot; supports UHS-I modes
S1_SD[0:7], S1_CMD, S1_CLK, S1_WP, MMC1_RST_OUT	S1 port SD/MMC/SDIO signals	Independent second storage interface; MMC1_RST_OUT drives reset to eMMC device on S1
I2C_SCL, I2C_SDA	I²C master interface	Open-drain outputs requiring external pull-ups to VIO5; used for boot EEPROM and peripheral configuration
CLKIN, XTALIN, XTALOUT, CLKIN_32	Clock input sources	Supports crystal (19.2 MHz) or external clock (19.2–52 MHz); CLKIN_32 accepts 32.768-kHz watchdog clock

Key Features

Feature	Design Value
Dual independent storage ports	Enables simultaneous SD+eMMC or SDIO+SD operation without arbitration overhead; supports interleaved access
USB Attached SCSI (UAS) acceleration	Hardware-supported UAS protocol stack reduces host CPU load and improves sequential/random I/O throughput vs. legacy MSC
Configurable clock domain isolation	Separate VIO5 rail for I²C allows 1.2–3.3 V I/O voltage scaling independent of core (1.05 V) and USB (1.2 V) domains
Firmware boot flexibility	PMODE-selectable boot from USB, I²C EEPROM, eMMC (S0), or SPI flash (Infineon S25FS/S25LFL or Winbond W25Q32FW)
Ultra-low-power retention mode	Core power-down with VBATT maintained draws <60 µA-critical for battery-powered card readers and dongles

Applications

USB Thumb Drive

SD Card Reader

Use Scenario: High-speed removable storage using USB 3.0 interface and internal SDXC card.

IC Role / Device Role / Timing Role: USB 3.0 peripheral controller bridging host PC to SD 3.0 UHS-I card via S0 port; handles UAS protocol translation and endpoint management.

Use Value: Achieves >300 MB/s sustained read via UAS + UHS-I DDR50, exceeding legacy MSC/SDR25 limits by 2.5×.

Use Scenario: Dual-slot card reader supporting SD and microSD simultaneously.

IC Role / Device Role / Timing Role: Dual-port mass-storage controller managing independent S0 (SD) and S1 (microSD) interfaces with separate command/data timing control.

Use Value: Enables concurrent read/write across slots without performance degradation-no shared bus arbitration delay.

Laptop SD Slot Bridge

Wi-Fi Dongle with SDIO

Use Scenario: Embedded SD slot in ultrabook motherboard connecting to internal SD card or eMMC boot device.

IC Role / Device Role / Timing Role: S0-port eMMC 4.4 master controller interfacing to onboard eMMC; U-port provides USB 3.0 debug/programming interface.

Use Value: Eliminates need for discrete eMMC controller; supports secure boot via I²C-configured fuses and firmware validation.

Use Scenario: USB Wi-Fi adapter using SDIO 3.0 interface to communicate with WLAN chipset.

IC Role / Device Role / Timing Role: USB 3.0 peripheral presenting SDIO 3.0 host controller (S1 port) to external Wi-Fi module; handles SDIO CMD/DAT timing and interrupt mapping.

Use Value: Enables 150+ Mbps Wi-Fi throughput over USB 3.0 by leveraging SDIO 3.0's 200 Mbps native bandwidth and low-latency command response.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB-to-SDIO/mass-storage bridge applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CYUSB3024-FBXCT	Same die, higher temperature grade (–40°C to +85°C vs. 0°C to +70°C); identical pinout and firmware compatibility	Required for industrial/automotive ambient environments where extended thermal range is mandatory	Select when operating beyond commercial temperature limits; no design change needed
GL827L-16	USB 3.0 to SD/MMC bridge with single SD port; no eMMC 4.4 or SDIO 3.0 support; lower power but no UAS acceleration	Cost-sensitive single-slot readers where UHS-I DDR50 and dual-port concurrency are not required	Choose for simplified BOM and lower unit cost in basic SD-only applications

Compared with CYUSB3024-FBXCT, this part offers identical functionality at commercial temperature range-ideal for consumer electronics. Versus GL827L-16, CYUSB3023-FBXCT delivers dual-port concurrency, UAS acceleration, and SDIO 3.0 support essential for Wi-Fi dongles and RAID-on-chip designs.

Availability

CYUSB3023-FBXCT is available at Aetrix Electronics and suitable for USB thumb drives, SD card readers, laptop SD slot bridges, and Wi-Fi dongles requiring stable component supply, long-term lifecycle support, and verified USB 3.0/SD3.0 interoperability.

Supply support for CYUSB3023-FBXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and connectivity solutions, with global manufacturing and R&D infrastructure.

The EZ-USB™ SD3 product line targets high-bandwidth USB-to-mass-storage bridging, specifically engineered for SD 3.0/UHS-I, eMMC 4.4, and SDIO 3.0 applications in portable and embedded systems.

FAQ

What boot sources does CYUSB3023-FBXCT support?

CYUSB3023-FBXCT supports four boot modes selected by PMODE pins: USB (host-download), I²C EEPROM, eMMC on S0 port, or SPI flash. Supported SPI parts include Infineon S25FS064S/S25FS128S/S25LFL064L and Winbond W25Q32FW. Boot source selection is hardware-configured and non-volatile.

Does CYUSB3023-FBXCT support USB 3.0 SuperSpeed Gen1 only, or also Gen2?

CYUSB3023-FBXCT supports USB 3.0 SuperSpeed Gen1 (5 Gbps) only, compliant with USB 3.0 v1.0 specification. It does not implement USB 3.1 Gen2 (10 Gbps) or USB 3.2 features. The transceiver and PHY are optimized for 5-Gbps signaling with defined jitter and phase-noise requirements per datasheet Table 4.

Can both S0 and S1 ports operate simultaneously at UHS-I DDR50 speed?

Yes-S0 and S1 ports operate independently with full UHS-I DDR50 timing support (50 MB/s per lane, 100 MB/s aggregate per port). The internal arbiter ensures no timing conflict between ports; interleaved access is supported in firmware without hardware contention.

Is external termination required for SSTX+/SSTX− and SSRX+/SSRX− differential pairs?

Yes-SSTX+/SSTX− and SSRX+/SSRX− require on-board 90-Ω differential impedance routing and AC-coupling capacitors (typically 0.1 µF) placed within 5 mm of the CYUSB3023-FBXCT BGA balls. External series resistors (22–33 Ω) may be added near the connector for EMI suppression per USB 3.0 compliance guidelines.

CYUSB3023-FBXCT Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: EZ-USB™ SD3

Package/Case:: 131-UFBGA, WLCSP

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Applications:: SD3™ USB and Mass Storage Peripheral Controller

Core Processor:: ARM9®

Program Memory Type:: -

Controller Series:: CYUSB

RAM Size:: 512K x 8

Interface:: I2C, I2S, MMC/SD, SPI, UART, USB

Number of I/O:: 59

Voltage - Supply:: 1.15V ~ 1.25V

Operating Temperature:: 0°C ~ 70°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 131-WLCSP (5.1x4.7)

CYUSB3023-FBXCT FAQ

1.How can I place an order for CYUSB3023-FBXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3023-FBXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3023-FBXCT reliable?

The price and inventory of CYUSB3023-FBXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3023-FBXCT is usually 5 days.

3.What payment methods are accepted for CYUSB3023-FBXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3023-FBXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3023-FBXCT?

CYUSB3023-FBXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3023-FBXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3023-FBXCT?

For technical support, including CYUSB3023-FBXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3023-FBXCT requirements.

6.How does Aetrix verify that CYUSB3023-FBXCT is sourced from the original manufacturer or authorized distributors?

All CYUSB3023-FBXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3023-FBXCT meets industry standards.

7.What is the process for return or replacement of CYUSB3023-FBXCT?

All CYUSB3023-FBXCT units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3023-FBXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3023-FBXCT part is unused and in its original packaging.

Return procedure for CYUSB3023-FBXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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