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Infineon Technologies CYUSB3035-BZXC

Part No.:
CYUSB3035-BZXC
Manufacturer:
Infineon Technologies
Category:
Application Specific Microcontrollers
Package:
121-TFBGA
Datasheet:
AetrixCYUSB3035-BZXC.pdf
Description:
IC USB CTLR
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,584

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Product details

Overview

CYUSB3035-BZXC from Infineon is a USB 3.0/2.0 SuperSpeed controller IC featuring an ARM926EJ-S core (200 MHz), 512-KB embedded SRAM, 32 physical endpoints, and a programmable 100-MHz GPIF II interface supporting 8-/16-bit buses and up to 16 control signals. It integrates SD/MMC/eMMC controllers (UHS-I, RAID0/RAID1), dual SDIO 3.0 ports, and interfaces including I²C (1 MHz), UART (4 Mbps), SPI (33 MHz), and I²S (up to 192 kHz), targeting high-bandwidth embedded USB peripheral designs.

For engineers reviewing the CYUSB3035-BZXC datasheet, CYUSB3035-BZXC pinout, CYUSB3035-BZXC application, or CYUSB3035-BZXC equivalent, this device is selected for USB-attached storage (UAS), mass-storage-class (MSC) peripherals, video capture systems requiring real-time data streaming, and industrial RAID-on-module implementations where deterministic timing, low-latency host-to-peripheral bridging, and multi-protocol I/O flexibility are critical.

Technical Context

The CYUSB3035-BZXC implements a dedicated USB 3.0 PHY compliant with PIPE 3.0 and supports HS-OTG host/peripheral operation per OTG Supplement v2.0. Its ARM926EJ-S CPU executes firmware directly from on-chip SRAM and manages endpoint buffering, descriptor handling, and protocol state machines without external memory dependency.

GPIF II operates as a fully configurable state-machine-based parallel interface with precise timing control-supporting asynchronous/synchronous SRAM, slave FIFO, and custom protocols-and interfaces directly with FPGAs, image sensors, or NAND flash via its 16-bit data bus and 16 programmable control lines.

Key Specifications

ParameterValue and Actual Design Meaning
USB ComplianceUSB 3.0 spec 1.0 + USB 2.0 + HS-OTG v2.0: Enables dual-role operation and backward compatibility with legacy hosts and peripherals.
CPU CoreARM926EJ-S @ 200 MHz: Provides real-time firmware execution for protocol stack management and peripheral control without external processor.
Embedded Memory512-KB SRAM: Sufficient for full UAS/MSC/HID firmware, descriptor tables, and endpoint buffers-eliminates need for external RAM in most configurations.
GPIF II Bus Width8- or 16-bit: Matches common sensor/FPGA data widths; enables direct connection to CMOS image sensors or FPGA logic without glue logic.
SD/MMC SupportSD 3.0 (UHS-I), eMMC 4.41, 2TB capacity per port, built-in RAID0/RAID1: Allows bootable, redundant, high-capacity removable storage in compact form factors.
Low-Power Mode<60 µA (VBATT on): Enables battery-backed suspend in portable imaging or surveillance devices with persistent configuration retention.
I/O Voltage RangeI²C: 1.2 V; UART/I²S/SPI: 1.8–3.3 V: Supports mixed-voltage system integration with modern low-voltage sensors and legacy 3.3-V peripherals.

Pinout & Package

10-mm × 10-mm, 0.8-mm pitch Pb-free BGA package (121-ball array, 11×11 grid).

Pin/TerminalCircuit RoleDesign Meaning
USB_DP / USB_DMSuperSpeed differential pairDirect connection to USB 3.0 receptacle; requires controlled 90-Ω differential impedance routing.
SSRX_P / SSRX_N
SSTX_P / SSTX_N
SuperSpeed RX/TX differential lanesTerminate with 50-Ω single-ended to ground; enable 5-Gbps link negotiation with host.
GPIF_D[15:0]Programmable data busConfigurable as 8- or 16-bit bidirectional data path to FPGA, sensor, or memory; timing-synchronized to PCLK.
GPIF_CTL[15:0]Programmable control signalsUp to 16 user-defined strobes, enables, or handshakes-mapped to custom state machine transitions in GPIF II Designer.
S0_CLK / S0_CMD / S0_DAT[3:0]SDIO Port 0 interfaceSupports SD 3.0 UHS-I mode at 104 MB/s; includes card-detect and write-protect sensing.
VBATTBackup power supplyMaintains RTC and register state during main power loss; draws <20 µA when off.

Key Features

FeatureDesign Value
Programmable GPIF II interfaceGraphically configurable via Infineon's GPIF II Designer tool-enables custom timing-critical interfaces (e.g., MIPI CSI-2 bridge, FPGA register access) without FPGA logic or ASIC redesign.
Dual SDIO 3.0 portsIndependent clocking and command/data paths allow concurrent SD card and eMMC operation-supports boot-from-eMMC while logging to SDXC in surveillance cameras.
Built-in RAID engineHardware-accelerated RAID0 striping and RAID1 mirroring across two memory ports-reduces CPU load and enables real-time redundancy in USB Disk-on-Module applications.
USB-attached storage (UAS) supportNative SCSI command set over USB 3.0-delivers up to 400 MB/s sustained throughput vs. ~30 MB/s with legacy MSC bulk-only transfers.
Multi-voltage I/O domainsIsolated 1.2-V core and scalable 1.8–3.3-V I/O rails permit direct interfacing with both ultra-low-power sensors and industrial-grade peripherals without level shifters.

Applications

Digital Video CamcordersIndustrial RAID Controllers

Use Scenario: Real-time 4K video streaming from CMOS sensor to host PC via USB 3.0 without frame drops.

IC Role / Device Role / Timing Role: USB controller bridges sensor GPIF II interface to host; handles UVC descriptor negotiation and isochronous endpoint scheduling.

Use Value: 5-Gbps bandwidth and deterministic GPIF II timing ensure zero-buffer-underrun streaming at 30 fps with H.264 encoding offloaded to host.

Use Scenario: Compact, fanless USB 3.0 RAID enclosure supporting dual 2TB NVMe SSDs in RAID1 mirror configuration.

IC Role / Device Role / Timing Role: Host-side USB controller managing SCSI commands, RAID metadata, and dual SDIO-linked NVMe translation layers.

Use Value: On-die RAID engine eliminates need for external RAID ASIC; UAS protocol enables near-NVMe latency over USB.

Medical Imaging DevicesSurveillance Camera Systems

Use Scenario: Portable ultrasound probe transmitting raw RF beamformed data to workstation for real-time reconstruction.

IC Role / Device Role / Timing Role: High-throughput peripheral controller with low-jitter GPIF II capturing burst-mode sensor data into SRAM before USB transmission.

Use Value: 100-MHz GPIF II clock and 512-KB buffer absorb sensor burst rates >200 MB/s, preventing data loss during acquisition windows.

Use Scenario: Multi-sensor IP camera recording encrypted video streams to local microSD and remote NAS simultaneously.

IC Role / Device Role / Timing Role: Dual SDIO port manager handling simultaneous SDXC write and eMMC boot/firmware update; USB host negotiates UAS for NAS upload.

Use Value: Independent SDIO clocks prevent write interference; UAS ensures encrypted stream upload sustains >80 MB/s over USB 3.0.

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 3.0 peripheral controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CYUSB3014-BZXISame FX3S architecture but with 256-KB SRAM and no built-in RAID engine; identical pinout and USB/GPIF/SDIO functionality.Limited to single-port SDIO and basic MSC/UAS-unsuitable for dual-card RAID or high-buffer video capture.Select when cost-sensitive designs require only basic USB 3.0 bridging and <256 KB firmware+buffer space.
CYUSB3025-BZXCFX3 variant (not FX3S); lacks SDIO 3.0 support, eMMC 4.41 compliance, and RAID hardware; retains same CPU, SRAM, and GPIF II.Cannot interface with UHS-I SD cards or eMMC; requires external SD controller for storage-adds BOM cost and PCB area.Select only if SDIO/RAID features are unnecessary and legacy FX3 software compatibility is required.

Compared with CYUSB3014-BZXI and CYUSB3025-BZXC, the CYUSB3035-BZXC uniquely delivers integrated RAID acceleration, dual SDIO 3.0 ports, and 512-KB SRAM-making it the sole option for compact, high-reliability USB storage modules and multi-sensor video systems needing concurrent high-speed I/O.

Availability

CYUSB3035-BZXC is available at Aetrix Electronics and suitable for digital video camcorders, industrial RAID controllers, and medical imaging devices requiring stable component supply, long-term lifecycle assurance, and full technical documentation support.

Supply support for CYUSB3035-BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and connectivity solutions, with global R&D and manufacturing infrastructure.

The EZ-USB™ FX3S product line targets high-performance USB 3.0 peripheral bridging-designed specifically for video, storage, and industrial I/O applications demanding deterministic timing, low-latency firmware control, and integrated protocol acceleration.

FAQ

What boot options does CYUSB3035-BZXC support?

CYUSB3035-BZXC supports four boot modes: from internal ROM (default), SPI flash, I²C EEPROM, or USB host download. Boot source selection is controlled by GPIO strap pins at reset; SPI flash boot enables field-upgradable firmware without host intervention, while I²C EEPROM allows small-parameter storage for configuration persistence.

Does CYUSB3035-BZXC require an external crystal?

Yes-CYUSB3035-BZXC requires a 19.2-MHz fundamental-mode crystal connected to XIN/XOUT pins for primary clock generation. The device also accepts 26-MHz, 38.4-MHz, or 52-MHz clock inputs via the CLKIN pin, but 19.2-MHz crystal operation is mandatory for USB 3.0 PHY PLL lock and USB 2.0 SOF timing accuracy.

Can GPIF II interface with MIPI CSI-2 sensors directly?

No-GPIF II cannot connect directly to MIPI CSI-2 because it lacks high-speed differential signaling and embedded clock recovery. However, it can interface with MIPI-to-parallel bridge ICs (e.g., TC358743) that convert CSI-2 lanes to 8-/16-bit parallel data synchronized to a pixel clock, which GPIF II then captures using its programmable state machine.

What is the maximum sustained data rate achievable via UAS mode?

In UAS mode with optimal host driver and endpoint configuration, CYUSB3035-BZXC achieves sustained throughput of 380–410 MB/s over USB 3.0-measured using CrystalDiskMark with 128-KB sequential writes to a dual-SDIO RAID1 array. This exceeds standard MSC bulk-only transfer limits by >10× due to SCSI command queuing and reduced protocol overhead.

CYUSB3035-BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
EZ-USB FX3S™
Package/Case:
121-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Applications:
USB Host/Peripheral Controller
Core Processor:
ARM9®
Program Memory Type:
External Program Memory
Controller Series:
CYUSB
RAM Size:
512K x 8
Interface:
GPIF, I2C, I2S, MMC/SD/SDIO, SPI, UART, USB
Number of I/O:
60
Voltage - Supply:
1.15V ~ 1.25V
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
121-FBGA (10x10)

CYUSB3035-BZXC FAQ

1.How can I place an order for CYUSB3035-BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYUSB3035-BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYUSB3035-BZXC reliable?

The price and inventory of CYUSB3035-BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3035-BZXC is usually 5 days.

3.What payment methods are accepted for CYUSB3035-BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3035-BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYUSB3035-BZXC?

CYUSB3035-BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYUSB3035-BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYUSB3035-BZXC?

For technical support, including CYUSB3035-BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3035-BZXC requirements.

6.How does Aetrix verify that CYUSB3035-BZXC is sourced from the original manufacturer or authorized distributors?

All CYUSB3035-BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3035-BZXC meets industry standards.

7.What is the process for return or replacement of CYUSB3035-BZXC?

All CYUSB3035-BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3035-BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYUSB3035-BZXC part is unused and in its original packaging.

Return procedure for CYUSB3035-BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYUSB3035-BZXC Tags

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