Infineon Technologies CYUSB3065-BZXI
- Part No.:
- CYUSB3065-BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 121-LFBGA
- Datasheet:
-
CYUSB3065-BZXI.pdf
- Description:
- IC ARM9 USB3 CONTROLLER 121FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:902
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYUSB3065-BZXI from Infineon is a MIPI CSI-2 to SuperSpeed USB 3.0 bridge controller featuring an ARM926EJ-S core (200 MHz), 512-KB embedded SRAM, 4-lane MIPI CSI-2 RX (1 Gbps/lane), and full USB 3.0/2.0 compliance. It enables high-bandwidth video streaming from image sensors to USB hosts in digital cameras, webcams, and industrial vision systems.
For engineers reviewing the CYUSB3065-BZXI datasheet, CYUSB3065-BZXI pinout, CYUSB3065-BZXI application, or CYUSB3065-BZXI equivalent, key selection criteria include MIPI lane count, USB 3.0 PHY compliance (PIPE 3.0), supported video formats (RAW12/YUV422/RGB888), SRAM size, and BGA package thermal performance.
Technical Context
The device implements a dedicated MIPI CSI-2 receiver with configurable D-PHY timing, supporting up to four data lanes and a reference clock input (REFCLK) for synchronization. Its USB 3.0 PHY complies with PIPE 3.0 and delivers 5-Gbps aggregate bandwidth with 32 physical endpoints.
The integrated ARM926EJ-S CPU executes firmware directly from on-chip 512-KB SRAM and manages real-time sensor configuration via CCI (I²C-compatible) and video pipeline control. Power domains are split: core at 1.2 V, I/Os at 1.8–3.3 V, enabling flexible interface voltage matching with sensors and peripherals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| USB Interface | USB 3.0 + USB 2.0 compliant; enables UVC-compliant video streaming to host without external USB controller logic |
| MIPI CSI-2 Lanes | 4-lane RX support; sustains up to 4 Gbps aggregate sensor data throughput (1 Gbps per lane) |
| CPU Core | ARM926EJ-S @ 200 MHz; runs custom firmware for sensor initialization, format conversion, and USB descriptor handling |
| On-chip Memory | 512-KB SRAM; holds boot code, video buffers, and application firmware-no external RAM required for basic UVC operation |
| Video Formats | RAW8/10/12/14, YUV422 (8/10-bit), RGB888/666/565, user-defined 8-bit; supports direct mapping to UVC payload structures |
| Package | 10 × 10 mm, 0.8-mm pitch Pb-free BGA (121-ball); optimized for thermal dissipation in compact camera modules |
| I/O Voltage Range | I²C/I²S/UART/SPI at 1.8–3.3 V; enables direct interfacing with common image sensors and audio codecs |
Pinout & Package
10 × 10 mm, 0.8-mm pitch Pb-free BGA package with 121 balls. Pin functions validated per Infineon datasheet 001-87516 Rev. *P (pages 25–41).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D0P / D0M | MIPI CSI-2 Data Lane 0 differential pair | Receives serialized pixel data from sensor; requires controlled 100-Ω differential impedance routing |
| REFCLK | MIPI reference clock input | Provides timing reference for D-PHY receiver; must be clean 25–100 MHz CMOS clock |
| SSTX+/SSTX− | USB 3.0 SuperSpeed transmit differential pair | Drives 5-Gbps USB 3.0 data to host; requires 90-Ω differential trace routing |
| SSRX+/SSRX− | USB 3.0 SuperSpeed receive differential pair | Receives USB 3.0 control and response traffic; shares same routing constraints as SSTX |
| I2C_SCL / I2C_SDA | CCI interface for sensor configuration | Configures image sensor registers (e.g., OV5640, AS0260) using standard I²C protocol |
| MCLK | Master clock output for audio peripherals | Generates programmable clock (e.g., 12.288 MHz for 48 kHz I²S) to drive external audio codecs |
Key Features
| Feature | Design Value |
|---|---|
| Integrated USB 3.0 PHY + Link Layer | Eliminates need for external USB transceiver; reduces BOM and PCB area in camera module designs |
| 4-lane MIPI CSI-2 RX with D-PHY v1.01 | Supports high-resolution sensors (e.g., 13MP@30fps) with low-latency, deterministic frame capture |
| ARM926EJ-S @ 200 MHz + 512 KB SRAM | Enables real-time firmware processing of metadata, auto-exposure, and UVC descriptor customization |
| Multi-peripheral connectivity (I²C/I²S/UART/SPI) | Allows co-integration of autofocus motors, microphones, LED flash controllers, and debug interfaces on single chip |
| Independent power domains (core @ 1.2 V, I/O @ 1.8–3.3 V) | Permits direct connection to diverse sensor and peripheral voltage rails without level shifters |
Applications
| Digital Still Cameras | Industrial Machine Vision |
|---|---|
Use Scenario: High-resolution still capture with live preview and metadata embedding (EXIF, GPS). IC Role / Device Role / Timing Role: Acts as primary image acquisition engine-receives RAW12 from CMOS sensor, applies ISP-lite preprocessing, and streams via UVC to PC. Use Value: Enables 20-MP JPEG capture at 5 fps over USB 3.0 with zero external memory, reducing system latency and component count. | Use Scenario: Real-time defect inspection on production lines using line-scan or area-scan sensors. IC Role / Device Role / Timing Role: Synchronizes multi-sensor triggers via GPIO and routes time-stamped image data to host for AI inference. Use Value: Delivers deterministic sub-millisecond frame-to-host latency and supports custom video descriptors for factory automation protocols. |
| USB Microscopes | Medical Endoscopy Systems |
Use Scenario: Portable handheld microscope with integrated LED illumination and focus control. IC Role / Device Role / Timing Role: Bridges MIPI output from 5MP medical-grade sensor to USB host while managing I²C-based LED dimming and motorized focus. Use Value: Integrates sensor interface, lighting control, and USB streaming in one BGA package-reducing board space by >40% vs. discrete solutions. | Use Scenario: Sterile-field endoscopic imaging with HD video, audio commentary, and real-time annotation. IC Role / Device Role / Timing Role: Simultaneously processes video (YUV422), audio (I²S), and control commands (UART) into synchronized UVC+UAC composite device. Use Value: Supports dual-stream UVC/UAC class compliance without external microcontroller-critical for FDA-cleared Class II devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar MIPI-to-USB bridge applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYUSB3064-BZXI | 2-lane MIPI CSI-2 RX; 256-KB SRAM; identical USB 3.0 PHY and CPU | Targeted at lower-resolution sensors (≤5MP) and cost-sensitive webcams | Select when sensor bandwidth ≤2 Gbps and SRAM footprint <512 KB suffices |
| USB3380-EZK | No MIPI interface; USB 3.0 hub + PHY only; requires external FPGA or MCU for sensor bridging | Used in legacy designs where MIPI interface is implemented externally | Choose only if existing design already includes FPGA-based MIPI processing and only USB PHY extension is needed |
Compared with CYUSB3064-BZXI, CYUSB3065-BZXI provides double MIPI bandwidth and double SRAM-essential for 4K/30fps or multi-sensor fusion. Versus USB3380-EZK, it integrates full sensor-to-USB functionality, eliminating FPGA dependency and reducing total BOM cost by ~35%.
Availability
CYUSB3065-BZXI is available at Aetrix Electronics and suitable for digital still cameras, industrial machine vision systems, and medical endoscopy requiring stable component supply across long-life production cycles.
Supply support for CYUSB3065-BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and connectivity solutions for automotive, industrial, and consumer markets.
CYUSB3065-BZXI belongs to the EZ-USB™ CX3 product line, engineered specifically to eliminate FPGA or dual-chip complexity in MIPI CSI-2 image sensor to USB 3.0 video streaming applications.
FAQ
Does CYUSB3065-BZXI require external memory to operate as a UVC device?
No. The device contains 512-KB on-chip SRAM sufficient to store boot firmware, video line buffers, and UVC descriptors. External memory is optional only for extended frame buffering or advanced ISP algorithms beyond baseline UVC functionality.
What MIPI CSI-2 sensor configurations are supported out-of-the-box?
The FX3 SDK includes pre-validated firmware for OmniVision OV5640 (2MP) and Aptina AS0260 (1.3MP) sensors. Configuration for other sensors requires use of the CX3 MIPI Configuration Tool plugin to generate timing-accurate D-PHY parameters and register initialization sequences.
Can CYUSB3065-BZXI support simultaneous video and audio streaming?
Yes. It supports concurrent UVC (video) and UAC (audio) class operation via its I²S master interface (up to 192 kHz sampling) and UART/I²C for microphone or codec control-enabling composite USB devices like video IP phones and telemedicine units.
Is the 10 × 10 mm BGA package compatible with standard reflow profiles?
Yes. The Pb-free 121-ball BGA uses JEDEC J-STD-020-compliant moisture sensitivity level (MSL) 3 packaging and is qualified for standard lead-free reflow profiles (peak 260°C). Board layout must observe 0.8-mm ball pitch spacing and thermal pad grounding per Infineon's hardware design guidelines.
CYUSB3065-BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- EZ-USB CX3
- Package/Case:
- 121-LFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- USB Host/Peripheral Controller
- Core Processor:
- ARM9®
- Program Memory Type:
- External Program Memory
- Controller Series:
- CYUSB
- RAM Size:
- 512K x 8
- Interface:
- GPIF, I2C, I2S, SPI, UART, USB
- Number of I/O:
- 12
- Voltage - Supply:
- 1.15V ~ 1.25V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 121-BGA (10x10)
CYUSB3065-BZXI FAQ
1.How can I place an order for CYUSB3065-BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CYUSB3065-BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYUSB3065-BZXI reliable?
The price and inventory of CYUSB3065-BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3065-BZXI is usually 5 days.
3.What payment methods are accepted for CYUSB3065-BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3065-BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYUSB3065-BZXI?
CYUSB3065-BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYUSB3065-BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYUSB3065-BZXI?
For technical support, including CYUSB3065-BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3065-BZXI requirements.
6.How does Aetrix verify that CYUSB3065-BZXI is sourced from the original manufacturer or authorized distributors?
All CYUSB3065-BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3065-BZXI meets industry standards.
7.What is the process for return or replacement of CYUSB3065-BZXI?
All CYUSB3065-BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3065-BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYUSB3065-BZXI part is unused and in its original packaging.
Return procedure for CYUSB3065-BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYUSB3065-BZXI Tags

-
CYPD3175-24LQXQ
Infineon Technologies

-
SLB9672VU20FW1523XTMA1
Infineon Technologies

-
SLB9670VQ20FW785XTMA1
Infineon Technologies

-
SLB9672XU20FW1523XTMA1
Infineon Technologies

-
SLB9673XU20FW2613XTMA1
Infineon Technologies

-
CYPD3125-40LQXIT
Infineon Technologies

-
AT97SC3204-U2A1A-20
Microchip Technology

-
AT97SC3204-U2A1A-10
Microchip Technology

-
SLM9670AQ20FW1311XTMA1
Infineon Technologies

-
SLB9672XU20FW1613XTMA1
Infineon Technologies

-
SLB9672AU20FW1613XTMA1
Infineon Technologies

-
SLB9673AU20FW2613XTMA1
Infineon Technologies
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

