Infineon Technologies CYUSB3304-68LTXC
- Part No.:
- CYUSB3304-68LTXC
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CYUSB3304-68LTXC.pdf
- Description:
- IC USB 3.0 HUB 4-PORT 68QFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,029
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYUSB3304-68LTXC from Infineon is a USB 3.2 Gen 1 (5 Gbps) hub controller with four downstream ports, integrated ARM® Cortex®-M0 CPU (16 KB RAM, 32 KB ROM), USB Battery Charging v1.2 compliance, and shared-link capability for embedded systems. It supports SS/HS/FS/LS signaling, multi-TT USB 2.0 transaction translators, and industrial temperature range (–40°C to +85°C).
For engineers reviewing the CYUSB3304-68LTXC datasheet, CYUSB3304-68LTXC pinout, CYUSB3304-68LTXC application, or CYUSB3304-68LTXC equivalent, key selection criteria include USB 3.2 Gen 1 hub topology support, BC v1.2 charging implementation per port, shared-link configuration flexibility, and I2C-based firmware upgrade capability.
Technical Context
The device integrates dual independent hub controllers: an SS hub supporting U0–U3 link power states and full-duplex 5 Gbps operation, and a USB 2.0 hub with four dedicated transaction translators and L0–L3 power management. The on-chip Cortex-M0 executes runtime configuration, battery charging control, and vendor-command processing.
It implements hardware-assisted port control including overcurrent detection, ganged/individual power switching, VBUS sensing, and LED status signaling per DS port. Configuration is supported via pin-straps (e.g., VID/PID, port count, charging enable), I2C EEPROM, or eFuse - enabling BOM reduction without external configuration ICs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| USB Speed Support | 5 Gbps SuperSpeed, 480 Mbps High-Speed, 12 Mbps Full-Speed, 1.5 Mbps Low-Speed on all ports |
| Downstream Ports | 4 × USB 3.2 Gen 1-compliant DS ports with individual Multi-TT USB 2.0 transaction translators |
| Battery Charging | Complies with USB BC v1.2; enables ghost charging (DCP emulation) and ACA-Dock mode on all DS ports |
| Embedded CPU | ARM Cortex-M0 core with 16 KB RAM and 32 KB ROM for GPIO control, descriptor handling, and firmware updates |
| Configuration Interface | I2C slave/master/multi-master support; enables EEPROM programming, external ASSP firmware upgrade, and shared I2C bus access |
| Operating Temp | Industrial grade: –40°C to +85°C ambient, validated for continuous operation in embedded docking and monitor applications |
| Package | 68-pin QFN (8 mm × 8 mm × 1.0 mm), lead-free and RoHS-compliant |
Pinout & Package
68-pin QFN package (8 mm × 8 mm × 1.0 mm body, 0.4 mm pitch), exposed thermal pad, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_3P3 | 3.3 V Power Supply | Primary digital I/O supply; requires local 3.3 V regulation and decoupling |
| VDD_1P2 | 1.2 V Core Power | Dedicated core voltage for SS PHY and Cortex-M0 subsystem |
| US_DP / US_DM | Upstream Differential Pair | Connects to host controller; supports SS, HS, FS, LS signaling with integrated termination |
| DS1_DP / DS1_DM … DS4_DP / DS4_DM | Downstream Differential Pairs | Four independent USB 3.2 Gen 1 ports; each includes separate SS and USB 2.0 PHY paths |
| I2C_SDA / I2C_SCL | I2C Interface | Configurable as master or slave; used for EEPROM programming, external ASSP firmware update, and runtime parameter tuning |
| GPIO[0:7] | General-Purpose I/O | Programmable for overcurrent detection input, power switch control, LED drive, or custom system signaling |
| RESET_N | Active-Low Reset | Synchronous reset input; initiates full hardware initialization and configuration reload |
Key Features
| Feature | Design Value |
|---|---|
| Shared Link Mode | Enables simultaneous connection of one SS device and one USB 2.0 device per DS port-doubling effective device count in embedded designs without extra hubs |
| Ghost Charging | Each DS port emulates a Dedicated Charging Port (DCP) when upstream host is disconnected-enabling battery top-up for peripherals without host presence |
| USB-to-I2C Bridge | Vendor-command support allows EZ-USB™ HX3 to act as a transparent bridge between USB host and external I2C devices (e.g., sensors, EEPROMs, PMICs) |
| Pin-Strap Configuration | Hardware-selectable VID/PID, port count, charging enable, and power switch polarity-eliminates need for external configuration EEPROM in cost-sensitive designs |
| WHQL Certification | Microsoft Windows Hardware Quality Lab certified for XP through Windows 10/11, reducing driver validation effort for OEM OS integration |
Applications
| Standalone USB Hub | Docking Station |
|---|---|
Use Scenario: Desktop peripheral expansion with four high-bandwidth USB devices (SS SSD, HD webcam, audio interface, and external GPU enclosure). IC Role / Device Role / Timing Role: Central USB 3.2 Gen 1 hub controller managing protocol translation, power delivery negotiation, and link state coordination across all ports. Use Value: Delivers full 5 Gbps bandwidth per port with minimal latency; eliminates USB 2.0 bottlenecks in multi-peripheral setups. | Use Scenario: Laptop docking station supporting simultaneous video (DisplayPort Alt Mode), data (SS storage), and charging (BC v1.2) over single USB-C upstream connection. IC Role / Device Role / Timing Role: Downstream hub controller providing independent power switching, BC v1.2 DCP emulation, and ACA-Dock compatibility for smartphone-as-host use cases. Use Value: Enables concurrent charging and data transfer from mobile host while maintaining full USB 3.2 Gen 1 throughput to peripherals. |
| Monitor with USB Hub | Industrial Embedded System |
Use Scenario: Smart monitor with built-in USB hub for keyboard, mouse, webcam, and headset-powered and controlled via single upstream USB-C cable. IC Role / Device Role / Timing Role: Integrated hub managing VBUS routing, port enumeration, suspend/resume signaling, and LED status indication per port. Use Value: Reduces external component count via integrated termination, pull-ups, and configurable GPIOs-lowering BOM and PCB layer count. | Use Scenario: Medical imaging device requiring reliable connection of multiple USB peripherals (SS camera, FS sensor array, LS control panel) in fanless, thermally constrained enclosure. IC Role / Device Role / Timing Role: Industrial-grade hub controller operating at –40°C to +85°C with shared-link mode enabling co-location of SS and USB 2.0 devices on same physical port. Use Value: Eliminates need for secondary hub ICs; simplifies thermal design by consolidating USB connectivity into single 68-QFN package. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB 3.2 Gen 1 hub controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYUSB3314-88LTXC | 88-pin QFN package; adds pin-strap configuration support and port indicators; same 4-port SS/USB 2.0 architecture | Preferred where board layout requires larger pitch or additional GPIOs for LED status feedback | Select when pin-strap configurability and visual port status are required; not drop-in compatible due to different footprint and pin count |
| UPD720210K8-711-BAC-A | Renesas USB 3.0 hub; no integrated Cortex-M0 CPU; no ghost charging or shared-link features; requires external EEPROM for configuration | Suitable for cost-sensitive PC peripheral hubs where advanced charging and embedded features are unnecessary | Choose only if basic USB 3.0 hub functionality suffices and firmware extensibility is not required |
Compared with CYUSB3304-68LTXC, CYUSB3314-88LTXC offers enhanced configurability and diagnostics at the cost of larger footprint, while UPD720210 provides simpler, lower-cost hub operation without embedded intelligence or BC v1.2 enhancements.
Availability
CYUSB3304-68LTXC is available at Aetrix Electronics and suitable for standalone USB hubs, docking stations, and industrial embedded systems requiring stable component supply, industrial temperature operation, and USB 3.2 Gen 1 bandwidth with BC v1.2 charging.
Supply support for CYUSB3304-68LTXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, security ICs, and connectivity solutions, with global manufacturing and quality certification to ISO 9001 and IATF 16949.
CYUSB3304 belongs to Infineon's EZ-USB™ HX3 family-designed specifically for high-integration USB hub applications in docking stations, monitors, and embedded systems requiring USB 3.2 Gen 1 performance, intelligent charging, and firmware-upgradable configuration.
FAQ
Does CYUSB3304-68LTXC support USB 3.2 Gen 2 (10 Gbps)?
No. CYUSB3304-68LTXC is compliant with USB 3.2 Gen 1 (5 Gbps) and fully backward-compatible with USB 2.0 (480 Mbps), USB 1.1 (12 Mbps), and USB 1.0 (1.5 Mbps). It does not implement the 10 Gbps lane bonding or new encoding scheme required for Gen 2.
Can the integrated Cortex-M0 be used for custom application code?
No. The ARM Cortex-M0 is reserved for Infineon's proprietary firmware controlling hub operation, charging logic, and configuration management. It is not user-programmable; external microcontrollers must handle application-level tasks.
What is the maximum total power consumption under full 5 Gbps load?
At 3.3 V and 1.2 V supplies, typical active power consumption is 520 mW (160 mW for SS PHY, 120 mW for USB 2.0 PHY, 240 mW for logic/CPU), per datasheet Section 10.2. Peak current draw remains within 68-QFN thermal limits at +85°C ambient.
Is CYUSB3304-68LTXC USB-IF certified?
Yes. It carries USB-IF Certification ID TID# 330000060 and TID# 30000074, confirming compliance with USB 3.0 specification revision 1.0 and interoperability testing across host and device ecosystems.
CYUSB3304-68LTXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HX3
- Package/Case:
- 68-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- USB 3.0 Hub Controller
- Core Processor:
- ARM® Cortex®-M0
- Program Memory Type:
- ROM (32kB)
- Controller Series:
- CYUSB
- RAM Size:
- 16K x 8
- Interface:
- I2C
- Number of I/O:
- 10
- Voltage - Supply:
- 1.14V ~ 1.26V, 2.5V ~ 2.7V, 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 68-QFN (8x8)
CYUSB3304-68LTXC FAQ
1.How can I place an order for CYUSB3304-68LTXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CYUSB3304-68LTXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYUSB3304-68LTXC reliable?
The price and inventory of CYUSB3304-68LTXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYUSB3304-68LTXC is usually 5 days.
3.What payment methods are accepted for CYUSB3304-68LTXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYUSB3304-68LTXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYUSB3304-68LTXC?
CYUSB3304-68LTXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYUSB3304-68LTXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYUSB3304-68LTXC?
For technical support, including CYUSB3304-68LTXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYUSB3304-68LTXC requirements.
6.How does Aetrix verify that CYUSB3304-68LTXC is sourced from the original manufacturer or authorized distributors?
All CYUSB3304-68LTXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYUSB3304-68LTXC meets industry standards.
7.What is the process for return or replacement of CYUSB3304-68LTXC?
All CYUSB3304-68LTXC units undergo pre-shipment inspection (PSI). If there is an issue with CYUSB3304-68LTXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYUSB3304-68LTXC part is unused and in its original packaging.
Return procedure for CYUSB3304-68LTXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYUSB3304-68LTXC Tags

-
CYPD3175-24LQXQ
Infineon Technologies

-
SLB9672VU20FW1523XTMA1
Infineon Technologies

-
SLB9670VQ20FW785XTMA1
Infineon Technologies

-
SLB9672XU20FW1523XTMA1
Infineon Technologies

-
SLB9673XU20FW2613XTMA1
Infineon Technologies

-
CYPD3125-40LQXIT
Infineon Technologies

-
AT97SC3204-U2A1A-20
Microchip Technology

-
AT97SC3204-U2A1A-10
Microchip Technology

-
SLM9670AQ20FW1311XTMA1
Infineon Technologies

-
SLB9672XU20FW1613XTMA1
Infineon Technologies

-
SLB9672AU20FW1613XTMA1
Infineon Technologies

-
SLB9673AU20FW2613XTMA1
Infineon Technologies
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

