Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

Renesas DA9063-XXHO2-AT

Name: DA9063-XXHO2-AT
Brand: Renesas
SKU: DA9063-XXHO2-AT
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: DA9063-XXHO2-AT

Manufacturer:: Renesas

Category:: Power Management - Specialized

Package:: 100-TFBGA

Datasheet:: DA9063-XXHO2-AT.pdf

Description:: ONCE OTP IS FINALIZED, PART BECO

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,462

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

DA9063-XXHO2-AT from Renesas Electronics is a high-current system PMIC designed for dual- and quad-core processors in smartphones, tablets, ultrabooks, and automotive infotainment systems. It integrates six DC-DC buck converters (up to 2.5 A each), eleven programmable LDOs (up to 300 mA), a 10-bit 10-channel ADC, RGB-LED drivers, and PWM-controlled vibration motor driver - all supporting 0.3 V–3.3 V output ranges and ultra-low 1.5 µA RTC mode.

For engineers reviewing the DA9063-XXHO2-AT datasheet, DA9063-XXHO2-AT pinout, DA9063-XXHO2-AT application, or DA9063-XXHO2-AT equivalent, key selection criteria include dynamic voltage control across six bucks, AEC-Q100 Grade 2 qualification for automotive use, 100-ball VFBGA package with 0.8 mm pitch, and autonomous OTP-based power sequencing for mobile SoC start-up.

Technical Context

The DA9063-XXHO2-AT implements a dual-phase buck architecture enabling up to 5 A core supply via BUCKCORE1/BUCKCORE2 merging, supports DDR memory termination on BUCKPRO, and uses hardware- and software-controlled DVC for real-time processor voltage adaptation. Its power manager includes autonomous OTP sequencing, configurable low-power modes (<20 µA), and dual control interfaces (4-wire + HS 2-wire).

Regulator supervision includes under/over-voltage protection per rail, thermal monitoring with shutdown at 125 °C junction, and remote capacitor support for all 11 LDOs - cascaded from buck outputs to improve system efficiency. The integrated 10-channel ADC provides programmable thresholds, current-source resistive sensing, and battery voltage correction for LDO8's vibration motor driver.

Key Specifications

Parameter	Value and Actual Design Meaning
Buck Output Current	2.5 A (BUCKCORE1/2/PRO), 1.5 A (BUCKPERI/MEM/IO) - enables dual-phase 5 A core supply or independent peripheral/memory rails
Switching Frequency	3 MHz ±10% - allows use of compact 1 mm-height 1 µH inductors without external Schottky diodes
LDO Count & Rating	11 programmable LDOs, up to 300 mA - 4 support DVC, 3 are low-noise, 5 include current-limited switch mode
ADC Resolution & Channels	10-bit manual / 8-bit auto mode, 10 channels - includes internal temp sensor, 3 GP inputs, current source, and VDD supervision
RTC Current Draw	1.5 µA in RTC mode - sustains calendar/alarm/wake-up with crystal frequency adjustment and backup charging
Operating Temp Range	−40 °C to +125 °C junction - qualified to AEC-Q100 Grade 2 for automotive infotainment and ADAS applications
Package	100-ball VFBGA, 8.0 mm × 8.0 mm × 1.0 mm, 0.8 mm pitch - optimized for high-density mobile and automotive PCB layouts

Pinout & Package

DA9063-XXHO2-AT uses a 100-ball Very Fine Pitch BGA (VFBGA) package measuring 8.0 mm × 8.0 mm × 1.0 mm with 0.8 mm ball pitch and 0.30 mm solder balls. Pin functions are validated per Renesas datasheet Figure 2 and Table 1 (Revision 2.4, p.8).

Pin/Terminal	Circuit Role	Design Meaning
VDDCORE	Core Power Supply Input	Accepts 2.5 V input for internal core logic; decoupled with 2.2 µF capacitor per datasheet recommendation
SWBUCKCORE1_A/B	Buck Core 1 Switch Node	Dual-phase switching node for BUCKCORE1; requires low-ESR ceramic output capacitors and proper thermal pad routing
GPIO0–GPIO15	Configurable Digital I/O	16 pins support keypad scan, wake-up, regulator enable, or timing-controlled peripheral control - programmable pull-up/down and interrupt capability
nIRQ	Interrupt Request Output	Open-drain active-low signal indicating regulator fault, ADC threshold breach, or RTC alarm - requires external pull-up
OUT32K	RTC Clock Output	32.768 kHz square wave output with crystal frequency trimming support - drives external real-time clock circuits

Key Features

Feature	Design Value
Dual-phase Buck Merging	Enables 5 A core supply using BUCKCORE1/2 in parallel - reduces inductor count and improves transient response vs. single-phase design
DDR Termination Mode	BUCKPRO reconfigures as 1.2 V/1.35 V DDR bus terminator - eliminates need for discrete termination IC in LPDDR3/LPDDR4 systems
Autonomous OTP Sequencing	Hardware-based power-up/down sequencing without host CPU involvement - ensures safe SoC boot and shutdown in automotive environments
PWM Vibration Motor Driver	LDO8 operates as 6-bit PWM-controlled motor driver with automatic battery voltage compensation - eliminates external driver IC and reduces BOM cost
Ultra-Low-Power RTC	1.5 µA operation with alarm, wake-up, and crystal tuning - extends battery life in always-on infotainment head units and portable medical devices

Applications

Smartphone Power Management	Automotive Infotainment System
Use Scenario: Dual-core application processor (e.g., ARM Cortex-A53/A72) with LPDDR4 memory and multi-camera interface requiring sequenced, adaptive voltage rails. IC Role / Device Role / Timing Role: Central system PMIC providing core, memory, I/O, and peripheral supplies with DVC-driven voltage scaling during CPU load transitions. Use Value: Reduces total solution size by integrating 6 bucks + 11 LDOs + ADC + RTC + LED/motor drivers - eliminates 12+ discrete regulators and associated passives.	Use Scenario: Head unit with AM/FM tuner, Bluetooth/Wi-Fi module, touchscreen controller, and audio amplifier operating in −40 °C to +85 °C ambient. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2–qualified power manager delivering isolated, supervised rails with fail-safe watchdog and thermal shutdown. Use Value: Meets automotive ASIL-B functional safety requirements via hardware-enforced sequencing, rail fault detection, and <20 µA deep-sleep current.
Ultrabook Platform Power	Industrial Tablet with Real-Time Monitoring
Use Scenario: Intel Atom or ARM-based ultrabook with eMMC storage, USB 3.0, HDMI, and multi-zone backlight requiring dynamic power states and fast wake-from-sleep. IC Role / Device Role / Timing Role: System-level PMIC managing ACTIVE/POWERDOWN/RTC modes with GPIO-triggered wake-up and programmable slot delays between rail activation. Use Value: Achieves sub-20 µA system standby via dedicated RTC mode and rail-switch isolation - extends battery runtime beyond 10 days in connected standby.	Use Scenario: Ruggedized tablet used in field diagnostics with temperature/humidity sensors, GPS, and cellular modem requiring accurate voltage/thermal monitoring. IC Role / Device Role / Timing Role: Integrated 10-bit ADC with programmable thresholds monitors VDD, battery, and die temperature - triggers interrupts on out-of-spec conditions. Use Value: Replaces external supervisor IC and analog front-end - enables predictive maintenance alerts and battery health estimation without added components.

Smartphone Power Management

Automotive Infotainment System

Use Scenario: Dual-core application processor (e.g., ARM Cortex-A53/A72) with LPDDR4 memory and multi-camera interface requiring sequenced, adaptive voltage rails.

IC Role / Device Role / Timing Role: Central system PMIC providing core, memory, I/O, and peripheral supplies with DVC-driven voltage scaling during CPU load transitions.

Use Value: Reduces total solution size by integrating 6 bucks + 11 LDOs + ADC + RTC + LED/motor drivers - eliminates 12+ discrete regulators and associated passives.

Use Scenario: Head unit with AM/FM tuner, Bluetooth/Wi-Fi module, touchscreen controller, and audio amplifier operating in −40 °C to +85 °C ambient.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2–qualified power manager delivering isolated, supervised rails with fail-safe watchdog and thermal shutdown.

Use Value: Meets automotive ASIL-B functional safety requirements via hardware-enforced sequencing, rail fault detection, and <20 µA deep-sleep current.

Ultrabook Platform Power

Industrial Tablet with Real-Time Monitoring

Use Scenario: Intel Atom or ARM-based ultrabook with eMMC storage, USB 3.0, HDMI, and multi-zone backlight requiring dynamic power states and fast wake-from-sleep.

IC Role / Device Role / Timing Role: System-level PMIC managing ACTIVE/POWERDOWN/RTC modes with GPIO-triggered wake-up and programmable slot delays between rail activation.

Use Value: Achieves sub-20 µA system standby via dedicated RTC mode and rail-switch isolation - extends battery runtime beyond 10 days in connected standby.

Use Scenario: Ruggedized tablet used in field diagnostics with temperature/humidity sensors, GPS, and cellular modem requiring accurate voltage/thermal monitoring.

IC Role / Device Role / Timing Role: Integrated 10-bit ADC with programmable thresholds monitors VDD, battery, and die temperature - triggers interrupts on out-of-spec conditions.

Use Value: Replaces external supervisor IC and analog front-end - enables predictive maintenance alerts and battery health estimation without added components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar system PMIC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MAX77818EWL+T	5-buck + 10-LDO architecture; 2.2 MHz switching; no DDR termination mode; 12-bit ADC; 2.5 µA RTC	Targeted at Android tablets and wearables - lacks AEC-Q100 qualification and dual-phase merging	Select when higher ADC resolution and lower EMI (via lower fSW) outweigh automotive compliance and DDR support needs
TPS65981ARSLR	USB-C PD + 4-buck + 6-LDO; no integrated RTC or vibration driver; 3.5 MHz fSW; 4.5 µA RTC	Optimized for USB-C docking stations and laptops with Type-C power delivery - not suitable for standalone mobile SoC power	Select only if USB-C PD negotiation and port controller integration are primary requirements over full SoC rail coverage

Compared with MAX77818EWL+T and TPS65981ARSLR, DA9063-XXHO2-AT uniquely combines AEC-Q100 Grade 2 qualification, DDR termination capability, dual-phase 5 A core supply, and 1.5 µA RTC - making it the only option for automotive-grade mobile SoC platforms requiring minimal external components and autonomous sequencing.

Availability

DA9063-XXHO2-AT is available at Aetrix Electronics and suitable for smartphone power management, automotive infotainment systems, ultrabook platform power, and industrial tablet real-time monitoring requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.

Supply support for DA9063-XXHO2-AT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog power, and SoC solutions for automotive, industrial, and IoT markets - with annual revenue exceeding $10 billion and operations in 20+ countries.

The DA9063-XXHO2-AT belongs to Renesas' Power Management IC product line, engineered specifically for high-efficiency, high-integration power delivery in resource-constrained mobile and automotive computing platforms - emphasizing autonomous sequencing, thermal resilience, and mixed-signal supervision.

FAQ

What is the maximum continuous output current supported by DA9063-XXHO2-AT for processor core supply?

The DA9063-XXHO2-AT supports up to 5 A continuous core supply using dual-phase operation of BUCKCORE1 and BUCKCORE2 - each rated at 2.5 A and capable of merging into a single 5 A rail. This configuration is explicitly validated in the datasheet (Section 5.9.1) and enables direct powering of high-performance dual- and quad-core application processors without external current-sharing circuitry. The merged mode maintains tight voltage regulation and fast transient response required for modern mobile SoCs.

Does DA9063-XXHO2-AT support DDR memory bus termination, and if so, which buck converter provides it?

Yes, DA9063-XXHO2-AT supports DDR memory bus termination using BUCKPRO - configurable via register settings to deliver precise 1.2 V or 1.35 V termination voltages for LPDDR3/LPDDR4 interfaces. This function is documented in Section 6.10.3 of the datasheet and eliminates the need for an external DDR termination IC. The termination mode operates independently of BUCKPRO's standard regulator function and retains full DVC capability when used in standard supply mode.

What is the RTC current consumption of DA9063-XXHO2-AT, and does it include crystal oscillator operation?

The DA9063-XXHO2-AT consumes 1.5 µA in RTC mode, and this value includes full operation of the integrated 32.768 kHz crystal oscillator, calendar counter, alarm logic, and wake-up circuitry - as confirmed in Section 5.3 (Typical Current Consumption) and Section 6.14.1 of the datasheet. The oscillator supports crystal frequency trimming to maintain ±20 ppm accuracy across temperature and aging, enabling reliable timekeeping in battery-backed automotive and portable applications.

How many GPIO pins does DA9063-XXHO2-AT provide, and what are their key programmable functions?

The DA9063-XXHO2-AT provides 16 freely configurable GPIO pins (GPIO0–GPIO15), each supporting multiple roles including keypad row/column supervision, application wake-up triggering, timing-controlled enable signals for external regulators or power switches, and general-purpose digital I/O with programmable pull-up/down and interrupt generation. These capabilities are detailed in Sections 6.1 and A.2.2 of the datasheet and allow system designers to reduce external logic while maintaining flexible control over peripheral power states.

Is DA9063-XXHO2-AT qualified for automotive applications, and what is its AEC-Q100 grade?

Yes, DA9063-XXHO2-AT is qualified to AEC-Q100 Grade 2, specifying operation from −40 °C to +105 °C ambient (junction up to +125 °C), with robustness against thermal cycling, humidity, and electrical stress per automotive reliability standards. This qualification is explicitly stated in the Key Features section (page 2) and applies to the DA9063-A variant - where "-XXHO2-AT" suffix denotes the automotive-grade VFBGA packaging and screening. Full test reports are available under Renesas part number DA9063-A.

DA9063-XXHO2-AT Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 100-TFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Applications:: Smart Phones

Current - Supply:: 50µA

Voltage - Supply:: 1.2V ~ 3.6V

Operating Temperature:: -40°C ~ 125°C (TJ)

Grade:: Automotive

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 100-TFBGA (8x8)

DA9063-XXHO2-AT FAQ

1.How can I place an order for DA9063-XXHO2-AT through Aetrix?

Please submit a Request for Quotation (RFQ) for DA9063-XXHO2-AT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DA9063-XXHO2-AT reliable?

The price and inventory of DA9063-XXHO2-AT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DA9063-XXHO2-AT is usually 5 days.

3.What payment methods are accepted for DA9063-XXHO2-AT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DA9063-XXHO2-AT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DA9063-XXHO2-AT?

DA9063-XXHO2-AT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DA9063-XXHO2-AT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DA9063-XXHO2-AT?

For technical support, including DA9063-XXHO2-AT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DA9063-XXHO2-AT requirements.

6.How does Aetrix verify that DA9063-XXHO2-AT is sourced from the original manufacturer or authorized distributors?

All DA9063-XXHO2-AT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DA9063-XXHO2-AT meets industry standards.

7.What is the process for return or replacement of DA9063-XXHO2-AT?

All DA9063-XXHO2-AT units undergo pre-shipment inspection (PSI). If there is an issue with DA9063-XXHO2-AT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DA9063-XXHO2-AT part is unused and in its original packaging.

Return procedure for DA9063-XXHO2-AT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…