Taiwan Semiconductor Corporation DBLS101G

Overview

DBLS101G from Taiwan Semiconductor is a 1A, 50V standard quad bridge rectifier in DBLS surface-mount package, featuring 1.1V max forward voltage at 1A, 2µA max reverse current at 25°C, and 40°C/W junction-to-ambient thermal resistance. It is widely used in compact AC/DC adapters and low-power SMPS designs.

For engineers reviewing the DBLS101G datasheet, DBLS101G pinout, DBLS101G application, or DBLS101G equivalent, key selection criteria include repetitive peak reverse voltage (50V), surge capability (40A @ 8.3ms), AEC-Q101 qualification availability, RoHS/halogen-free compliance, and tape-and-reel packaging for automated assembly.

Technical Context

The DBLS101G integrates four silicon diodes in a single-phase full-wave bridge configuration with common-cathode/common-anode topology. Its DBLS package enables high-density PCB layout while maintaining 15°C/W junction-to-lead thermal resistance and UL 94V-0 flammability rating.

Designed for operation across –55°C to +150°C junction temperature range, it delivers stable performance under pulsed forward current (0.3ms PW) and reverse bias (30ms PW), with junction capacitance of 25pF per diode at 1MHz and 4V reverse bias.

Key Specifications

Pinout & Package

DBLS101G uses the DBLS surface-mount molded plastic package (UL 94V-0), measuring 7.1 × 5.2 × 2.3 mm, with matte tin-plated gull-wing leads compliant with J-STD-002 solderability and JESD201 Class 2 whisker resistance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU4A and MB1S, the DBLS101G uniquely balances 1A continuous current, SMD DBLS footprint, 40°C/W thermal resistance, and AEC-Q101 qualification path-making it optimal for modern compact, thermally constrained, and automotive-adjacent AC/DC designs.

Availability

DBLS101G is available at Aetrix Electronics and suitable for AC/DC adapters, LED lighting drivers, and industrial SMPS requiring stable component supply, RoHS/halogen-free compliance, and tape-and-reel delivery for high-volume SMT production.

Supply support for DBLS101G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.

The DBLS101G belongs to TSC's standard bridge rectifier product line, engineered for cost-sensitive, high-reliability AC/DC front-end applications where compact SMD packaging, thermal efficiency, and regulatory compliance are critical.

FAQ

What is the maximum junction temperature rating for DBLS101G?

The DBLS101G has a maximum junction temperature (TJ MAX) of +150°C, enabling reliable operation in enclosed or high-ambient environments such as sealed LED drivers or industrial control modules. This rating is validated across its full operating range from –55°C to +150°C and supports derating curves published in the DBLS101G datasheet for sustained 1A load conditions.

Does DBLS101G have AEC-Q101 qualification?

The DBLS101G itself is not AEC-Q101 qualified, but its variant DBLS101GH is explicitly qualified per AEC-Q101. The "H" suffix denotes automotive-grade testing including HTOL, TC, and UHAST. For automotive interior or under-hood auxiliary power applications, DBLS101GH must be specified; DBLS101G remains suitable for industrial and consumer use cases.

What is the forward voltage drop of DBLS101G at full rated current?

The DBLS101G exhibits a maximum forward voltage (VF) of 1.1 V per diode at IF = 1 A and TJ = 25°C, resulting in a total bridge conduction drop of ≤2.2 V under full-load DC conditions. This value is measured using a 0.3 ms pulse test and remains stable across the device's operational temperature range, directly impacting system efficiency and thermal design.

How does the DBLS101G package compare to traditional bridge rectifiers like KBP201?

The DBLS101G uses a compact surface-mount DBLS package (7.1 × 5.2 × 2.3 mm), whereas KBP201 uses a through-hole KBP package (13.5 × 11.2 × 5.5 mm). The DBLS101G saves >65% board area, eliminates through-hole drilling, and offers lower thermal resistance (40°C/W vs. ~60°C/W), making it ideal for modern high-density SMT manufacturing and thermally constrained designs.

What is the reverse leakage current specification for DBLS101G at elevated temperature?

At TJ = 125°C, the DBLS101G specifies a maximum reverse current (IR) of 100 µA per diode under rated VR, significantly higher than its 2 µA max at 25°C. This temperature-dependent leakage must be accounted for in high-temperature applications such as enclosed LED drivers or industrial power supplies operating near thermal limits.