Infineon Technologies DD230S24KHPSA1

Overview

DD230S24KHPSA1 from eupec (now Infineon Technologies) is a 2400 V, 230 A mean forward current, press-pack dual thyristor module designed for high-power phase-controlled rectification and AC line commutated inverters in industrial medium-voltage drives and HVDC converter stations. It features 1.74 V max forward voltage at 800 A and 150 °C junction temperature, 0.150 °C/W max thermal resistance per arm, and 9000 A non-repetitive surge current capability.

For engineers reviewing the DD230S24KHPSA1 datasheet, DD230S24KHPSA1 pinout, DD230S24KHPSA1 application, or DD230S24KHPSA1 equivalent, key selection criteria include repetitive peak reverse voltage (VRRM = 2400 V), RMS forward current rating (IFRMSM = 410 A), transient thermal impedance ZthJC per arm, pressure-contact Si-pellet construction, and isolation test voltage (VISOL = 3 kV RMS).

Technical Context

This dual thyristor module implements two independent, electrically isolated SCR arms in a single press-pack housing with AlN internal insulation and M8 mechanical mounting. Each arm supports phase-controlled conduction with gate trigger thresholds defined for reliable turn-on under high dv/dt conditions up to 250 A/µs.

Thermal performance is characterized by analytical ZthJC transient models (six RC network elements) and steady-state RthJC = 0.150 °C/W per arm. The device operates with case temperatures from –40 °C to +150 °C and requires controlled clamping force (16 Nm ±15% for M1 mounting bolts) to maintain thermal and electrical integrity.

Key Specifications

Pinout & Package

DD230S24KHPSA1 is housed in a press-pack module with two isolated thyristor arms, each featuring anode (A), cathode (K), and gate (G) terminals accessible via threaded M8 studs (anode/cathode) and M2 screw terminals (gates). Mechanical mounting uses four M1 bolts (16 Nm torque) on the baseplate.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage thyristor module applications.

Compared with TT230N24KOF and SKKT230/24E, DD230S24KHPSA1 delivers superior thermal cycling endurance via pressure-contact construction, higher isolation margin for critical infrastructure, and tighter transient thermal modeling support-making it preferred for HVDC and industrial drives demanding >20-year service life.

Availability

DD230S24KHPSA1 is available at Aetrix Electronics and suitable for industrial medium-voltage drives, line-commutated HVDC converters, traction converter systems, and reactive power compensation requiring stable component supply across multi-year production programs.

Supply support for DD230S24KHPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

eupec GmbH + Co. KG was a European power semiconductor specialist acquired by Infineon Technologies in 2000; its high-power thyristor and diode modules remain industry benchmarks for reliability in grid and industrial applications.

DD230S24KHPSA1 belongs to the DD230S series of dual-arm press-pack thyristors engineered specifically for natural-commutated high-power conversion systems operating above 3.3 kV, where long-term thermal stability and galvanic isolation integrity are mission-critical.

FAQ

What gate drive voltage and current are required to reliably trigger DD230S24KHPSA1?

DD230S24KHPSA1 requires a minimum gate trigger pulse of 2.5 V and 1.5 A with <100 ns rise time for guaranteed turn-on at 150 °C junction temperature. Gate threshold voltage (VGT) is specified ≤2.0 V at 25 °C, but derates to ≤2.5 V at 150 °C. Pulse width must exceed 20 µs to ensure latching under high dv/dt conditions up to 250 A/µs.

Can DD230S24KHPSA1 be used in parallel configurations?

No-DD230S24KHPSA1 is not designed for paralleling. Its press-pack construction lacks integrated current-sharing features like emitter ballasting or matched dynamic parameters. Parallel operation would cause unequal current distribution due to parameter spread in VTO (1.0 V) and rT (0.8 mΩ), risking thermal runaway. For higher current, series connection of modules is recommended with active voltage balancing.

What is the maximum allowable heatsink surface temperature for continuous operation?

The maximum allowable heatsink (case) temperature for continuous operation is +100 °C, based on the IFAVM = 230 A rating at tc = 100 °C. Exceeding this temperature reduces mean forward current linearly: at tc = 91 °C, IFAVM rises to 261 A; at tc = 110 °C, IFAVM drops to 207 A. Thermal derating must follow the published RthJC = 0.150 °C/W per arm and RthCK = 0.04 °C/W curves.

Does DD230S24KHPSA1 require forced cooling, or is natural convection sufficient?

Forced cooling is mandatory. At 230 A mean forward current and 150 °C max junction temperature, natural convection cannot dissipate the ~1.2 kW of conduction loss (based on 1.74 V vF). A heatsink with thermal resistance ≤0.08 °C/W (including RthCK = 0.04 °C/W and interface resistance) and ≥1200 CFM airflow is required. Liquid cooling is recommended for HVDC valve applications to maintain ΔT < 25 K.