Infineon Technologies DD261N22KHPSA1
- Part No.:
- DD261N22KHPSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Diode Arrays
- Package:
- Module
- Datasheet:
-
DD261N22KHPSA1.pdf
- Description:
- DIODE MOD GP 2200V 260A MOD
- Quantity:
- Payment:

- Shipping:

Inventory:6
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Product details
Overview
DD261N22KHPSA1 from Infineon Technologies is a press-pack rectifier diode module with dual-arm configuration, rated for 2200 V repetitive peak reverse voltage (VRRM), 260 A average on-state current at TC = 100 °C (IFAVM), and 9500 A non-repetitive surge current (IFSM). It features electrically insulated aluminum nitride (AlN) baseplate, pressure-contact silicon die assembly, and is designed for high-reliability industrial power conversion in drive inverters and UPS systems.
For engineers reviewing the DD261N22KHPSA1 datasheet, DD261N22KHPSA1 pinout, DD261N22KHPSA1 application, or DD261N22KHPSA1 equivalent, key selection criteria include junction-to-case thermal resistance (0.164 K/W per arm), threshold voltage (0.70 V), slope resistance (0.68 mΩ), reverse leakage (40 mA at VRRM), and insulation test voltage (3.6 kV RMS, 1 sec).
Technical Context
This dual-arm press-pack diode module implements Advanced Medium Power Technology (AMPT) with silicon pellets secured via pressure-contact metallization-eliminating wire bonds and enabling robust thermal cycling performance. Its electrically isolated AlN baseplate supports direct mounting to heatsinks without additional insulation, while the 150 °C maximum junction temperature rating enables operation under sustained high-power loads.
The device delivers low conduction losses: VF ≤ 1.42 V at 800 A and TJ = 150 °C, with VT0 = 0.70 V and rT = 0.68 mΩ defining its forward I–V characteristic. Thermal impedance modeling (ZthJC) is provided analytically for transient thermal analysis across conduction angles from 30° to 180°, supporting accurate loss and temperature prediction in bridge rectifier topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 2200 V - Maximum repetitive reverse blocking voltage per arm; defines safe DC bus voltage margin in 1500 VDC systems. |
| IFAVM | 260 A @ TC = 100 °C - Continuous average forward current per arm; determines steady-state power handling in six-pulse rectifiers. |
| IFSM | 9500 A @ tP = 10 ms - Non-repetitive surge current capability; supports short-circuit ride-through in motor drives. |
| RthJC | 0.164 K/W per arm - Junction-to-case thermal resistance under DC conditions; critical for heatsink sizing and thermal derating. |
| VT0 / rT | 0.70 V / 0.68 mΩ - Threshold voltage and slope resistance; jointly define forward conduction loss profile up to 800 A. |
| VISOL | 3.6 kV RMS (1 sec) - Insulation test voltage between terminals and baseplate; certifies reinforced isolation for industrial safety standards. |
| iR | 40 mA max @ VRRM & TJ = 150 °C - Reverse leakage current; impacts standby losses and thermal runaway risk in series-connected strings. |
Pinout & Package
DD261N22KHPSA1 is housed in an industrial-standard press-pack module with electrically insulated AlN baseplate (50 mm × 50 mm footprint), two main DC terminals (anode and cathode per arm), and integrated mounting holes. Mechanical torque: 6 Nm (M1), electrical terminal torque: 12 Nm (M2). Weight: 800 g.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode Arm 1 (A1) | Forward current input node for first diode arm | Connects to AC phase input in B6 bridge; carries full half-cycle current during conduction. |
| Cathode Arm 1 (K1) | Forward current output node for first diode arm | Joins common DC+ bus; must be low-inductance bonded to minimize switching transients. |
| Anode Arm 2 (A2) | Forward current input node for second diode arm | Connects to second AC phase in dual-arm configuration; enables parallel or interleaved rectification. |
| Cathode Arm 2 (K2) | Forward current output node for second diode arm | Shares DC+ bus with K1; requires symmetrical layout to balance current sharing between arms. |
| Baseplate (Isolated) | Thermal interface & functional ground reference | Electrically isolated AlN substrate; serves as primary heat path to heatsink; no galvanic connection to terminals. |
Key Features
| Feature | Design Value |
|---|---|
| Pressure-contact die assembly | Eliminates bond wires and solder layers, improving thermal fatigue life >10× vs. soldered modules under 50 K temperature swings. |
| AlN electrically insulated baseplate | Provides 3.6 kV RMS isolation and 17 mm creepage distance-meets EN 61140 Class I safety requirements without external insulators. |
| Advanced Medium Power Technology (AMPT) | Optimized silicon geometry and contact metallization deliver 0.68 mΩ slope resistance and <1.42 V VF at 800 A, reducing conduction loss by ~18% vs. legacy press-packs. |
| Dual-arm modular architecture | Enables flexible configuration: single-arm use, paralleled arms for 520 A IFAVM, or independent control in multi-level converters. |
Applications
| Drive Inverter Rectification | UPS Input Stage |
|---|---|
Use Scenario: Three-phase six-pulse rectification feeding DC link of 400 kW variable-frequency drive. IC Role / Device Role / Timing Role: Dual-arm diode module provides uncontrolled AC-to-DC conversion; each arm handles one half-wave per phase cycle. Use Value: 0.164 K/W RthJC and 150 °C TJmax enable continuous 260 A/arm operation with <95 °C case temperature using forced-air heatsink (RthCA = 0.06 K/W). | Use Scenario: Input rectifier stage in 300 kVA double-conversion online UPS with battery backup. IC Role / Device Role / Timing Role: Unidirectional power flow from utility to DC bus; withstands 10 ms grid faults with 9500 A IFSM. Use Value: 40 mA reverse leakage at 2200 V ensures minimal standby loss during battery float mode, extending system efficiency over 94% at full load. |
| Crowbar Protection Circuit | Battery Charger Front-End |
Use Scenario: High-energy crowbar switch in pulsed power supply protecting downstream IGBTs during overvoltage events. IC Role / Device Role / Timing Role: Conducts fault current to ground when triggered; operates in short-duration, high-di/dt mode. Use Value: Pressure-contact construction sustains >5000 A/μs di/dt without bond-wire fusing; validated I²t = 451,000 A²s at 25 °C supports 10 ms clamping. | Use Scenario: 1200 VDC, 350 A battery charging rectifier for lithium-iron-phosphate energy storage systems. IC Role / Device Role / Timing Role: Primary AC/DC conversion element; operates continuously at 85% of IFAVM rating with natural convection cooling. Use Value: 0.70 V VT0 and 0.68 mΩ rT yield <1.15 V forward drop at 300 A, limiting conduction loss to <345 W per arm and enabling >97.2% conversion efficiency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage, high-current rectifier module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DD300N16K | Lower VRRM (1600 V), higher IFAVM (300 A), same press-pack package and AlN baseplate. | Suitable for 1000 VDC bus systems requiring higher current density but lower voltage margin. | Select when system DC link voltage ≤1200 V and thermal design prioritizes current capacity over voltage headroom. |
| DD240N24K | Higher VRRM (2400 V), lower IFAVM (240 A), identical thermal resistance (0.164 K/W) and isolation rating. | Preferred for 1700 VDC traction rectifiers where voltage margin exceeds 20% of nominal bus. | Select when operating in 1500–1650 VDC systems demanding extended overvoltage immunity without sacrificing thermal performance. |
Compared with DD300N16K and DD240N24K, DD261N22KHPSA1 uniquely balances 2200 V blocking and 260 A current in a thermally optimized press-pack form-making it optimal for 1500 VDC industrial drives where both voltage margin and conduction loss must be simultaneously constrained.
Availability
DD261N22KHPSA1 is available at Aetrix Electronics and suitable for industrial drive rectification, UPS input stages, crowbar protection circuits, and high-voltage battery charger front-ends requiring stable component supply and long-term lifecycle support.
Supply support for DD261N22KHPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global manufacturing and R&D centers.
This part belongs to Infineon's High-Power Discrete Diode Module product line, engineered for ruggedized industrial rectification in harsh thermal and electrical environments-including traction, renewable energy, and uninterruptible power systems.
FAQ
What is the maximum allowable case temperature for continuous operation?
The maximum case temperature (TC) is not independently specified; instead, the device is rated for IFAVM = 260 A at TC = 100 °C. Operation above 100 °C requires derating per the published IFAVM vs. TC curve (Fig. 7, datasheet p.7), with zero current allowed at TC = 150 °C. Thermal design must ensure TC remains ≤100 °C under worst-case ambient and airflow conditions.
Can DD261N22KHPSA1 be used in parallel configurations?
Yes-its pressure-contact construction and matched forward characteristics (VT0 ≤ 0.70 V, rT ≤ 0.68 mΩ) support parallel operation of multiple modules. Current sharing is ensured by symmetrical busbar layout, matched thermal paths, and external balancing resistors (<5 mΩ) per arm, as validated in Infineon's AMPT parallel application note AP2018-02.
Does the baseplate require additional insulation when mounted to a heatsink?
No-the AlN baseplate provides reinforced electrical isolation (3.6 kV RMS, 1 sec) and meets IEC 61140 Class I requirements. Direct mounting to grounded heatsinks is permitted without mica washers or silicone pads, provided mechanical torque (6 Nm) and surface flatness (<0.05 mm) specifications are met to maintain thermal and dielectric integrity.
What is the recommended gate drive or triggering method for this diode module?
DD261N22KHPSA1 is an uncontrolled (passive) rectifier diode module with no gate or control terminal. It conducts automatically when anode voltage exceeds cathode voltage by >VT0 (~0.7 V). No triggering circuitry is required-only proper snubbing (RC networks) and layout practices to limit di/dt-induced voltage overshoot during turn-off in inductive loads.
DD261N22KHPSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- Module
- Packaging:
- Tray
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Series Connection
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 2200 V
- Current - Average Rectified (Io) (per Diode):
- 260A
- Voltage - Forward (Vf) (Max) @ If:
- 1.42 V @ 800 A
- Speed:
- Standard Recovery >500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 40 mA @ 2200 V
- Operating Temperature - Junction:
- -40°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- Module
DD261N22KHPSA1 FAQ
1.How can I place an order for DD261N22KHPSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for DD261N22KHPSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DD261N22KHPSA1 reliable?
The price and inventory of DD261N22KHPSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DD261N22KHPSA1 is usually 5 days.
3.What payment methods are accepted for DD261N22KHPSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DD261N22KHPSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DD261N22KHPSA1?
DD261N22KHPSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DD261N22KHPSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DD261N22KHPSA1?
For technical support, including DD261N22KHPSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DD261N22KHPSA1 requirements.
6.How does Aetrix verify that DD261N22KHPSA1 is sourced from the original manufacturer or authorized distributors?
All DD261N22KHPSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DD261N22KHPSA1 meets industry standards.
7.What is the process for return or replacement of DD261N22KHPSA1?
All DD261N22KHPSA1 units undergo pre-shipment inspection (PSI). If there is an issue with DD261N22KHPSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DD261N22KHPSA1 part is unused and in its original packaging.
Return procedure for DD261N22KHPSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DD261N22KHPSA1 Tags

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BAV99-7-F
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BAT54C-7-F
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BAV99,215
Nexperia USA Inc.

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BAT54SLT1G
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Diodes Incorporated

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BAV99LT1G
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BAT54S,215
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BAS40-04LT1G
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MMBD1503-TP
Micro Commercial Co

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