Infineon Technologies DD540N26KHPSA1

Overview

DD540N26KHPSA1 from Infineon Technologies is a press-pack rectifier diode module rated for 2600 V repetitive peak reverse voltage (VRRM), 540 A average forward current (IFAVM) at TC = 100 °C, and 16.5 kA non-repetitive surge current (IFSM); it features electrically insulated AlN baseplate, pressure-contact silicon pellet construction, and is used in high-power industrial drive rectification.

For engineers reviewing the DD540N26KHPSA1 datasheet, DD540N26KHPSA1 pinout, DD540N26KHPSA1 application, or DD540N26KHPSA1 equivalent, key selection criteria include junction-to-case thermal resistance (0.078 K/W per module), on-state threshold voltage (0.78 V), slope resistance (0.31 mΩ), reverse leakage (40 mA at VRRM), and insulation test voltage (3.6 kV RMS, 1 sec).

Technical Context

This dual-arm press-pack diode module implements a two-diode half-bridge configuration with independent terminals for anode, cathode, and isolated baseplate. Its pressure-contact technology eliminates wire bonds and solder layers, enabling robust thermal cycling performance and low parasitic inductance.

Designed for forced-air or liquid-cooled heatsink mounting, it supports both two-pulse (B2) and six-pulse (B6) bridge topologies with validated derating curves for IFAVM vs. case temperature and total power loss vs. ambient temperature across RthCA values from 0.012 to 0.5 K/W.

Key Specifications

Pinout & Package

Package: Press-pack module with electrically insulated AlN ceramic baseplate (60 mm × 60 mm footprint), height 10 mm, weight 1500 g, M1 mechanical mounting torque 6 Nm ±15%, M2 terminal torque 12 Nm ±10%.

Key Features

Applications

Availability

DD540N26KHPSA1 is available at Aetrix Electronics and suitable for industrial AC drives, uninterruptible power supplies (UPS), battery charging systems, and medium-voltage rectifier stacks requiring stable component supply and long-term production continuity.

Supply support for DD540N26KHPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and energy markets.

This device belongs to Infineon's High-Power Discrete Diode Module product line, engineered for reliability-critical, high-current rectification in harsh thermal and electrical environments where solder-free construction and isolation integrity are mandatory.

FAQ

What is the maximum allowable junction temperature for DD540N26KHPSA1?

The maximum junction temperature (Tvj max) is 150 °C, validated under steady-state and transient conditions per IEC 60747-2. Operation above this limit risks irreversible degradation of the silicon die and pressure-contact interface. Thermal design must ensure that peak instantaneous junction temperature-calculated using ZthJC transient curves and actual power loss waveforms-remains below 150 °C across all operating modes including overload and startup.

Can DD540N26KHPSA1 be used in parallel configurations?

Yes, but only with strict matching and external current-sharing measures. The module has no integrated current-balancing features; parallel operation requires identical heatsink contact resistance, symmetrical busbar inductance (<10 nH difference), and individual fast-acting fusing per arm. Derating to ≤450 A per device is recommended when paralleling two units to account for Vf mismatch (±5% typical) and thermal coupling effects.

What is the creepage distance and why does it matter for this module?

The creepage distance is 19 mm between terminals and baseplate, compliant with IEC 60664-1 for Pollution Degree 2 and material group IIIa. This value ensures safe operation at 2600 V blocking voltage in industrial environments with dust, humidity, or condensation. Insufficient creepage would risk surface tracking, especially under high humidity or contamination, leading to insulation failure and short circuits between high-voltage terminals and grounded heatsinks.

How does the pressure-contact construction affect maintenance and replacement?

Pressure-contact construction eliminates solder joints and wire bonds, making the module field-replaceable without rework of PCBs or substrates. Replacement requires only torque-controlled removal of M2 terminals and M1 baseplate bolts, followed by visual inspection of contact surfaces for pitting or oxidation. No reflow or bonding equipment is needed, reducing downtime in drive cabinet servicing-but baseplate flatness and surface finish must be verified before reuse to maintain specified RthCH (0.01–0.02 K/W).