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Infineon Technologies DDB2U60N12W1RFB11BPSA1
- Part No.:
- DDB2U60N12W1RFB11BPSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Bridge Rectifiers
- Package:
- Module
- Datasheet:
-
DDB2U60N12W1RFB11BPSA1.pdf
- Description:
- BRIDGE RECT 1P 1.2KV 60A EASY1B1
- Quantity:
- Payment:
- Shipping:
Inventory:5,707
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Product details
Overview
DDB2U60N12W1RFB11BPSA1 from Infineon is an EasyBRIDGE power module integrating a 1200 V / 60 A CoolSiC™ Gen 5 Schottky diode and an NTC thermistor on an Al₂O₃ substrate, rated for 150 °C junction operation and qualified per IEC 60747/60749/60068 for industrial DC fast charging systems.
For engineers reviewing the DDB2U60N12W1RFB11BPSA1 datasheet, DDB2U60N12W1RFB11BPSA1 pinout, DDB2U60N12W1RFB11BPSA1 application, or DDB2U60N12W1RFB11BPSA1 equivalent, this module delivers validated thermal robustness (RthJH = 0.713 K/W), low stray inductance (10 nH), PressFIT mounting, and integrated temperature sensing for high-reliability EV charger front-end rectification.
Technical Context
This module implements a dual-die configuration with a single SiC Schottky diode chip and co-packaged NTC sensor, enabling real-time thermal monitoring without external components. Its Al₂O₃ substrate provides 0.713 K/W thermal resistance from junction to heatsink and supports continuous 60 A RMS forward current at TH = 40 °C.
The PressFIT contact system eliminates soldering while maintaining <1.7 mΩ terminal-to-chip resistance per switch path. Electrical isolation meets 3.0 kV RMS (50 Hz, 1 min) with 11.5 mm creepage to heatsink, satisfying industrial safety requirements for 1200 V DC bus applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 1200 V - Maximum repetitive reverse voltage withstand capability for 1200 V DC link rectification |
| IFRMSM | 60 A @ TH = 40 °C - Continuous RMS forward current rating per diode chip under defined heatsink conditions |
| Tvj, op | −40 to 150 °C - Operational junction temperature range enabling high-temperature reliability in enclosed chargers |
| RthJH | 0.713 K/W - Thermal resistance from diode junction to heatsink, critical for thermal design margin in forced-air-cooled systems |
| LsCE | 10 nH - Stray inductance across main terminals, minimizing voltage overshoot during fast diode turn-off |
| R25 (NTC) | 5 kΩ ±5% @ 25 °C - Standardized NTC resistance enabling direct interface with common analog temperature acquisition circuits |
| VF | 1.85 V @ IF = 60 A, Tvj = 150 °C - Forward voltage drop defining conduction loss and thermal load at full-rated current |
Pinout & Package
Package: EasyBRIDGE 2L (two-terminal layout), PressFIT-compatible housing with integrated clamps, Al₂O₃ ceramic substrate, 22 g mass, 11.5 mm creepage to heatsink.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (A) | Diode anode connection | Main high-side DC input terminal for unidirectional current flow into the module |
| Cathode (K) | Diode cathode connection | Main low-side DC output terminal; carries full rectified current to downstream filter stage |
| NTC+ / NTC− | NTC thermistor terminals | Dedicated 2-wire interface for precision temperature sensing adjacent to diode die |
Key Features
| Feature | Design Value |
|---|---|
| CoolSiC™ Gen 5 Schottky diode | Zero reverse recovery charge (Qrr ≈ 0), eliminating switching losses and EMI in high-frequency rectifiers |
| Integrated NTC thermistor | 5 kΩ ±5% @ 25 °C with B25/100 = 3433 K, enabling accurate thermal derating without PCB space penalty |
| PressFIT contact technology | Eliminates solder reflow process; achieves reliable mechanical and electrical connection via spring-loaded pins |
| Al₂O₃ substrate | Provides 0.713 K/W thermal resistance and 3.0 kV RMS isolation, meeting IEC 60747 insulation requirements |
| Compact rugged mounting | Integrated clamps deliver 20–50 N mounting force per clamp, ensuring stable thermal interface under vibration |
Applications
| EV DC Fast Charging Front-End Rectifier | Industrial AC/DC Power Supply |
|---|---|
Use Scenario: High-efficiency 1200 V DC bus rectification in liquid- or forced-air-cooled EV charging stations. IC Role / Device Role / Timing Role: Primary unidirectional power conversion element handling up to 60 A RMS continuous current. Use Value: Zero Qrr and 1.85 V VF at 150 °C reduce conduction + switching losses by >30% vs. silicon diodes, lowering heatsink size and fan noise. | Use Scenario: Input-stage rectification in high-reliability industrial UPS and motor drive power supplies. IC Role / Device Role / Timing Role: High-voltage, high-current freewheeling and rectification device operating continuously at 150 °C junction. Use Value: Rugged 150 °C operation and IEC-qualified validation ensure long-term stability in sealed enclosures with limited airflow. |
| Solar Inverter Boost Stage | Energy Storage System (ESS) Bi-Directional Converter |
Use Scenario: Boost diode in string-level solar inverters interfacing 1000–1500 V PV arrays. IC Role / Device Role / Timing Role: High-voltage, low-loss freewheeling path during MOSFET/IGBT switching transitions. Use Value: 10 nH stray inductance minimizes voltage spikes during diode commutation, reducing snubber component count and cost. | Use Scenario: Unidirectional power path in bi-directional DC/DC converters for battery energy storage systems. IC Role / Device Role / Timing Role: Isolation diode preventing reverse current flow during battery discharge mode. Use Value: Integrated NTC enables real-time thermal monitoring of diode die, supporting dynamic current derating and predictive maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage SiC diode module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| FF600R12ME4 | 1200 V / 600 A IGBT module with anti-parallel SiC diode; larger footprint, higher current capacity | Designed for inverter output stage, not optimized for standalone rectification | Choose only if both switching and rectification functions are required in same module |
| DD1200S33H16 | 1200 V / 1200 A SiC diode module; no integrated NTC; TO-247-3L discrete packaging | Lacks integrated thermal sensing and PressFIT mounting; requires external temperature monitoring circuitry | Select when maximum current density is prioritized over thermal integration and assembly simplicity |
Compared with FF600R12ME4 and DD1200S33H16, DDB2U60N12W1RFB11BPSA1 uniquely combines 60 A rectification, integrated NTC, PressFIT mounting, and compact EasyBRIDGE form factor-making it optimal for space-constrained, thermally managed DC charger front ends where modularity and simplified BOM are critical.
Availability
DDB2U60N12W1RFB11BPSA1 is available at Aetrix Electronics and suitable for EV DC fast charging, industrial AC/DC power supplies, solar inverter boost stages, and energy storage system bi-directional converters requiring stable component supply and long-lifecycle support.
Supply support for DDB2U60N12W1RFB11BPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensors for automotive, industrial, and renewable energy markets.
This part belongs to Infineon's EasyBRIDGE family-engineered specifically for high-efficiency, high-reliability power conversion modules in EV infrastructure and industrial power systems, emphasizing integration, thermal performance, and qualification to international standards.
FAQ
What is the maximum continuous forward current rating for DDB2U60N12W1RFB11BPSA1?
The module is rated for 60 A RMS forward current per diode chip at heatsink temperature TH = 40 °C. This rating assumes proper thermal management and adherence to the specified mounting force (20–50 N per clamp) and heatsink interface conditions outlined in the datasheet.
Does DDB2U60N12W1RFB11BPSA1 include galvanic isolation between terminals and heatsink?
Yes-it provides reinforced basic insulation per IEC 61140 with 3.0 kV RMS isolation test voltage (50 Hz, 1 min), 11.5 mm creepage, and 10.0 mm clearance from terminals to heatsink, enabled by its Al₂O₃ ceramic substrate.
Can the integrated NTC thermistor be used for closed-loop thermal protection?
Yes-the NTC provides 5 kΩ ±5% resistance at 25 °C with tight B-value tolerance (B25/100 = 3433 K), allowing precise temperature calculation across −40 to 150 °C. It interfaces directly with standard analog front-ends for real-time thermal derating and fault shutdown.
Is PressFIT mounting compatible with standard PCB assembly processes?
No-PressFIT is a press-in connector technology requiring dedicated insertion tooling and compatible heatsink footprints. It replaces soldering but is not compatible with reflow or wave soldering; mechanical retention and contact integrity depend on controlled insertion force and heatsink pad flatness.
DDB2U60N12W1RFB11BPSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolSiC™
- Package/Case:
- Module
- Packaging:
- Tray
- Product Status:
- Active
- Diode Type:
- Single Phase
- Technology:
- Silicon Carbide Schottky
- Voltage - Peak Reverse (Max):
- 1.2 kV
- Current - Average Rectified (Io):
- 60 A
- Voltage - Forward (Vf) (Max) @ If:
- 1.85 V @ 60 A
- Current - Reverse Leakage @ Vr:
- 174 µA @ 1200 V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- AG-EASY1B-1
DDB2U60N12W1RFB11BPSA1 FAQ
1.How can I place an order for DDB2U60N12W1RFB11BPSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for DDB2U60N12W1RFB11BPSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DDB2U60N12W1RFB11BPSA1 reliable?
The price and inventory of DDB2U60N12W1RFB11BPSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DDB2U60N12W1RFB11BPSA1 is usually 5 days.
3.What payment methods are accepted for DDB2U60N12W1RFB11BPSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DDB2U60N12W1RFB11BPSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DDB2U60N12W1RFB11BPSA1?
DDB2U60N12W1RFB11BPSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DDB2U60N12W1RFB11BPSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DDB2U60N12W1RFB11BPSA1?
For technical support, including DDB2U60N12W1RFB11BPSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DDB2U60N12W1RFB11BPSA1 requirements.
6.How does Aetrix verify that DDB2U60N12W1RFB11BPSA1 is sourced from the original manufacturer or authorized distributors?
All DDB2U60N12W1RFB11BPSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DDB2U60N12W1RFB11BPSA1 meets industry standards.
7.What is the process for return or replacement of DDB2U60N12W1RFB11BPSA1?
All DDB2U60N12W1RFB11BPSA1 units undergo pre-shipment inspection (PSI). If there is an issue with DDB2U60N12W1RFB11BPSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DDB2U60N12W1RFB11BPSA1 part is unused and in its original packaging.
Return procedure for DDB2U60N12W1RFB11BPSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DDB2U60N12W1RFB11BPSA1 Tags
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HDS10M-13
Diodes Incorporated
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CD-MBL106S
Bourns Inc.
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MB10S-13
Diodes Incorporated
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CD-MBL206SL
Bourns Inc.
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MB4S-TP
Micro Commercial Co
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MB6S-TP
Micro Commercial Co
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CD-MBL210S
Bourns Inc.
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BAS3007ARPPE6327HTSA1
Infineon Technologies
-
DF02M
Diodes Incorporated
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CD-MBL210SL
Bourns Inc.
-
DF04M
Diodes Incorporated
-
DF01M
Diodes Incorporated
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