Infineon Technologies DDB6U180N16RRPB37BPSA1

Overview

DDB6U180N16RRPB37BPSA1 from Infineon is a dual-function power module integrating an IGBT4 brake-chopper (VCES = 1200 V, IC = 100 A) and an emitter-controlled brake-chopper diode (VRRM = 1200 V, IF = 50 A), housed in EconoPACK™2 with PressFIT terminals and pre-applied thermal interface material. It operates up to Tvj op = 150°C and delivers low conduction losses (VCE sat ≤ 2.10 V @ 150°C, VF ≤ 2.15 V @ 150°C) for high-efficiency motor drive braking circuits.

For engineers reviewing the DDB6U180N16RRPB37BPSA1 datasheet, DDB6U180N16RRPB37BPSA1 pinout, DDB6U180N16RRPB37BPSA1 application, or DDB6U180N16RRPB37BPSA1 equivalent, key selection criteria include validated RthJH of 0.425 K/W (IGBT) and 1.19 K/W (diode), integrated NTC thermistor (R25 = 5.00 kΩ), and 2.5 kV isolation test voltage - all critical for servo drive thermal management and safety compliance.

Technical Context

This module implements a co-packaged IGBT–diode pair optimized for regenerative braking in industrial motor drives. The IGBT uses Trench/Fieldstop 4 technology with gate threshold voltage VGEth = 5.25–6.35 V and internal RGint = 7.5 Ω, enabling robust turn-on/turn-off control under high dv/dt conditions. Its RBSOA supports 360 A short-circuit current at 150°C for tP ≤ 10 µs.

The brake-chopper diode features soft reverse recovery (Qr = 5.50–10.2 µC, Erec = 1.70–3.70 mJ) and low forward voltage (VF = 1.65–2.15 V), minimizing switching loss during energy dissipation. Both devices share a common Al₂O₃ substrate (RthJH validated with IFX TIM) and isolated copper baseplate, enabling direct heatsink mounting without additional insulation.

Key Specifications

Pinout & Package

EconoPACK™2 package with isolated copper baseplate, Al₂O₃ ceramic substrate, and PressFIT solderless terminals. Dimensions: 100 mm × 62 mm × 17 mm (L × W × H). Pre-applied thermal interface material (TIM) on baseplate surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar brake-chopper applications.

Compared with F4-12MR12W2M1_B11, DDB6U180N16RRPB37BPSA1 offers proven thermal stability with pre-applied TIM and simpler integration, while FF450R12ME4_B4 trades modularity for higher current scalability at the cost of added design overhead.

Availability

DDB6U180N16RRPB37BPSA1 is available at Aetrix Electronics and suitable for industrial servo drives, auxiliary inverters, and motor drive auxiliary power supplies requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.

Supply support for DDB6U180N16RRPB37BPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and renewable energy markets.

This part belongs to Infineon's EconoPACK™2 power module product line, designed specifically for cost-sensitive, high-reliability industrial motor control applications requiring integrated thermal and electrical performance in compact press-fit packages.

FAQ

What is the maximum allowable baseplate temperature for continuous operation?

The maximum baseplate operating temperature (TBPmax) is 125°C, as specified in the datasheet. This limit ensures reliable long-term operation of the Al₂O₃ substrate, PressFIT contacts, and pre-applied TIM. Exceeding this temperature risks TIM degradation and increased thermal resistance, potentially triggering thermal shutdown in systems using the integrated NTC for protection.

Can the NTC thermistor be used for closed-loop temperature control?

Yes - the integrated NTC (R25 = 5.00 kΩ, B25/100 = 3433 K) provides calibrated resistance vs. temperature data across –40°C to 125°C. Its ±5% R100 deviation and 20 mW power dissipation rating support direct use with standard analog front-end circuits for real-time baseplate temperature feedback in thermal management algorithms.

What gate drive voltage and resistance are recommended for optimal switching performance?

Infineon specifies ±15 V gate drive with RGon = RGoff = 1.6 Ω for characterization. This setting balances switching speed (td(on) = 0.17 µs, td(off) = 0.45 µs @ 150°C) and voltage overshoot control. Using higher resistance increases Eon/Eoff; lower resistance risks excessive dv/dt and oscillation due to LsCE = 50 nH and RGint = 7.5 Ω.

Is rework or replacement of the pre-applied thermal interface material possible?

No - the IFX thermal interface material is factory-applied and not user-serviceable. Attempting removal or reapplication voids warranty and risks substrate damage or contamination. For thermal maintenance, Infineon recommends replacing the entire module per AN 2012-07 guidelines on storage and shipment of TIM-equipped modules.