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Diodes Incorporated DESD3V3X1BCSF-7
- Part No.:
- DESD3V3X1BCSF-7
- Manufacturer:
- Diodes Incorporated
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
DESD3V3X1BCSF-7.pdf
- Description:
- DATALINE PROTECTION PP X2-DSN060
- Quantity:
- Payment:
- Shipping:
Inventory:3,473
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Product details
Overview
DESD3V3X1BCSF-7 from Diodes Incorporated is a bidirectional TVS diode engineered for ultra-low-capacitance ESD protection in high-speed data lines. It delivers 3.3 V reverse standoff voltage, 5.2 V clamping at 4 A (8/20 µs), ±10 kV IEC 61000-4-2 contact ESD immunity, and only 0.21 pF input capacitance - enabling robust protection without signal integrity degradation in USB3.1 and Thunderbolt 3 interfaces.
For engineers reviewing the DESD3V3X1BCSF-7 datasheet, DESD3V3X1BCSF-7 pinout, DESD3V3X1BCSF-7 application, or DESD3V3X1BCSF-7 equivalent, key selection criteria include sub-0.25 pF channel capacitance, low dynamic resistance (0.35 Ω), precise 3.3 V VRWM tolerance, and X2-DSN0603-2 chip-scale package compatibility with fine-pitch high-speed routing.
Technical Context
This TVS operates as a bidirectional clamping device across a single channel, triggered by transient overvoltage exceeding its 5 V minimum breakdown voltage (VBR). Its low 0.35 Ω dynamic resistance ensures rapid energy shunting during ESD events, while the 0.21 pF typical input capacitance minimizes insertion loss and phase distortion on differential pairs.
The device uses NiAu bump terminations on a DSN0603-2 substrate, enabling solder reflow per MIL-STD-202 Method 208. Thermal resistance of 500 °C/W and 250 mW steady-state power dissipation support operation from –55 °C to +150 °C in compact portable PCB layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Standoff Voltage | 3.3 V - Maximum continuous working voltage before leakage exceeds 1 µA; sets operating margin below signal swing in 3.3 V logic or USB3.1 common-mode range. |
| Clamping Voltage (IPP = 4 A) | 5.2 V - Peak voltage seen by protected IC during 8/20 µs surge; stays below absolute maximum ratings of most 3.3 V transceivers. |
| ESD Clamping Voltage (TLP) | 6.0 V @ 8 A - Confirmed low-voltage clamping under fast TLP stress (100 ns), critical for preserving eye diagram integrity in multi-Gbps links. |
| Channel Input Capacitance | 0.21 pF - Measured at 0 V bias, 1 MHz; enables <0.1 dB insertion loss up to 10 GHz, suitable for USB3.1 Gen1/Gen2 differential signaling. |
| Breakdown Voltage | 5–9 V - Minimum 5 V onset ensures no false triggering during normal 3.3 V rail transients; max 9 V defines worst-case turn-on threshold. |
| Peak Pulse Current | 4 A - Sustains 8/20 µs surges per IEC 61000-4-5 Level 2; sufficient for system-level ESD coupling into shielded cables or connectors. |
Pinout & Package
DESD3V3X1BCSF-7 is housed in the X2-DSN0603-2 chip-scale package: 0.60 mm × 0.30 mm footprint, 0.30 mm height, NiAu bump terminations, and pin 1 marked by a bar on top view. The two-terminal configuration supports bidirectional protection across a single signal line or differential pair.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode/Cathode (bidirectional) | Non-polarized terminal; connects to signal line requiring ESD protection - no orientation dependency in layout. |
| Pin 2 | Anode/Cathode (bidirectional) | Paired terminal forming symmetric clamping path; both pins function identically for transient suppression in either polarity. |
Key Features
| Feature | Design Value |
|---|---|
| IEC 61000-4-2 ESD immunity | ±10 kV contact discharge - meets industrial and consumer end-equipment compliance requirements without external shielding or filtering. |
| Ultra-low input capacitance | 0.21 pF - preserves signal rise/fall times and return loss >15 dB up to 8 GHz, essential for USB3.1 Gen2 (10 Gbps) eye opening. |
| Dynamic resistance | 0.35 Ω - limits voltage overshoot during sub-nanosecond ESD events, reducing risk of gate oxide damage in downstream PHYs. |
| Chip-scale packaging | X2-DSN0603-2 - 0.6 mm × 0.3 mm footprint saves >70% board area vs. SOD-323, enabling placement directly at connector pads. |
Applications
| USB3.1 Interface Protection | Thunderbolt 3 Lane Protection |
|---|---|
Use Scenario: Protecting SuperSpeed TX/RX differential pairs in laptop docking stations against connector hot-plug ESD. IC Role / Device Role / Timing Role: Bidirectional clamping TVS placed within 3 mm of USB-C receptacle to suppress ±10 kV contact discharges before reaching controller PHY. Use Value: 0.21 pF capacitance avoids measurable jitter increase (<0.1 UI) and maintains 8.0+ dB return loss at 5 GHz, ensuring Gen2 link training success. |
Use Scenario: Safeguarding four-lane Thunderbolt 3 host ports in compact NUC-style PCs during repeated cable insertions. IC Role / Device Role / Timing Role: Single-channel TVS deployed per differential lane (eight devices total) to clamp transients without degrading 20 Gbps NRZ eye diagrams. Use Value: 5.2 V clamping at 4 A prevents receiver input saturation, maintaining BER <1e−12 under IEC 61000-4-2 stress. |
| High-Density Peripheral Ports | Industrial USB Hub Controllers |
Use Scenario: ESD hardening of front-panel USB 3.0 ports on medical imaging consoles where space constraints limit filter component count. IC Role / Device Role / Timing Role: Primary ESD suppression element replacing RC filters, mounted directly at panel-mount connector PCB pads. Use Value: X2-DSN0603-2 footprint allows placement in 0.4 mm pitch routing zones, eliminating need for vias or stubs that degrade impedance matching. |
Use Scenario: Protecting embedded USB hub ICs in factory automation gateways exposed to maintenance personnel ESD in ungrounded environments. IC Role / Device Role / Timing Role: Standalone TVS on upstream DP/DM lines, rated for continuous 3.3 V operation and transient clamping up to 150 °C ambient. Use Value: –55 °C to +150 °C operating range ensures reliability in sealed enclosures with passive thermal buildup during extended runtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional low-capacitance TVS applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMA6J33A-Q | Unidirectional, 33 V VRWM, 120 pF CIN, DO-214AC package | Designed for 24–48 V industrial bus lines, not high-speed data | Select only for non-high-speed, higher-voltage DC rails where capacitance is not critical. |
| SP3205-01UTG | Bidirectional, 3.3 V VRWM, 0.35 pF CIN, SOD-523 package | 0.35 pF capacitance increases insertion loss at 5 GHz; larger 1.2 mm × 0.8 mm footprint | Acceptable if board space permits and 0.14 pF margin is available for Gen2 compliance. |
Compared with SMA6J33A-Q and SP3205-01UTG, DESD3V3X1BCSF-7 uniquely combines 0.21 pF capacitance, X2-DSN0603-2 size, and ±10 kV ESD rating - making it the only option qualified for USB3.1 Gen2 and Thunderbolt 3 differential lane placement without signal integrity compromise.
Availability
DESD3V3X1BCSF-7 is available at Aetrix Electronics and suitable for USB3.1 interface protection, Thunderbolt 3 lane hardening, and high-density peripheral port ESD mitigation requiring stable component supply across production ramps and long-life industrial programs.
Supply support for DESD3V3X1BCSF-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance protection, signal integrity, and power management solutions for computing, communications, and industrial markets.
This device belongs to Diodes' DESD series of ultra-low-capacitance TVS diodes, developed specifically to meet the stringent signal integrity and miniaturization demands of next-generation high-speed serial interfaces including USB, PCIe, and DisplayPort.
FAQ
What is the maximum operating temperature for DESD3V3X1BCSF-7?
The device is rated for continuous operation from –55 °C to +150 °C junction temperature. This range is validated per JEDEC JESD22-A104 and supports use in sealed industrial enclosures where passive thermal buildup may exceed 100 °C ambient, provided PCB copper area and airflow meet Diodes' suggested pad layout guidelines.
Can DESD3V3X1BCSF-7 protect differential USB3.1 signals without skew?
Yes - its symmetrical bidirectional structure and matched 0.21 pF capacitance per channel ensure <0.02 ps inter-line skew at 5 GHz. Layout best practices (equal trace length, 0.2 mm spacing between TVS pins and differential pair) maintain common-mode rejection and prevent mode conversion.
Is this part qualified for automotive applications?
No - DESD3V3X1BCSF-7 is not AEC-Q200 qualified. Diodes offers automotive-grade variants (e.g., DESD3V3W1BCSF-Q) with PPAP documentation, IATF 16949 manufacturing, and extended temperature validation; those parts carry explicit "-Q" suffixes and separate qualification reports.
How does the 0.35 Ω dynamic resistance impact ESD protection performance?
A 0.35 Ω dynamic resistance limits voltage overshoot during the initial 100 ps of an ESD event, reducing peak stress on downstream silicon gates. Measured via TLP, this value ensures clamping occurs before internal oxide breakdown thresholds are exceeded in 28 nm and smaller process nodes used in modern USB controllers.
DESD3V3X1BCSF-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5V
- Voltage - Clamping (Max) @ Ipp:
- 5.2V
- Current - Peak Pulse (10/1000µs):
- 4A (8/20µs)
- Power - Peak Pulse:
- 21W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.21pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DSN0603-2
DESD3V3X1BCSF-7 FAQ
1.How can I place an order for DESD3V3X1BCSF-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DESD3V3X1BCSF-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DESD3V3X1BCSF-7 reliable?
The price and inventory of DESD3V3X1BCSF-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DESD3V3X1BCSF-7 is usually 5 days.
3.What payment methods are accepted for DESD3V3X1BCSF-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DESD3V3X1BCSF-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DESD3V3X1BCSF-7?
DESD3V3X1BCSF-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DESD3V3X1BCSF-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DESD3V3X1BCSF-7?
For technical support, including DESD3V3X1BCSF-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DESD3V3X1BCSF-7 requirements.
6.How does Aetrix verify that DESD3V3X1BCSF-7 is sourced from the original manufacturer or authorized distributors?
All DESD3V3X1BCSF-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DESD3V3X1BCSF-7 meets industry standards.
7.What is the process for return or replacement of DESD3V3X1BCSF-7?
All DESD3V3X1BCSF-7 units undergo pre-shipment inspection (PSI). If there is an issue with DESD3V3X1BCSF-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DESD3V3X1BCSF-7 part is unused and in its original packaging.
Return procedure for DESD3V3X1BCSF-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DESD3V3X1BCSF-7 Tags
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