Diodes Incorporated DESD6V8DLP-7B
- Part No.:
- DESD6V8DLP-7B
- Manufacturer:
- Diodes Incorporated
- Category:
- TVS Diodes
- Package:
- 3-UFDFN
- Datasheet:
-
DESD6V8DLP-7B.pdf
- Description:
- TVS DIODE 5.25VWM 3-X1DFN1006
- Quantity:
- Payment:

- Shipping:

Inventory:6,562
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DESD6V8DLP-7B from Diodes Incorporated is a dual-channel, low-capacitance transient voltage suppression diode array designed for high-speed data line ESD protection in USB 2.0, HDMI, and audio interfaces. It features a 5.25 V reverse standoff voltage, 7.2 V maximum breakdown voltage, 40 pF typical capacitance at 0 V, 1.0 µA leakage at VRWM, and clamps to ≤12 V at 5 A (8/20 µs pulse).
For engineers reviewing the DESD6V8DLP-7B datasheet, DESD6V8DLP-7B pinout, DESD6V8DLP-7B application, or DESD6V8DLP-7B equivalent, key selection criteria include IEC 61000-4-2 Level 4 ESD robustness (±16 kV air / ±8 kV contact), low dynamic impedance (<30 Ω), and DFN1006-3 package compatibility with high-density PCB layouts.
Technical Context
This dual TVS array integrates two independent unidirectional ESD protection elements in a single X1-DFN1006-3 package, each with cathode-anode polarity defined by the bar marking. It operates as a clamping device during fast transients, leveraging silicon avalanche breakdown to limit voltage across protected lines while maintaining signal integrity via sub-40 pF capacitance.
The device meets MIL-STD-883C HBM ESD rating of 16 kV and supports automotive-grade reliability when qualified per AEC-Q101 - though this specific variant is not AEC-Q101 certified and carries the "NOT RECOMMENDED FOR NEW DESIGN" notice in its datasheet.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Standoff Voltage | 5.25 V - Maximum continuous working voltage before conduction begins; sets upper limit for safe operation on 5 V data lines. |
| Breakdown Voltage | 6.4–7.2 V - Confirmed avalanche onset range at 5 mA test current; ensures reliable triggering before IC damage thresholds. |
| Clamping Voltage | ≤12 V @ 5 A (8/20 µs) - Peak voltage seen by protected circuit during worst-case ESD event; critical for safeguarding 3.3 V/5 V interface ICs. |
| Total Capacitance | 40 pF @ 0 V, 1 MHz - Measured differential capacitance between I/O pins; low enough to avoid signal degradation in USB 2.0 (480 Mbps) paths. |
| Leakage Current | <1.0 µA @ 5.25 V - Minimal DC loading on source drivers; preserves battery life and signal bias stability in portable systems. |
| Peak Pulse Power | 70 W @ 8/20 µs - Energy-handling capability per channel under standardized surge waveform; validates compliance with IEC 61000-4-2 Level 4. |
Pinout & Package
Package: X1-DFN1006-3 - 1.0 × 0.6 mm, 0.5 mm height, 3-terminal leadless plastic package with NiPdAu-plated copper leadframe, moisture sensitivity level 1, and UL 94V-0 flammability rating.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Anode 1) | Anode of Channel 1 | Connected to protected signal line (e.g., USB D+); requires external cathode tie to VBUS or ground depending on topology. |
| Pin 2 (Cathode) | Shared Cathode | Common cathode node for both channels; routed to system ground or VCC rail to define clamping reference point. |
| Pin 3 (Anode 2) | Anode of Channel 2 | Connected to second protected signal line (e.g., USB D−); enables dual-line protection without discrete devices. |
Key Features
| Feature | Design Value |
|---|---|
| Dual unidirectional ESD protection | Two independent 5.25 V standoff channels in one DFN package - reduces board area vs. discrete diodes and eliminates routing skew between differential pairs. |
| IEC 61000-4-2 Level 4 compliance | Withstands ±16 kV air discharge and ±8 kV contact discharge - satisfies end-equipment ESD immunity requirements for consumer and industrial USB/HDMI ports. |
| Low dynamic impedance | <30 Ω at IT = 5 mA - minimizes voltage overshoot during fast transients, improving clamping precision over higher-Z alternatives. |
| Halogen- and antimony-free "Green" construction | Br < 900 ppm, Cl < 900 ppm (total Br+Cl < 1500 ppm), Sb < 1000 ppm - meets global environmental regulations including RoHS 3 and JEDEC J-STD-609. |
Applications
| USB 2.0 Interface Protection | HDMI Data Line Protection |
|---|---|
Use Scenario: Protecting D+ and D− lines of USB 2.0 host/device connectors against electrostatic discharge during hot-plug events. IC Role / Device Role / Timing Role: Unidirectional clamping TVS array placed directly at connector, referenced to system ground. Use Value: 40 pF capacitance avoids signal rise-time degradation at 480 Mbps; clamping ≤12 V prevents damage to USB transceivers rated for 5.5 V absolute max. | Use Scenario: Safeguarding TMDS clock and data channels in HDMI 1.4 receivers against ESD coupling through cable shield or connector housing. IC Role / Device Role / Timing Role: Dual-channel TVS mounted adjacent to HDMI receptacle, with shared cathode tied to chassis ground. Use Value: Low leakage (<1 µA) eliminates DC loading on 3.3 V TMDS terminations; 70 W peak power rating handles multiple ESD strikes without parametric shift. |
| Smartphone Audio Jack ESD Guard | Automotive Infotainment USB Port |
Use Scenario: ESD protection for stereo headset microphone and ground return paths in mobile phone 3.5 mm jack circuits. IC Role / Device Role / Timing Role: Dual TVS array with anodes connected to MIC and GND lines, cathode grounded - suppresses common-mode and differential ESD pulses. Use Value: Sub-1 µA leakage preserves battery runtime in always-on audio detection circuits; DFN1006-3 footprint fits tight space behind jack PCB cutout. | Use Scenario: Front-panel USB charging/data port in vehicle infotainment head units exposed to dry-climate ESD events. IC Role / Device Role / Timing Role: Dual-channel TVS deployed at USB Type-A receptacle, cathode tied to isolated digital ground plane. Use Value: 16 kV air/8 kV contact ESD rating exceeds ISO 10605 requirements for automotive interiors; RoHS 3 and halogen-free status supports OEM material declarations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel unidirectional TVS applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMA6J5.0A-Q | Single-channel, SMA package (4.5 × 2.7 mm), 5.0 V standoff, 100 pF capacitance | Requires two devices for dual-line protection; higher capacitance limits use to low-speed lines only | Select only if board space allows larger footprint and speed requirements are ≤12 Mbps |
| SP1006-01UTG | Single-line, SOD-523 package, 5.5 V standoff, 0.6 pF capacitance, 30 W Ppk | Ultra-low capacitance ideal for USB 3.0/PCIe, but no dual-channel integration | Choose when protecting ultra-high-speed serial links where 40 pF is unacceptable, accepting higher BOM count |
Compared with SMA6J5.0A-Q and SP1006-01UTG, DESD6V8DLP-7B uniquely balances dual-channel integration, 40 pF capacitance, and IEC Level 4 ESD rating in a 1.0 × 0.6 mm footprint - making it optimal for space-constrained USB 2.0 and HDMI 1.4 designs where moderate speed and compact layout are prioritized.
Availability
DESD6V8DLP-7B is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI 1.4 data line safeguarding, and smartphone audio jack ESD guard applications requiring stable component supply and consistent DFN1006-3 packaging.
Supply support for DESD6V8DLP-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.
The DESD6V8DLP-7B belongs to Diodes' TVS Diode Arrays product line, engineered specifically for high-density, high-reliability ESD protection of high-speed digital interfaces in consumer, computing, and automotive electronics.
FAQ
Is DESD6V8DLP-7B AEC-Q101 qualified?
No. Although Diodes offers AEC-Q101-qualified variants in the same product family (e.g., DESD6V8DLPQ-7B), the DESD6V8DLP-7B part number is explicitly marked "NOT RECOMMENDED FOR NEW DESIGN" in its datasheet and lacks AEC-Q101 certification. It is intended for commercial and industrial applications only.
What is the correct PCB pad layout for X1-DFN1006-3?
The recommended footprint uses a 0.40 mm wide × 1.10 mm long solder pad (X1), 0.25 mm wide × 0.70 mm long thermal pad (Y1), and 0.30 mm gap (G1) between pads. Diodes specifies a 0.70 mm center-to-center spacing (C) and prohibits solder mask defined pads due to thermal relief requirements.
Can DESD6V8DLP-7B protect bidirectional data lines like I²C?
No. Its internal schematic shows two unidirectional elements sharing a cathode - suitable only for lines referenced to ground or VCC. For bidirectional buses such as I²C, a bidirectional TVS like D3V3Z5U-7 or SP3052-01UTG is required to clamp both positive and negative transients symmetrically.
Why does the datasheet list "NOT RECOMMENDED FOR NEW DESIGN"?
This notice indicates Diodes has superseded DESD6V8DLP-7B with enhanced variants (e.g., lower capacitance, AEC-Q101 qualification, or improved thermal performance). While fully functional and in active production, new designs should evaluate successors like DESD6V8DLPQ-7B to ensure long-term supply and specification alignment.
DESD6V8DLP-7B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 3-UFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.25V
- Voltage - Breakdown (Min):
- 6.4V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- 70W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X1-DFN1006-3
DESD6V8DLP-7B FAQ
1.How can I place an order for DESD6V8DLP-7B through Aetrix?
Please submit a Request for Quotation (RFQ) for DESD6V8DLP-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DESD6V8DLP-7B reliable?
The price and inventory of DESD6V8DLP-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DESD6V8DLP-7B is usually 5 days.
3.What payment methods are accepted for DESD6V8DLP-7B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DESD6V8DLP-7B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DESD6V8DLP-7B?
DESD6V8DLP-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DESD6V8DLP-7B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DESD6V8DLP-7B?
For technical support, including DESD6V8DLP-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DESD6V8DLP-7B requirements.
6.How does Aetrix verify that DESD6V8DLP-7B is sourced from the original manufacturer or authorized distributors?
All DESD6V8DLP-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DESD6V8DLP-7B meets industry standards.
7.What is the process for return or replacement of DESD6V8DLP-7B?
All DESD6V8DLP-7B units undergo pre-shipment inspection (PSI). If there is an issue with DESD6V8DLP-7B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DESD6V8DLP-7B part is unused and in its original packaging.
Return procedure for DESD6V8DLP-7B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DESD6V8DLP-7B Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

