Diodes Incorporated DFLR1400-7

Overview

DFLR1400-7 from Diodes Incorporated is a 400 V, 1.0 A glass passivated surface-mount rectifier in the PowerDI®123 package, featuring 1.1 V max forward voltage at 1.0 A and 3 µA max reverse leakage at 25°C. It delivers high surge capability (25 A IFSM) and low-profile packaging (<1.1 mm height), making it suitable for space-constrained AC-DC adapters and DC-DC converter output rectification.

For engineers reviewing the DFLR1400-7 datasheet, DFLR1400-7 pinout, DFLR1400-7 application, or DFLR1400-7 equivalent, key selection criteria include peak repetitive reverse voltage (400 V), thermal resistance junction-to-solder point (6 °C/W), compact PowerDI®123 footprint, RoHS-compliant lead-free finish, and suitability for freewheeling and inverter snubber circuits.

Technical Context

This device is a single-phase, silicon planar epitaxial PN-junction rectifier with glass passivation for enhanced reliability under humid or high-bias stress conditions. Its construction enables stable operation across -65°C to +150°C ambient range and supports automated SMT assembly without solderability degradation.

The PowerDI®123 package uses an interlocking clip design (US Patent #7,095,113) to improve mechanical robustness and surge current handling. Thermal performance is optimized via direct die-to-cathode tab conduction path, yielding R_θJS = 6 °C/W when mounted on a 1-in² FR-4 board with 2 oz copper.

Key Specifications

Pinout & Package

Package: PowerDI®123 - surface-mount, low-profile (height <1.1 mm), molded green plastic case with UL 94V-0 rating and matte tin-plated copper leadframe. Cathode identified by band marking.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar general-purpose rectifier applications.

Compared with SB140-TB and ES1J-13-F, DFLR1400-7 uniquely balances 400 V blocking, 1.1 V forward drop, and 25 A surge capability in a low-profile SMT package-making it optimal for cost-sensitive, medium-voltage AC-DC and motor control rectification where Schottky voltage limits or fast-recovery losses are unacceptable.

Availability

DFLR1400-7 is available at Aetrix Electronics and suitable for AC-DC adapters, DC-DC converter output stages, and freewheeling diode applications requiring stable component supply, consistent parametric performance, and full traceability across production batches.

Supply support for DFLR1400-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for industrial, computing, and consumer markets.

The DFLR series belongs to Diodes' general-purpose rectifier product line, engineered for cost-effective, high-yield SMT deployment in mainstream power conversion systems where robustness, thermal predictability, and regulatory compliance are mandatory.

FAQ

What is the maximum junction temperature for continuous operation?

The DFLR1400-7 has an operating junction temperature range of -65°C to +150°C. For reliable long-term operation, junction temperature must remain below 150°C under worst-case ambient and power dissipation conditions. Derating curves in Figure 4 show usable I_O drops to ~0.6 A at 100°C ambient, assuming standard PCB mounting per AP02001.

Is DFLR1400-7 suitable for use in automotive applications?

DFLR1400-7 is qualified for commercial temperature range (-65°C to +150°C) and meets AEC-Q200 stress test requirements for passive components, but it is not AEC-Q101 qualified as a discrete semiconductor. It may be used in non-safety-critical automotive subsystems (e.g., infotainment power rails) with proper thermal and voltage margining, but not in ADAS or powertrain systems.

How does the PowerDI®123 package compare thermally to SMA (DO-214AC)?

PowerDI®123 offers R_θJS = 6 °C/W versus ~15–20 °C/W for SMA under identical PCB conditions. This 2–3× better thermal path results from direct cathode-tab solder connection and optimized internal clip geometry, enabling higher sustained current or smaller heatsinking in space-constrained designs.

Can DFLR1400-7 replace DFLR1200-7 or DFLR1600-7 in existing designs?

Yes-pin-compatible and identical in package, thermal, and mounting characteristics. Substitution requires verifying that 400 V V_RRM meets system overvoltage requirements: DFLR1200-7 (200 V) is insufficient for 400 V designs, while DFLR1600-7 (600 V) adds unnecessary cost and slightly higher V_F due to wider depletion region.