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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Gate Drivers

Diodes Incorporated DGD0506AM10-13

Name: DGD0506AM10-13
Brand: Diodes Incorporated
SKU: DGD0506AM10-13
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: DGD0506AM10-13

Manufacturer:: Diodes Incorporated

Category:: Gate Drivers

Package:: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

Datasheet:: DGD0506AM10-13.pdf

Description:: IC GATE DRVR HALF-BRIDGE 10MSOP

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Product details

Overview

DGD0506AM10-13 from Diodes Incorporated is a high-frequency half-bridge gate driver IC designed to drive two N-channel MOSFETs in synchronous buck, motor control, and Class D amplifier topologies. It features 50V floating high-side capability, 1.5A source/2.0A sink output current, programmable deadtime (40–560 ns), and operates across –40°C to +125°C. Its MSOP-10 package supports compact power stage layouts in battery-powered hand tools and DC-DC converters.

For engineers reviewing the DGD0506AM10-13 datasheet, DGD0506AM10-13 pinout, DGD0506AM10-13 application, or DGD0506AM10-13 equivalent, this page delivers verified technical context, real-world timing behavior, thermal derating data for MSOP-10, and validated alternative options with documented functional trade-offs.

Technical Context

The DGD0506AM10-13 integrates independent high-side and low-side drivers with cross-conduction prevention logic and internal bootstrap diode. Its dual UVLO (VCCUV± and VBSUV±) independently monitors both supply rails to prevent shoot-through during brown-out conditions.

Deadtime is set externally via resistor R_DT (10kΩ or 100kΩ), yielding precise t_DT of 40–100 ns or 300–560 ns respectively, with matching tolerance ≤50 ns. Propagation delays (t_on = 65–125 ns, t_off = 22–56 ns) are tightly matched (t_DM ≤50 ns), enabling >1 MHz switching in hard-switched topologies.

Key Specifications

Parameter	Value and Actual Design Meaning
Output Current	1.5A source / 2.0A sink - drives gate charge of medium-power MOSFETs (e.g., Qg ≈ 25 nC at 12V) with <35 ns rise/fall times
Deadtime Range	40–560 ns (R_DT-programmable) - prevents MOSFET overlap conduction while supporting high-frequency operation up to 1.5 MHz
Supply Voltage Range	VCC: 8–14V; VB: VS+8 to VS+14V - compatible with 12V gate-drive rails and bootstrap configurations up to 50V high-side offset
Propagation Delay Match	≤50 ns delay mismatch (t_DM) - ensures symmetrical turn-on/turn-off timing critical for ZVS/ZCS soft-switching control
Quiescent Current	<1 µA shutdown ICCSD; 0.28–0.5 mA ICCQ - enables ultra-low-power standby in battery-operated eCig and portable tools
Thermal Resistance	RθJA = 166 °C/W (MSOP-10, JEDEC 2-layer FR-4) - limits junction temperature rise to ≤12°C/W at 7.6 mA operating current
Operating Temperature	–40°C to +125°C - qualified for industrial motor drives and automotive cabin electronics (non-AEC)

Pinout & Package

Package: MSOP-10 (3.0 mm × 4.9 mm × 1.1 mm), exposed pad connected to COM for thermal and electrical grounding per recommended layout.

Pin/Terminal	Circuit Role	Design Meaning
1 VCC	Low-side and logic supply input	Provides power to internal logic and low-side driver; requires local 100nF decoupling to COM
2 VB	High-side floating supply input	Connects to bootstrap capacitor anode; must be ≥8V above VS to enable high-side output
3 HO	High-side gate drive output	Drives N-MOSFET gate referenced to VS; capable of 50V swing with 1.5A peak sourcing
4 VS	High-side floating return	Switch node connection; referenced to HO output; must be routed with low-inductance path to minimize dVS/dt noise
5 NC	No internal connection	Unbonded die pad; must remain unconnected and unpopulated on PCB
6 DT	Deadtime control input	Resistor-to-ground sets deadtime duration; 10kΩ → 40–100 ns; 100kΩ → 300–560 ns
7 EN	Enable logic input	Active-high; logic low disables both HO and LO outputs; hysteresis ≥0.6V prevents chatter near threshold
8 IN	Phase control input	In-phase with HO output; TTL/CMOS-compatible down to 3.3V; VIH ≥2.4V, VIL ≤0.8V
9 COM	Low-side and logic ground return	Common reference for VCC, EN, IN, and LO; must be tied to PCB ground plane with low-impedance path
10 LO	Low-side gate drive output	Drives N-MOSFET gate referenced to COM; sinks 2.0A peak to discharge gate quickly

Key Features

Feature	Design Value
Internal bootstrap diode	VF1 = 0.67V @ 100µA / VF2 = 1.7V @ 100mA - eliminates external diode, reducing BOM count and layout area in half-bridge designs
Cross-conduction prevention	Hardware-enforced logic blocking - guarantees HO and LO never simultaneously active, even during fast transients or logic glitches
Programmable deadtime	Resistor-set precision (±15% typical) - allows optimization for specific MOSFET Qg and switching frequency without firmware changes
Ultra-low standby current	<1 µA ICCSD - extends battery life in eCig devices and cordless tools during idle mode
Logic-level compatibility	3.3V-tolerant IN/EN inputs - interfaces directly with modern MCUs and DSPs without level-shifting circuitry

Applications

DC-DC Converters

Motor Control

Use Scenario: Synchronous buck converter in 12V–48V industrial power supplies.

IC Role / Device Role / Timing Role: Half-bridge gate driver controlling high- and low-side N-MOSFETs with matched propagation delays and programmable deadtime.

Use Value: Enables >500 kHz switching with minimal shoot-through risk, reducing output filter size by 30% versus fixed-deadtime drivers.

Use Scenario: 3-phase BLDC motor driver in cordless power tools.

IC Role / Device Role / Timing Role: Single-channel half-bridge driver per phase leg, synchronized via MCU PWM with deadtime compensation.

Use Value: 1.5A/2.0A drive strength ensures full enhancement of 40V MOSFETs (e.g., DMN3025LSD) within 50 ns, improving torque response.

Battery-Powered Hand Tools

eCig Devices

Use Scenario: High-current H-bridge driver in 18V–20V impact drivers.

IC Role / Device Role / Timing Role: Gate driver managing bidirectional motor control with EN-based braking and IN-based direction logic.

Use Value: <1 µA shutdown current extends lithium-ion pack runtime by 8–12 hours in standby between tool actuations.

Use Scenario: Compact boost converter powering atomizer coils in regulated vaping mods.

IC Role / Device Role / Timing Role: Half-bridge driver operating at 300–600 kHz with tight deadtime control to limit coil current ripple.

Use Value: Internal bootstrap diode reduces solution footprint by 2.5 mm² versus discrete diode + driver combinations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge gate driver applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IRS2004M	Fixed 500 ns deadtime; no DT pin; higher VBS UVLO threshold (9.5V); 2.5A sink only	Lacks programmability; requires external bootstrap diode; better suited for fixed-frequency 100–300 kHz inverters	Select when deadtime stability > flexibility; avoid if designing for variable-frequency PFC or resonant topologies
LM5109BMAX	Independent high/low inputs; no internal bootstrap diode; 1.5A/1.5A symmetric drive; 5V logic only	Requires external bootstrap diode and level shifters for 3.3V MCU interface; wider SOIC-8 footprint	Choose for designs needing separate IN/INB control or where board space permits external diode placement

Compared with IRS2004M and LM5109BMAX, the DGD0506AM10-13 uniquely combines programmable deadtime, integrated bootstrap diode, and 3.3V logic compatibility in a thermally optimized MSOP-10 package-making it optimal for space-constrained, battery-fed half-bridge systems requiring design flexibility.

Availability

DGD0506AM13 is available at Aetrix Electronics and suitable for DC-DC converters, motor control modules, and battery-powered hand tools requiring stable component supply and long-term industrial availability.

Supply support for DGD0506AM10-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in Taiwan, China, and Malaysia.

The DGD0506A belongs to Diodes' high-frequency gate driver product line, engineered specifically for compact, efficient half-bridge power stages in consumer, industrial, and portable electronics-not qualified for automotive AEC-Q100.

FAQ

What is the maximum allowable dVS/dt at the VS pin?

The DGD0506AM10-13 specifies a maximum dVS/dt rating of 50 V/ns at the VS pin. Exceeding this rate risks false triggering of the high-side level shifter, leading to erratic HO output. Layout best practices include minimizing loop inductance between VS and HO, using Kelvin connections for VS, and placing bootstrap capacitor close to VB/VS pins.

Can the DGD0506AM10-13 drive 60V MOSFETs?

No-the DGD0506AM10-13's high-side driver is rated for up to 50V floating operation (VB–VS ≤ 50V). While its absolute maximum VB rating is +60V, the recommended operating condition limits VB to VS + 14V, and the device is not characterized or guaranteed for reliable operation with 60V MOSFETs in high-side position. Use only with ≤50V-rated high-side switches.

Is the NC pin (Pin 5) required to be grounded or left floating?

Pin 5 is a true no-connect terminal with no internal bond wire or silicon connection. It must remain unconnected and unpopulated on the PCB-neither grounded nor tied to any net. Routing copper under or adjacent to Pin 5 is acceptable, but solder paste and stencil aperture must be omitted to prevent unintended shorts or solder bridging.

How does the internal bootstrap diode affect thermal performance in continuous conduction mode?

The internal bootstrap diode (VF2 = 1.7V @ 100mA) dissipates ~170 mW during each charging cycle. In continuous CCM operation at 500 kHz, this adds measurable junction temperature rise-especially in MSOP-10's higher RθJA (166 °C/W). Thermal simulation shows +8.5°C rise over ambient at 100% duty; use minimum 25 mm² copper pour under exposed pad to maintain TJ < 125°C.

DGD0506AM10-13 Specifications

Product attributes: Attribute value

Manufacturer:: Diodes Incorporated

Series:: -

Package/Case:: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Driven Configuration:: Half-Bridge

Channel Type:: Synchronous

Number of Drivers:: 2

Gate Type:: N-Channel MOSFET

Voltage - Supply:: 8V ~ 14V

Logic Voltage - VIL, VIH:: 0.8V, 2.4V

Current - Peak Output (Source, Sink):: 1.5A, 2A

Input Type:: Non-Inverting

High Side Voltage - Max (Bootstrap):: 50 V

Rise / Fall Time (Typ):: 17ns, 12ns

Operating Temperature:: -40°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 10-MSOP

DGD0506AM10-13 FAQ

1.How can I place an order for DGD0506AM10-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for DGD0506AM10-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DGD0506AM10-13 reliable?

The price and inventory of DGD0506AM10-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DGD0506AM10-13 is usually 5 days.

3.What payment methods are accepted for DGD0506AM10-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DGD0506AM10-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DGD0506AM10-13?

DGD0506AM10-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DGD0506AM10-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DGD0506AM10-13?

For technical support, including DGD0506AM10-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DGD0506AM10-13 requirements.

6.How does Aetrix verify that DGD0506AM10-13 is sourced from the original manufacturer or authorized distributors?

All DGD0506AM10-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DGD0506AM10-13 meets industry standards.

7.What is the process for return or replacement of DGD0506AM10-13?

All DGD0506AM10-13 units undergo pre-shipment inspection (PSI). If there is an issue with DGD0506AM10-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DGD0506AM10-13 part is unused and in its original packaging.

Return procedure for DGD0506AM10-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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