Diodes Incorporated DGD2101S8-13
- Part No.:
- DGD2101S8-13
- Manufacturer:
- Diodes Incorporated
- Category:
- Gate Drivers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
DGD2101S8-13.pdf
- Description:
- IC GATE DRVR HALF-BRIDGE 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:1,892
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DGD2101S8-13 from Diodes Incorporated is a high-voltage, high-speed dual-channel gate driver IC for N-channel MOSFETs and IGBTs in half-bridge configurations. It supports 600V high-side bootstrap operation, delivers ≤50ns propagation delay matching between channels, and operates with 10V–20V VCC and TTL/CMOS-compatible logic inputs down to 3.3V. It is used in DC-DC converters, motor controls, and Class D amplifiers requiring precise timing and robust isolation.
For engineers reviewing the DGD2101S8-13 datasheet, DGD2101S8-13 pinout, DGD2101S8-13 application, or DGD2101S8-13 equivalent, key selection criteria include high-side floating voltage capability (600V), propagation delay matching (≤50ns), SO-8 thermal resistance (RθJA = 200°C/W), undervoltage lockout thresholds (VCCUV+ = 8.0–9.8V), and negative transient tolerance on outputs.
Technical Context
The DGD2101S8-13 integrates independent high-side and low-side drivers with isolated floating supply paths: VB/VS define the high-side domain, while VCC/COM ground the logic and low-side output. Its Schmitt-triggered HIN/LIN inputs provide noise immunity, and internal UVLO prevents operation below safe VCC levels.
It uses charge-pump-assisted bootstrap operation for high-side drive, enabling continuous switching at VS up to 600V relative to COM. The matched propagation delays (tON/tOFF ≤220ns, tDM ≤50ns) and fast edge rates (tR ≤170ns, tF ≤90ns) support >100kHz PWM frequencies in hard-switching topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| High-side max voltage | 600V VB–VS offset - enables direct use in 400V DC bus inverters without external level shifters |
| Propagation delay match | ≤50ns - minimizes shoot-through risk in synchronous half-bridge switching |
| VCC operating range | 10V–20V - supports industrial 12V/15V supply rails with margin for ripple |
| Logic input compatibility | TTL/CMOS down to 3.3V - interfaces directly with microcontrollers and FPGA I/O without level translation |
| UVLO threshold (rising) | 8.0–9.8V - prevents erratic gate drive during brown-out conditions in power supply startup |
| Output short-circuit current | HO: +130/+290mA (pulse); LO: −270/−600mA (pulse) - ensures rapid MOSFET turn-on/turn-off under capacitive load |
| Operating temperature | −40°C to +125°C - qualified for under-hood automotive and industrial ambient environments |
Pinout & Package
Package: SO-8 (Type TH), surface-mount, lead-free, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 VCC | Low-side and logic supply input | Fixed 10V–20V rail powering internal logic, level shifters, and LO driver stage |
| 2 HIN | High-side logic input | In-phase CMOS/TTL signal controlling HO output; Schmitt-triggered for noise rejection |
| 3 LIN | Low-side logic input | In-phase CMOS/TTL signal controlling LO output; internally pulled down when floating |
| 4 COM | Low-side return reference | Common ground for VCC, LIN, and LO - must be connected to system power ground |
| 5 LO | Low-side gate drive output | Source-follower compatible output driving N-MOSFET gate to COM potential |
| 6 VS | High-side floating supply return | Reference node for high-side driver; tracks source of high-side MOSFET in bootstrap configuration |
| 7 HO | High-side gate drive output | Drives gate of high-side N-MOSFET referenced to VS; tolerant to negative transients |
| 8 VB | High-side floating supply input | Bootstrap capacitor connection point; supplies high-side driver domain up to 600V above VS |
Key Features
| Feature | Design Value |
|---|---|
| Floating high-side driver | Operates with VB–VS up to 600V using external bootstrap capacitor - eliminates need for isolated DC/DC supply |
| Negative transient tolerance | Outputs withstand −5V undershoot on VS and COM - improves reliability in noisy motor-drive environments |
| Matched propagation delay | ≤50ns difference between HO and LO paths - reduces dead-time uncertainty and enables tighter PWM control |
| Integrated UVLO | Hysteresis of ~0.8V between rising/falling thresholds - prevents oscillation during marginal VCC conditions |
| Schmitt-triggered inputs | Hysteresis ≥1.7V (VIH=2.5V, VIL=0.8V) - rejects EMI-induced glitches on HIN/LIN lines |
Applications
| DC-DC Converters | Motor Controls |
|---|---|
Use Scenario: Isolated buck-boost and full-bridge DC-DC converters for telecom and server power supplies. IC Role / Device Role: Dual gate driver enabling synchronous rectification and high-frequency switching of primary-side N-MOSFETs. Use Value: 600V high-side rating supports 400V input rails; matched delays reduce conduction loss and improve efficiency above 100kHz. |
Use Scenario: Brushless DC (BLDC) and permanent magnet synchronous motor (PMSM) drives in HVAC and industrial automation. IC Role / Device Role: Half-bridge driver controlling upper/lower N-MOSFETs in inverter leg with bootstrap high-side biasing. Use Value: Negative transient tolerance on VS/COM protects against inductive kickback; 125°C operation sustains performance in enclosed motor enclosures. |
| AC-DC Power Supplies | Class D Power Amplifiers |
Use Scenario: Active clamp flyback and LLC resonant converters in high-efficiency AC-DC adapters and LED drivers. IC Role / Device Role: Gate driver for high-side switch in active clamp circuit and low-side synchronous rectifier. Use Value: Fast rise/fall times (tR ≤170ns, tF ≤90ns) minimize switching losses; SO-8 package allows compact layout near power stage. |
Use Scenario: High-fidelity audio amplifiers requiring low-distortion, high-slew-rate output stages. IC Role / Device Role: Half-bridge driver for complementary N-MOSFET output pair in bridge-tied load (BTL) topology. Use Value: Tight propagation matching (≤50ns) preserves PWM fidelity; CMOS/TTL compatibility simplifies interface with DSP-based modulators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side/low-side gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRS21844SPbF | Higher peak output current (600mA/2A), integrated bootstrap diode, but only 600V max VB–VS and no negative transient tolerance on VS | Preferred in high-current motor drives where diode integration reduces BOM count; less suited for noisy inductive loads | Select when higher drive strength is required and board space permits larger SOIC-14 footprint |
| UCC27211D | 120V max high-side offset, faster propagation (30ns typ), but requires external level shifter for >120V operation | Better for low-voltage, high-frequency SMPS (<100V bus); not viable for 400V DC bus without added components | Choose for cost-sensitive, low-voltage designs where speed outweighs voltage capability |
Compared with IRS21844SPbF and UCC27211D, the DGD2101S8-13 uniquely balances 600V high-side capability, SO-8 compactness, and negative transient resilience - making it optimal for space-constrained, medium-voltage industrial inverters where reliability under electrical stress is critical.
Availability
DGD2101S8-13 is available at Aetrix Electronics and suitable for DC-DC converters, motor controls, and Class D power amplifiers requiring stable component supply across extended temperature ranges and high-voltage operation.
Supply support for DGD2101S8-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for industrial, computing, and consumer markets.
The DGD2101S8-13 belongs to Diodes' high-voltage gate driver product line, engineered specifically for robust half-bridge control in power conversion systems operating up to 600V with minimal external components.
FAQ
What is the maximum allowable dVS/dt for the DGD2101S8-13?
The DGD2101S8-13 specifies a maximum dVS/dt rating of 50 V/ns. This limit ensures reliable operation of the internal level-shifting circuitry during fast high-side switching transitions. Exceeding this rate may cause false triggering or latch-up. Layout practices - including minimized loop area between VS, HO, and bootstrap capacitor - are critical to maintain compliance in real-world PCB implementations.
Can the DGD2101S8-13 drive IGBTs directly?
Yes - the DGD2101S8-13 is explicitly rated to drive both N-channel MOSFETs and IGBTs. Its high pulse output currents (HO: +290mA, LO: −600mA) and 600V high-side capability meet typical IGBT gate drive requirements. However, gate resistor selection must account for IGBT gate charge and desired switching speed to avoid excessive power dissipation in the driver outputs.
Is an external bootstrap diode required?
Yes - the DGD2101S8-13 does not integrate a bootstrap diode. An external ultrafast or Schottky diode (e.g., 1N4148W or BAS21) must be placed between VB and the bootstrap capacitor's positive terminal to recharge the capacitor during low-side conduction. Diode reverse recovery time and forward voltage directly impact high-side drive stability at high duty cycles.
Does the DGD2101S8-13 support independent enable/disable control for each channel?
No - the DGD2101S8-13 has no dedicated enable pins. Channel control is solely via HIN and LIN logic inputs. Both outputs are active when their respective inputs are asserted; cross-conduction is prevented by external dead-time insertion in the controller. The device lacks internal interlock or shutdown logic - system-level timing control remains the responsibility of the upstream PWM generator.
DGD2101S8-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Driven Configuration:
- Half-Bridge
- Channel Type:
- Independent
- Number of Drivers:
- 2
- Gate Type:
- IGBT, N-Channel MOSFET
- Voltage - Supply:
- 10V ~ 20V
- Logic Voltage - VIL, VIH:
- 0.8V, 2.5V
- Current - Peak Output (Source, Sink):
- 290mA, 600mA
- Input Type:
- Non-Inverting
- High Side Voltage - Max (Bootstrap):
- 600 V
- Rise / Fall Time (Typ):
- 70ns, 35ns
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
DGD2101S8-13 FAQ
1.How can I place an order for DGD2101S8-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DGD2101S8-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DGD2101S8-13 reliable?
The price and inventory of DGD2101S8-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DGD2101S8-13 is usually 5 days.
3.What payment methods are accepted for DGD2101S8-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DGD2101S8-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DGD2101S8-13?
DGD2101S8-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DGD2101S8-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DGD2101S8-13?
For technical support, including DGD2101S8-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DGD2101S8-13 requirements.
6.How does Aetrix verify that DGD2101S8-13 is sourced from the original manufacturer or authorized distributors?
All DGD2101S8-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DGD2101S8-13 meets industry standards.
7.What is the process for return or replacement of DGD2101S8-13?
All DGD2101S8-13 units undergo pre-shipment inspection (PSI). If there is an issue with DGD2101S8-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DGD2101S8-13 part is unused and in its original packaging.
Return procedure for DGD2101S8-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DGD2101S8-13 Tags

-
ZXGD3009E6TA
Diodes Incorporated

-
1EDN7512BXTSA1
Infineon Technologies
-
UCC27517DBVR
Texas Instruments

-
MCP1416T-E/OT
Microchip Technology

-
MCP1402T-E/OT
Microchip Technology

-
MCP1415T-E/OT
Microchip Technology

-
MCP1401T-E/OT
Microchip Technology

-
IX4428NTR
Littelfuse Inc.

-
IRS2005STRPBF
Infineon Technologies

-
IRS2008STRPBF
Infineon Technologies

-
IX4310TTR
Littelfuse Inc.

-
2EDN7524RXTMA1
Infineon Technologies
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

