Diodes Incorporated DGD21064MS14-13

Overview

DGD21064MS14-13 from Diodes Incorporated is a high-voltage, high-speed dual-channel gate driver IC for half-bridge N-channel MOSFET/IGBT configurations. It features 600V high-side floating operation in bootstrap mode, TTL/CMOS-compatible 3.3V logic inputs (HIN/LIN), and independent undervoltage lockout on both high- and low-side supplies. It operates across –40°C to +125°C and drives power stages in DC-DC converters and motor controls.

For engineers reviewing the DGD21064MS14-13 datasheet, DGD21064MS14-13 pinout, DGD21064MS14-13 application, or DGD21064MS14-13 equivalent, key selection criteria include bootstrap high-side voltage rating (600V), propagation delay matching (≤30 ns), output drive strength (290 mA sink / 600 mA source pulsed), logic-level compatibility down to 3.3V, and SO-14 thermal resistance (120 °C/W).

Technical Context

The DGD21064MS14-13 integrates independent high-side and low-side drivers with isolated floating supply (VB/VS) and fixed logic supply (VCC/VSS). Its Schmitt-triggered HIN/LIN inputs provide noise immunity, while internal pull-downs ensure defined states during initialization. The architecture supports dead-time insertion via external control logic.

Undervoltage lockout thresholds are asymmetric (VCCUV+ = 8.0–9.8 V; VBSUV+ = 8.0–9.8 V) with 0.7 V hysteresis, preventing erratic switching during supply ramp-up. Output stage design minimizes cross-conduction via fast turn-on (220 ns typ) and turn-off (200 ns typ) delays with matched timing (≤30 ns skew).

Key Specifications

Pinout & Package

Package: SO-14 (Type TH), surface-mount, lead-free, RoHS-compliant, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side/low-side gate driver applications.

Compared with IR2104S and UCC27211D, the DGD21064MS14-13 uniquely combines 600 V high-side capability, independent VSS/COM references, and 3.3 V logic compatibility - reducing BOM count and layout complexity in industrial half-bridge designs.

Availability

DGD21064MS14-13 is available at Aetrix Electronics and suitable for DC-DC converters, motor controls, and AC-DC power supplies requiring stable component supply, extended temperature operation, and high-voltage gate drive reliability.

Supply support for DGD21064MS14-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in power management, signal integrity, and protection solutions for industrial, computing, and consumer markets.

The DGD21064M belongs to Diodes' high-voltage gate driver product line, engineered specifically for robust half-bridge control in high-efficiency power conversion systems operating up to 600 V.

FAQ

What is the maximum allowable dVS/dt for the DGD21064MS14-13?

The absolute maximum dVS/dt rating is 50 V/ns, as specified in the Absolute Maximum Ratings table. Exceeding this rate risks false triggering of the high-side level shifter or latch-up due to capacitive coupling through the internal isolation barrier. Layout best practices-such as minimizing VS loop area and using low-inductance bootstrap paths-are critical to maintain safe operation at high switching frequencies.

Can HIN and LIN be driven differentially to implement dead-time control?

No-HIN and LIN are independent, in-phase logic inputs referenced to VSS; they do not accept differential signals. Dead-time must be generated externally by the controller (e.g., MCU or PWM IC) before applying signals to HIN and LIN. The device does not embed dead-time generation or cross-conduction prevention logic.

Is the SO-14 (Type TH) package thermally enhanced compared to standard SO-14?

No-the SO-14 (Type TH) package uses standard plastic molding compound and has identical thermal resistance (RθJA = 120 °C/W on JEDEC 2-layer board) to conventional SO-14. Thermal performance relies on PCB copper area and via placement; no exposed pad or thermal tab is present.

Does the DGD21064MS14-13 support 3.3 V-only operation without level shifting?

Yes-both HIN and LIN accept 3.3 V logic levels directly, with VIH(min) = 2.5 V and VIL(max) = 0.6 V at VCC = 10–20 V. No external level shifter is needed when interfacing with 3.3 V microcontrollers or FPGAs, provided VCC remains within its 10–20 V operating range.